Lateral Thermoelectric Cooling by Anisotropic Composites for Hot Spot Thermal Management

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

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Modeling and Analysis of a Thermal Management System With Thermoelectric Cooling for the Application in Li-Ion Batteries

10.1115/1.0000513v ◽

2021 ◽

Author(s):

Amirhossein Mostafavi ◽

Ankur Jain

Keyword(s):

Thermal Management ◽

Management System ◽

Li Ion Batteries ◽

Thermoelectric Cooling ◽

Modeling And Analysis ◽

Thermal Management System ◽

Li Ion

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Paraffin wax microsphere embedded epoxy composites for potential thermal management in electronic devices

High Performance Polymers ◽

10.1177/0954008318792984 ◽

2018 ◽

Vol 31 (7) ◽

pp. 767-777

Author(s):

Gopal Krishna Singh Khagokpam ◽

Sudipta Halder

Keyword(s):

Thermal Management ◽

Latent Heat ◽

Phase Change Materials ◽

Epoxy Composite ◽

Hot Spot ◽

Electronic Devices ◽

Average Diameter ◽

Paraffin Wax ◽

Heat Of Fusion ◽

Epoxy Network

Miniaturization of electronic devices with more computing power has created a challenging set of aspects in thermal management. Present work is based on phase change materials microsphere and its incorporation in the epoxy network to develop a new class of potting material facilitating thermal management for miniaturized electronic devices. A facile and scalable method was implemented to synthesize paraffin wax microspheres (PMPs). It was dispersed into a room temperature curing epoxy network to fabricate the epoxy composite with high latent heat of fusion and high thermal stability. PMPs obtained have spherical morphology with an average diameter of approximately 5 µm. The PMP/epoxy composite can store 34.34 and 49.3 J g−1 of latent heat energy at 30 and 40 wt% PMP loading, respectively. Leakage test reveals that leaching declined as the size of PMP is reduced. Incorporation of PMP into the epoxy network reduces the compressive strength, but still resilient enough to protect electronic devices. This is an added advantage over the potential to mitigate the issue of hot spot in electronic devices as demonstrated by infrared thermography. The application of such composite is not limited only as electronic potting materials but also has the potential for other thermal energy storage applications.

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Perspiration Nano-Patch for Hot Spot Thermal Management

ASME 2007 InterPACK Conference, Volume 2 ◽

10.1115/ipack2007-33156 ◽

2007 ◽

Author(s):

Shankar Narayanan ◽

Andrei G. Fedorov ◽

Yogendra K. Joshi

Keyword(s):

Heat Transfer ◽

Thermal Management ◽

Hot Spot ◽

Evaporative Cooling ◽

Heat Removal ◽

Heat Fluxes ◽

Conceptual System ◽

Sweeping Gas ◽

Phase Change Heat Transfer ◽

Latent Heat Of Vaporization

A novel cooling scheme utilizing evaporative cooling for an ultra-thin, spatially confined liquid film is described for meeting the challenge of hot spot thermal management aiming at locally removing heat fluxes in excess of 200 W/cm2. This work presents the conceptual system design and results of performance calculations supporting the feasibility of the proposed cooling scheme. The phase change heat transfer is one of the most efficient means of heat transfer due to an advantage offered by the significant latent heat of vaporization of liquids. Fundamentally, evaporation could be a much more efficient method of heat removal as compared to boiling if certain conditions are met. Theoretically, we demonstrate that if a stable monolayer of liquid can be maintained on the surface and fully dry sweeping gas (e.g., air) is blown at high velocity above this liquid monolayer one can dissipate heat fluxes of the order of several hundreds of Watts per cm2. We also show that a more volatile FC-72 can outperform water in evaporative cooling using stable liquid microfilms.

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Modeling and Analysis of a Thermal Management System With Thermoelectric Cooling for the Application in Li-Ion Batteries

ASME 2020 Power Conference ◽

10.1115/power2020-16769 ◽

2020 ◽

Author(s):

Amirhossein Mostafavi ◽

Ankur Jain

Keyword(s):

Thermal Management ◽

High Energy ◽

Cold Climate ◽

Test Cell ◽

High Energy Density ◽

Li Ion Batteries ◽

Thermoelectric Cooling ◽

Temperature Range ◽

Surface Temperatures ◽

Li Ion

Abstract Lithium-ion (Li-ion) batteries have recently become the main source of power in portable devices due to advantages such as high energy density. However, Li-ion cells operate well only in a specific temperature range. Degraded preperformance is a consequence of low temperature operation, and potential fire risk originates from thermal runaway at elevated temperatures. Efficient thermal management of Li-ion cells and battery packs is essential to ensure safe and durable performance in wide temperature range. Thermoelectric coolers (TECs), which have been used widely for electronics cooling may also be appropriate for battery cooling due to size compactness, working with direct current. This paper presents experimental characterization of cooling of a prismatic test cell with TECs on two sides. Cooling effect of TEC on the cell core and surface temperatures is investigated at different TEC power rates. Results show core and surface temperatures of the test cell decrease significantly. The obtained results show that by applying the TEC, a temperature drop of 10 °C was achieved for 0.75A TEC current. The optimum TEC current can be selected based on the application. In addition, numerical simulations are carried out to compare with experimental measurements. Heating effect of mounted TECs can be easily achieved just by changing current direction. Experimental results reveal TECs can heat up a cell in cold climate shortly. In addition, thermo electric module may also offer insulating effect in cold climate. Results presented in this paper illustrate potential application of thermoelectric cooling for thermal management of Li-ion cells.

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Impact of Interface Resistance on Pulsed Thermoelectric Cooling

Journal of Heat Transfer ◽

10.1115/1.2780186 ◽

2008 ◽

Vol 130 (1) ◽

Cited By ~ 14

Author(s):

Y. Sungtaek Ju

Keyword(s):

Heat Flux ◽

Thermal Management ◽

Thermoelectric Cooling ◽

Infrared Sensors ◽

New Techniques ◽

Site Specific ◽

Cooling Performance ◽

Interface Resistance ◽

High Pulse ◽

The Impact

Pulsed thermoelectric cooling is an attractive approach for the site specific thermal management of infrared sensors and other low-heat flux devices. Intense Joule heating caused by electrical interface resistance, however, can severely degrade pulsed cooling performance. Numerical simulations are used to quantify the impact of the interface resistance on pulsed thermoelectric cooling. The degradation in performance is most pronounced for microcoolers that have small bulk resistivity at high pulse amplitudes. Our work also forms a basis for new techniques to probe interfaces in TE devices for energy harvesting as well as cooling applications.

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The study on thermal management of magnetorheological fluid retarder with thermoelectric cooling module

Case Studies in Thermal Engineering ◽

10.1016/j.csite.2021.101686 ◽

2021 ◽

Vol 28 ◽

pp. 101686

Author(s):

Philip K. Agyeman ◽

Tan Gangfeng ◽

Frimpong J. Alex ◽

Dengzhi Peng ◽

Jamshid Valiev ◽

...

Keyword(s):

Thermal Management ◽

Magnetorheological Fluid ◽

Thermoelectric Cooling ◽

Cooling Module

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Simplified Thermal Model of Silicon Thermoelectric Microcooler for On-Chip Hot Spot Remediation

ASME 2007 InterPACK Conference, Volume 2 ◽

10.1115/ipack2007-33940 ◽

2007 ◽

Cited By ~ 1

Author(s):

Peng Wang ◽

Avram Bar-Cohen

Keyword(s):

Thermal Management ◽

Material Properties ◽

Hot Spots ◽

Hot Spot ◽

Design Tool ◽

The Novel ◽

Thermo Electric ◽

Design And Optimization ◽

Conventional Cooling ◽

On Chip

Thermal management of on-chip hot spots has become an increasing challenge in recent years because such localized high flux hot spots can not be effectively removed by conventional cooling techniques. The authors have recently explored the novel use of the silicon chip itself as a solid state thermoelectric micrcooler (μTEC) for hot spot thermal management. This paper describes the development and application of a thermo-electric design tool based on closed-form equations for the primary variables. This tool can be used to effectively reduce the complexity and required time for the design and optimization of the silicon microcooler geometry and material properties for on-chip hot spot remediation.

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