scholarly journals Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

2007 ◽  
Vol 129 (3) ◽  
pp. 291-299 ◽  
Author(s):  
Robert Wadell ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov
Keyword(s):  
High Heat ◽  
Heat Fluxes ◽  
Junction Temperature ◽  
High Heat Flux ◽  
Base Line ◽  
Vapor Compression ◽  
Pin Fin ◽  
Slit Flow ◽  
Strong Motivation ◽  
Pin Fin Array

Microprocessor performance can be significantly improved by lowering the junction temperature, especially down to the deep subambient levels. This provides the strong motivation for the current study, which focuses on the design and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at −80°C. Four compact evaporator designs are examined—a base line slit-flow structure with no microfeatures, straight microchannels, an inline pin fin array, and an alternating pin fin array—all fitting the same size envelope. Pressure drop and heat transfer measurements are reported and discussed to explain the performance of the various evaporator geometries for heat fluxes ranging between 20W∕cm2 and 100W∕cm2.

Optimization of Refrigeration Systems for High-Heat-Flux Microelectronics

2008 ◽  
Author(s):  
P. E. Phelan ◽  
Y. Gupta ◽  
H. Tyagi ◽  
R. Prasher ◽  
J. Cattano ◽  
...  
Keyword(s):  
Heat Flux ◽  
Energy Consumption ◽  
System Design ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Compressor Inlet

Increasingly, military and civilian applications of electronics require extremely high heat fluxes, on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are subject to a number of constraints, including energy consumption, controllability, and the volume or size of the package. Calculations indicate that the only possible approach to meeting this heat flux condition, while maintaining the chip temperature below 50 °C, is to utilize refrigeration. Here we report an initial optimization of the refrigeration system design. Because the outlet quality of the fluid leaving the evaporator must be held to approximately less than 20%, in order to avoid reaching critical heat flux, the refrigeration system design is dramatically different from typical configurations for household applications. In short, a simple vapor-compression cycle will require excessive energy consumption, largely because of the superheat required to return the refrigerant to its vapor state before the compressor inlet. A better design is determined to be a “two-loop” cycle, in which the vapor-compression loop is coupled thermally to a primary loop that directly cools the high-heat-flux chip.

Energy Efficiency of Refrigeration Systems for High-Heat-Flux Microelectronics

2010 ◽  
Vol 2 (3) ◽  
Author(s):  
P. E. Phelan ◽  
Y. Gupta ◽  
H. Tyagi ◽  
R. S. Prasher ◽  
J. Catano ◽  
...  
Keyword(s):  
Heat Flux ◽  
Energy Consumption ◽  
System Design ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Compressor Inlet

Increasingly, military and civilian applications of electronics require extremely high-heat fluxes on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are subject to a number of constraints, including energy consumption, controllability, and the volume or size of the package. Calculations indicate that the only possible approach to meeting this heat flux condition, while maintaining the chip temperature below 65°C, is to utilize refrigeration. Here, we report an initial thermodynamic optimization of the refrigeration system design. In order to hold the outlet quality of the fluid leaving the evaporator to less than approximately 20%, in order to avoid reaching critical heat flux, the refrigeration system design is dramatically different from typical configurations for household applications. In short, a simple vapor-compression cycle will require excessive energy consumption, largely because of the additional heat required to return the refrigerant to its vapor state before the compressor inlet. A better design is determined to be a “two-loop” cycle, in which the vapor-compression loop is coupled thermally to a pumped loop that directly cools the high-heat-flux chip.

The Steady-State Modeling and Analysis of a Two-Loop Cooling System for High Heat Flux Removal

2009 ◽  
Author(s):  
Rongliang Zhou ◽  
Juan Catano ◽  
Tiejun Zhang ◽  
John T. Wen ◽  
Greg J. Michna ◽  
...  
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
System Structure ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Vapor Compression Cycle ◽  
Compression Cycle

Steady-state modeling and analysis of a two-loop cooling system for high heat flux removal applications are studied. The system structure proposed consists of a primary pumped loop and a vapor compression cycle (VCC) as the secondary loop to which the pumped loop rejects heat. The pumped loop consists of evaporator, condenser, pump, and bladder liquid accumulator. The pumped loop evaporator has direct contact with the heat generating device and CHF must be higher than the imposed heat fluxes to prevent device burnout. The bladder liquid accumulator adjusts the pumped loop pressure level and, hence, the subcooling of the refrigerant to avoid pump cavitation and to achieve high critical heat flux (CHF) in the pumped loop evaporator. The vapor compression cycle of the two-loop cooling system consists of evaporator, liquid accumulator, compressor, condenser and electronic expansion valve. It is coupled with the pumped loop through a fluid-to-fluid heat exchanger that serves as both the vapor compression cycle evaporator and the pumped loop condenser. The liquid accumulator of the vapor compression cycle regulates the cycle active refrigerant charge and provides saturated vapor to the compressor at steady state. The heat exchangers are modeled with the mass, momentum, and energy balance equations. Due to the projected incorporation of microchannels in the pumped loop to enhance the heat transfer in heat sinks, the momentum equation, rarely seen in previous refrigeration system modeling efforts, is included to capture the expected significant microchannel pressure drop witnessed in previous experimental investigations. Electronic expansion valve, compressor, pump, and liquid accumulators are modeled as static components due to their much faster dynamics compared with heat exchangers. The steady-state model can be used for static system design that includes determining the total refrigerant charge in the vapor compression cycle and the pumped loop to accommodate the varying heat load, sizing of various components, and parametric studies to optimize the operating conditions for a given heat load. The effect of pumped loop pressure level, heat exchangers geometries, pumped loop refrigerant selection, and placement of the pump (upstream or downstream of the evaporator) are studied. The two-loop cooling system structure shows both improved coefficient of performance (COP) and CHF overthe single loop vapor compression cycle investigated earlier by authors for high heat flux removal.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

scholarly journals Influence of the ambient temperature on the cooling efficiency of the high performance cooling device with thermosiphon effect

2018 ◽  
Vol 180 ◽  
pp. 02073
Author(s):  
Patrik Nemec ◽  
Milan Malcho
Keyword(s):  
Ambient Temperature ◽  
High Performance ◽  
Convection Heat Transfer ◽  
Heat Removal ◽  
Measuring Method ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Cooling Efficiency ◽  
Cooling Device

This work deal with experimental measurement and calculation cooling efficiency of the cooling device working with a heat pipe technology. The referred device in the article is cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description, working principle and construction of cooling device. The main factor affected the dissipation of high heat flux from electronic elements through the cooling device to the surrounding is condenser construction, its capacity and option of heat removal. Experimental part describe the measuring method cooling efficiency of the cooling device depending on ambient temperature in range -20 to 40°C and at heat load of electronic components 750 W. Measured results are compared with results calculation based on physical phenomena of boiling, condensation and natural convection heat transfer.

PTFE Modification to Enhance Boiling Performance of Porous Surface

2020 ◽  
Vol 142 (7) ◽  
Author(s):  
Ya-Qiao Wang ◽  
Jia-Li Luo ◽  
Yi Heng ◽  
Dong-Chuan Mo ◽  
Shu-Shen Lyu
Keyword(s):  
Boiling Heat Transfer ◽  
Heat Dissipation ◽  
Flat Surface ◽  
Hydrophobic Surface ◽  
High Heat ◽  
High Heat Flux ◽  
Pin Fin ◽  
Original Surface ◽  
Wall Superheat ◽  
Hybrid Modification

Abstract Boiling heat transfer is one of the most effective methods to meet the challenge of heat dissipation of high heat flux devices. A wetting hybrid surface has been shown to have better performance than the hydrophilic or hydrophobic surface. This kind of wetting hybrid modification is always carried out on a plain or flat surface. In this paper, polytetrafluoroethylene (PTFE) powders were coated on a superhydrophilic microcopper dendrite fin surface to build a wetting hybrid surface. The pool-boiling experimental results showed that after applying the coating, the wall superheat dramatically decreased to 8 K, which is 9 K lower than that on the original surface at 250 W·cm−2, and has a better performance than a silicon pin-fin-based wetting hybrid surface.

Fabrication and Performance of a Pin Fin Micro Heat Exchanger

2004 ◽  
Vol 126 (3) ◽  
pp. 434-444 ◽  
Author(s):  
Christophe Marques ◽  
Kevin W. Kelly
Keyword(s):  
Heat Exchanger ◽  
Gas Turbine ◽  
Heat Exchangers ◽  
Turbine Blades ◽  
High Heat ◽  
Gas Turbine Engine ◽  
High Heat Flux ◽  
Turbine Engine ◽  
Pin Fin ◽  
Micro Heat Exchanger

Nickel micro pin fin heat exchangers can be electroplated directly onto planar or non-planar metal surfaces using a derivative of the LIGA micromachining process. These heat exchangers offer the potential to more effectively control the temperature of surfaces in high heat flux applications. Of particular interest is the temperature control of gas turbine engine components. The components in the gas turbine engine that require efficient, improved cooling schemes include the gas turbine blades, the stator vanes, the turbine disk, and the combustor liner. Efficient heating of component surfaces may also be required (i.e., surfaces near the compressor inlet to prevent deicing). In all cases, correlations providing the Nusselt number and the friction factor are needed for such micro pin fin heat exchangers. Heat transfer and pressure loss experimental results are reported for a flat parallel plate pin fin micro heat exchanger with a staggered pin fin array, with height-to-diameter ratios of 1.0, with spacing-to-diameter ratios of 2.5 and for Reynolds numbers (based on the hydraulic diameter of the channel) from 4000 to 20,000. The results are compared to studies of larger scale, but geometrically similar, pin fin heat exchangers. To motivate further research, an analytic model is described which uses the empirical results from the pin fin heat exchanger experiments to predict a cooling effectiveness exceeding 0.82 in a gas turbine blade cooling application. As a final point, the feasibility of fabricating a relatively complex micro heat exchanger on a simple airfoil (a cylinder) is demonstrated.

Thermal Management of a Heat-Pipe Drill: A FEM Analysis

2003 ◽  
Author(s):  
Tien-Chien Jen ◽  
Rajendra Jadhav
Keyword(s):  
Finite Element ◽  
Heat Pipe ◽  
Thermal Management ◽  
Heat Pipes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Drilling Process ◽  
Generation Process ◽  
Finite Element Software

Thermal management using heat pipes is gaining significant attention in past decades. This is because of the fact that it can be used as an effective heat sink in very intricate and space constrained applications such as in electronics cooling or turbine blade cooling where high heat fluxes are involved. Extensive research has been done in exploring various possible applications for the use of heat pipes as well as understanding and modeling the behavior of heat pipe under those applications. One of the possible applications of heat pipe technology is in machining operations, which involves a very high heat flux being generated during the chip generation process. Present study focuses on the thermal management of using a heat pipe in a drill for a drilling process. To check the feasibility and effectiveness of the heat pipe drill, structural and thermal analyses are performed using Finite Element Analysis. Finite Element Software ANSYS was used for this purpose. It is important for any conceptual design to be made practical and hence a parametric study was carried out to determine the optimum geometry size for the heat pipe for a specific standard drill.

Integrated Vapor Chamber Heat Spreader for Power Module Applications

2017 ◽  
Author(s):  
Clayton L. Hose ◽  
Dimeji Ibitayo ◽  
Lauren M. Boteler ◽  
Jens Weyant ◽  
Bradley Richard
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Power Module ◽  
Heat Spreader

This work presents a demonstration of a coefficient of thermal expansion (CTE) matched, high heat flux vapor chamber directly integrated onto the backside of a direct bond copper (DBC) substrate to improve heat spreading and reduce thermal resistance of power electronics modules. Typical vapor chambers are designed to operate at heat fluxes > 25 W/cm2 with overall thermal resistances < 0.20 °C/W. Due to the rising demands for increased thermal performance in high power electronics modules, this vapor chamber has been designed as a passive, drop-in replacement for a standard heat spreader. In order to operate with device heat fluxes >500 W/cm2 while maintaining low thermal resistance, a planar vapor chamber is positioned onto the backside of the power substrate, which incorporates a specially designed wick directly beneath the active heat dissipating components to balance liquid return and vapor mass flow. In addition to the high heat flux capability, the vapor chamber is designed to be CTE matched to reduce thermally induced stresses. Modeling results showed effective thermal conductivities of up to 950 W/m-K, which is 5 times better than standard copper-molybdenum (CuMo) heat spreaders. Experimental results show a 43°C reduction in device temperature compared to a standard solid CuMo heat spreader at a heat flux of 520 W/cm2.

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