Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

2021 ◽  
Vol 143 (4) ◽  
Author(s):  
Tomas Moreno-Torres ◽  
Daniel Lorenzini ◽  
Yogendra Joshi ◽  
Abel Hernandez-Guerrero ◽  
J. Luis Luviano-Ortiz

Abstract This work is a numerical study of microfluidic cooling of integrated circuits (ICs), using embedded micropin-fins on a silicon chip. The study considers non-uniform chip heat fluxes (250–500 W/cm2) and variable pin fin density using DI water as coolant. A parametric analysis was performed, using the theory of design of experiments (DoE) in order to find the best performing configurations. The proposed factorial design considers six geometrical parameters resulting in 64 microfluidic cooling configurations. The pressure drop and average chip temperatures were obtained for each model to determine the importance of input parameters utilizing a statistical approach. Results from this optimization point to different suitable configurations in which the maximum device temperature is below 60 °C, under moderate pressure drops below 80 kPa. This work takes advantage of numerical models and statistical approaches to seek optimal designs of microfluidic cooling systems and to identify key parameters that have influence on their global performance. In addition, alternative configurations are also assessed for cases in which thermal or hydraulic parameters could be traded-off depending on the application. The results from this study are helpful for the design of chip thermal management with nonuniform power distribution.

2018 ◽  
Vol 32 (31) ◽  
pp. 1850344 ◽  
Author(s):  
N. Eti ◽  
Z. Çetin ◽  
H. S. Sözüer

A detailed numerical study of low-loss silicon on insulator (SOI) waveguide bend is presented using the fully three-dimensional (3D) finite-difference time-domain (FDTD) method. The geometrical parameters are optimized to minimize the bending loss over a range of frequencies. Transmission results for the conventional single bend and photonic crystal assisted SOI waveguide bend are compared. Calculations are performed for the transmission values of TE-like modes where the electric field is strongly transverse to the direction of propagation. The best obtained transmission is over 95% for TE-like modes.


2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Omar Ahmed ◽  
Chukwudi Okoro ◽  
Scott Pollard ◽  
Tengfei Jiang

PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.Design/methodology/approachNumerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.FindingsERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.Originality/valueThis study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.


2019 ◽  
Vol 30 (11) ◽  
pp. 1950083 ◽  
Author(s):  
Hossien Montaseri ◽  
Hossein Asiaei ◽  
Abdolhossein Baghlani ◽  
Pourya Omidvar

This paper deals with numerical study of flow field in a channel bend in presence of a lateral intake using three-dimensional numerical model SSIIM2. The effects of bend on the structure of the flow around the intake are investigated and compared with the experimental data. The tests are carried out in a U-shaped channel bend with a lateral intake. The intake is located at the outer bank of an 180∘ bend at position 115∘ with 45∘ diversion angle and the experimental data can be used to calibrate and validate numerical models. The results show that both the center-region and outer-bank cross-stream circulations are observed in the experiments while only the former is captured by the numerical model due to the limitations of the turbulence model. In the curved channel after the intake, both experimental and numerical results show another type of bi-cellular circulations in which clockwise center-region circulations and counterclockwise circulations near the inner bank and the free surface (inner-bank circulations) are captured. The study shows that the numerical model very satisfactorily predicts streamlines, velocity field and flow pattern in the channel and in vicinity of the intake. Investigation of flow pattern around lateral intake in channel bends shows that contrary to the case of flow diversion in straight channels, the width of the dividing stream surface near water surface level is greater than that of near bed level. Finally, the effects of position and diversion angle of the lateral intake, discharge ratio and upstream Froude number on the flow pattern are investigated.


Author(s):  
Sadek Horra ◽  
Zoubir Nemouchi ◽  
Lyes Khezzar

This work is a numerical study of a turbulent impinging jet issuing from a nozzle with chevrons. The Reynolds number based on the jet exit velocity and nozzle diameter is equal to 5000 corresponding to a low Mach number of 0.0057 at the nozzle exit. The main objectives of the investigation, inspired by the work of Violato et al. (Int. J. of Heat and Fluid Flow, 37, 2012), are to highlight, from a fundamental point of view, the effects of the nozzle shape and the nozzle-to-plate distance on the mean parameters characterizing the dynamics of the flow in question. The nozzle configurations considered are a circular nozzle without chevrons and nozzles provided with 4 and 6 chevrons. The nozzle-to-plate distance ranges from 2 to 6 nozzle diameters. All the other flow conditions and geometrical parameters used in the different cases treated are identical. Interesting features of the flow are revealed by the obtained results of averaged three-dimensional fields of velocity and turbulent kinetic energy, particularly close to the wall. An attempt is made to bring additional insight into the phenomena in the free jet, the impingement region and the wall jet when using 4, 6 and no chevrons, for different nozzle-to-plate distances.


Author(s):  
Se´amus Hickey ◽  
Jeff Punch ◽  
John Daly ◽  
Nicholas Jeffers

Photonics Integrated Circuits (PICs), a feature of contemporary optical communications technologies, can represent a stringent packaging challenge, particularly in terms of their requirements for thermal control. Devices such as laser arrays can demonstrate tight temperature limits, sub-ambient operating temperatures, moderate heat loads but high device-level heat fluxes. A key feature of many hybrid PICs is a multilayer substrate which offers mechanical support, electrical interconnection and heat spreading for the devices that it carries; such substrates are typically mounted on a thermoelectric (TE) module (TEM) to achieve thermal control. The objective of this paper is to examine the influence of heat spreader structures on the thermal behavior of PICs, with particular attention on maximizing TEM efficiency. To this end, closed-form analytical and numerical models are developed for a representative laser array PIC which captures the conductive heat transfer within the spreader, coupled with a constitutive representation of the TEM. A parametric study is conducted to illustrate the influence of the following parameters on the source temperature of the PIC for the application: effective conductivities and dimensions of the heat spreader; thermal interface resistances; and thermal resistance between the TEM and the ambient. The outcome of the paper is an enhanced understanding of the role of heat spreading in the stable and efficient operation of contemporary PICs. This paper represents the initial results of an extensive programme of work on packaging-related aspects of next-generation PICs.


Author(s):  
Jingru Zhang ◽  
Tiantian Zhang ◽  
Yogesh Jaluria

Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics and the time needed for heat removal is important. In this paper, an experimental setup and numerical model was developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks. The temperature change with time of the system for different heat fluxes at different flow was determined, from which the response time can be obtained. Three different configurations of multi-microchannel heat sinks were tested during the experiment. Numerical models were then developed to simulate the transient cooling for two of the configurations. A good agreement between the experimental data and numerical results showed that single-channel models are capable of simulating the thermal behavior of the entire heat sink by applying appropriate assumptions and boundary conditions.


Author(s):  
C. De Maesschalck ◽  
S. Lavagnoli ◽  
G. Paniagua

Tip leakage flows in unshrouded high speed turbines cause large aerodynamic penalties, induce significant thermal loads and give rise to intense thermal stresses onto the blade tip and casing endwalls. In the pursuit of superior engine reliability and efficiency, the turbine blade tip design is of paramount importance and still poses an exceptional challenge to turbine designers. The ever-increasing rotational speeds and pressure loadings tend to accelerate the tip flow velocities beyond the transonic regime. Overtip supersonic flows are characterized by complex flow patterns, which determine the heat transfer signature. Hence, the physics of the overtip flow structures and the influence of the geometrical parameters on the overtip flow require further understanding to develop innovative tip designs. Conventional blade tip shapes are not adequate for such high speed flows and hence, potential for enhanced performances lays in appropriate tip shaping. The present research aims to quantify the prospective gain offered by a fully contoured blade tip shape against conventional geometries such as a flat and squealer tip. A detailed numerical study was conducted on a modern transonic turbine rotor blade (Reynolds number is 5.5 × 105, relative exit Mach number is 0.9) by means of three-dimensional Reynolds-Averaged Navier-Stokes calculations. The novel contoured tip geometry was designed based on a 2D tip shape optimization in which only the upper 2% of the blade span was modified. This study yields a deeper insight into the application of blade tip carving in high speed turbines and provides guidelines for future tip designs with enhanced aerothermal performances.


Author(s):  
Salah Mebarki ◽  
Benaoumeur Aour ◽  
Malachanne Etienne ◽  
Franck Jourdan ◽  
Abdel Hakem Belaghit ◽  
...  

Despite the widespread use of reverse total shoulder arthroplasty, there is still a problem of conflict between the polyethylene cup of the prosthesis and the scapula, which over time causes the phenomenon of notching. In order to circumvent this problem correctly, several innovations have been proposed regard to the implementation method. In this context, the aim of this work is to study the biomechanical behavior of new implantation methods using different glenoid configurations in order to avoid the notching phenomenon between the cup and the scapula. The study was performed using virtual prototypes of the shoulder prosthesis assembly. Using CT scan images, three-dimensional models of shoulder bones were reconstructed. The implantation of the prosthesis in the three-dimensional model was performed in collaboration with an experienced surgeon from the Caduceus Clinic (Oran, Algeria). The numerical models were imported to finite element calculation software. After the validation of the numerical model using the literature results, we assessed the biomechanical behavior of four implantation methods under the same boundary conditions and abduction movements. From the obtained results, it was found that among the proposed methods, the BIO-SR lateralization method offers significant biomechanical advantages in terms of the forces applied to the glenoid during the abduction movement.


2018 ◽  
Vol 91 (1) ◽  
pp. 30-37 ◽  
Author(s):  
Yunpeng Ma ◽  
Na Guo

PurposeA numerical study on the aerodynamic noise generation of a high efficiency propeller is carried out.Design/methodology/approachThree-dimensional numerical simulation based on Reynolds averaged N-S model is performed to obtain the aerodynamic performance of the propeller. Then, the result of the aerodynamic analysis is given as input of the acoustic calculation. The sound is calculated using the Farassat 1A which was derived from Ffowcs Williams–Hawkings equation and is compared with the measurements.FindingsMoreover, the fan is modified for noise reduction by changing its geometrical parameters such as span, chord length and torsion angle.Originality/valueThe variation trend of aerodynamic and acoustic are compared and discussed for different modification tasks. Some meaningful conclusions are drawn on the noise reduction of propeller.


2014 ◽  
Vol 137 (2) ◽  
Author(s):  
C. De Maesschalck ◽  
S. Lavagnoli ◽  
G. Paniagua

Tip leakage flows in unshrouded high speed turbines cause large aerodynamic penalties, induce significant thermal loads and give rise to intense thermal stresses onto the blade tip and casing endwalls. In the pursuit of superior engine reliability and efficiency, the turbine blade tip design is of paramount importance and still poses an exceptional challenge to turbine designers. The ever-increasing rotational speeds and pressure loadings tend to accelerate the tip flow velocities beyond the transonic regime. Overtip supersonic flows are characterized by complex flow patterns, which determine the heat transfer signature. Hence, the physics of the overtip flow structures and the influence of the geometrical parameters require further understanding to develop innovative tip designs. Conventional blade tip shapes are not adequate for such high speed flows and hence, potential for enhanced performances lays in appropriate tip shaping. The present research aims to quantify the prospective gain offered by a fully contoured blade tip shape against conventional geometries such as a flat and squealer tip. A detailed numerical study was conducted on a modern rotor blade (Reynolds number of 5.5 × 105 and a relative exit Mach number of 0.9) by means of three-dimensional (3D) Reynolds-averaged Navier–Stokes (RANS) calculations. Two novel contoured tip geometries were designed based on a two-dimensional (2D) tip shape optimization in which only the upper 2% of the blade span was modified. This study yields a deeper insight into the application of blade tip carving in high speed turbines and provides guidelines for future tip designs with enhanced aerothermal performances.


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