Singulation of Electronic Packages With Abrasive Waterjets

2005 ◽  
Author(s):  
Mohamed Hashish
Keyword(s):  
Flash Memory ◽  
Cutting Speed ◽  
High Volume ◽  
Cutting Process ◽  
Electronic Packages ◽  
Digital Cameras ◽  
Storage Devices ◽  
High Cutting Speed ◽  
Machine Reliability ◽  
Abrasive Waterjets

Abrasive waterjets were used for the first time to commercially singulate electronic chips such as those used for flash memory cards found in digital cameras, cell phones, and USB storage devices. Cutting these components requires high cutting speed, high edge quality, accuracy, and precision. For example, a minimal accuracy needed is about 0.1-mm and a minimum Cpk of 1.33. A relatively small AWJ (~ 0.38 mm) was successfully used to accurately cut chips at speeds of 20 mm/s to 60 mm/s. It was determined that the use of machine vision is critical to meeting the accuracy requirements. The cutting process consisted of piercing starting holes and then cutting shaped pattern cuts to contour the chip components. Drilling holes was performed without delamination and the cutting speed was optimized to meet the intricate chip geometry. Because of the relatively high volume of components to be cut, requiring around the clock duty, process and machine reliability are of critical importance. This paper discusses the results and observation of the cutting process as well as the performance of the system.

Singulation of Electronic Packages With Abrasive Waterjets

2006 ◽  
Vol 128 (4) ◽  
pp. 479-483 ◽  
Author(s):  
Mohamed Hashish
Keyword(s):  
Flash Memory ◽  
Cutting Speed ◽  
High Volume ◽  
Cutting Process ◽  
Electronic Packages ◽  
Digital Cameras ◽  
Storage Devices ◽  
High Cutting Speed ◽  
Machine Reliability ◽  
Abrasive Waterjets

Abrasive waterjets (AWJ) were used for the first time to commercially singulate electronic chips such as those used for flash memory cards found in digital cameras, cell phones, and universal serial bus (USB) storage devices. Cutting these components requires high cutting speed, high edge quality, accuracy, and precision. For example, a minimal accuracy needed is ∼0.1mm and a minimum Cpk of 1.33. A relatively small AWJ (∼0.38mm) was successfully used to accurately cut chips at speeds of 20-60mm∕s. It was determined that the use of machine vision is critical to meeting the accuracy requirements. The cutting process consisted of piercing starting holes and then cutting shaped pattern cuts to contour the chip components. Drilling holes was performed without delamination, and the cutting speed was optimized to meet the intricate chip geometry. Because of the relatively high volume of components to be cut, requiring around-the-clock duty, process and machine reliability are of critical importance. This paper discusses the results and observation of the cutting process as well as the performance of the system.

Mechanism of Variable Helix Tools in Suppressing Chatter Using Process Damping for Machining Titanium Alloys at Low Cutting Speed

2013 ◽  
Vol 773-774 ◽  
pp. 370-376
Author(s):  
Muhammad Adib Shaharun ◽  
Ahmad Razlan Yusoff ◽  
Mohammad S. Reza
Keyword(s):  
Titanium Alloy ◽  
Cutting Speed ◽  
Milling Process ◽  
Cutting Process ◽  
Chatter Vibration ◽  
Process Damping ◽  
High Cutting Speed ◽  
Titanium Machining ◽  
Different Types ◽  
Variable Helix

Titanium is difficult-to-cut materials due to its poor machinability and thermal conductivity when machining at high cutting speed. To overcome this machining titanium alloy problem, this study in interaction between machining structural system and the cutting process are very important. One of the main problems in the cutting process is chatter vibration. Due to chatter problem, the mechanism to suppress chatter named, process damping is a useful method can be manipulated to improve the limited productivity of titanium machining at low speed machining in milling process. In the present study, experiment are conducted to evaluate and study the process damping mechanism in milling using different types of variable tools geometries. These tools are variable he-lix/uniform pitch, variable pitch/uniform helix and variable helix and pitch and uniform helix/pitch. The result showed that the variable helix and pitch tools is very significantly improve process damping performance in machining titanium alloy compare to traditional of regular tools and other irregular tools.

scholarly journals Roughing Milling with Ceramic Tools in Comparison with Sintered Carbide on Nickel-Based Alloys

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 734
Author(s):  
Pablo Fernández-Lucio ◽  
Octavio Pereira Neto ◽  
Gaizka Gómez-Escudero ◽  
Francisco Javier Amigo Fuertes ◽  
Asier Fernández Valdivielso ◽  
...  
Keyword(s):  
Cutting Speed ◽  
High Volume ◽  
Cemented Carbide ◽  
Performance Ratio ◽  
Cost Performance ◽  
Ceramic Tools ◽  
The Cost ◽  
Engine Components ◽  
Coated Carbide ◽  
Milling Tools

Productivity in the manufacture of aircrafts components, especially engine components, must increase along with more sustainable conditions. Regarding machining, a solution is proposed to increase the cutting speed, but engines are made with very difficult-to-cut alloys. In this work, a comparison between two cutting tool materials, namely (a) cemented carbide and (b) SiAlON ceramics, for milling rough operations in Inconel® 718 in aged condition was carried out. Furthermore, both the influence of coatings in cemented carbide milling tools and the cutting speed in the ceramic tools were analysed. All tools were tested until the end of their useful life. The cost performance ratio was used to compare the productivity of the tested tools. Despite the results showing higher durability of the coated carbide tool, the ceramic tools presented a better behavior in terms of productivity at higher speed. Therefore, ceramic tools should be used for higher productivity demands, while coated carbide tools for low speed-high volume material removal.

Cutting Performance and Wear Mechanism of Si3N4-Based Nanocomposite Ceramic Tool

2010 ◽  
Vol 443 ◽  
pp. 324-329 ◽  
Author(s):  
Bin Zou ◽  
Chuan Zhen Huang ◽  
Han Lian Liu ◽  
Jin Peng Song
Keyword(s):  
Wear Resistance ◽  
Wear Mechanism ◽  
Cutting Tools ◽  
Cutting Speed ◽  
Cutting Performance ◽  
Nano Particles ◽  
Ceramic Tool ◽  
Tool Materials ◽  
High Cutting Speed ◽  
The Matrix

Si3N4/TiN nanocomposite tool and Si3N4/Ti(C7N3) nanocomposite tool were prepared. The cutting performance and wear mechanism of Si3N4-based nanocomposite ceramic tool was investigated by comparison with a commercial sialon ceramic tool in machining of 45 steel. Si3N4-based nanocomposite ceramic tool exhibits the better wear resistance than sialon at the relatively high cutting speed. The increased cutting performance of Si3N4-based nanocomposite ceramic tool is ascribed to the higher mechanical properties. Nano-particles can refine the matrix grains and improve the bonding strength among the matrix grains of Si3N4-based nanocomposite ceramic tool materials. It contributes to an improved wear resistance of the cutting tools during machining.

Study of a High Performance AFM Probe-Based Microscribing Process

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Keith Bourne ◽  
Shiv G. Kapoor ◽  
Richard E. DeVor
Keyword(s):  
Tool Wear ◽  
High Performance ◽  
Cutting Speed ◽  
Rake Angle ◽  
Motion Platform ◽  
High Cutting Speed ◽  
Working Volume ◽  
Afm Probe ◽  
Tool Motion ◽  
Five Axis

In this paper, a mechanical microscribing process is described that combines AFM probe-based microscribing with a five-axis microscale machine tool motion platform in order to achieve high scribing speeds, a large working volume, and the capability of cutting curvilinear patterns of grooves. An experiment is described that demonstrates groove formation, groove shape, and tool wear when long grooves are formed using multiple tool passes. A second more systematic experiment is described in which short-distance single-pass cutting tests were used to explore the effects of cutting speed, nominal tool load, and AFM probe mounting angle on groove geometry, tool wear, effective rake angle, and chip formation. Lastly, an experiment is described in which a long curvilinear groove is cut. It is shown that the most well-formed grooves were cut and acceptable tool wear was achieved, when using a high cutting speed, high nominal tool load, and low probe mounting angle. The capability of cutting grooves as long at 82 mm but with depths of only a few hundred nanometers, using a single tool pass at cutting speeds as high at 25 mm/min is demonstrated.

Effect of Large Cross-Section Oxygen-Propane Flame Cutting on Microstructure in Heat-Affected Zone

2013 ◽  
Vol 274 ◽  
pp. 249-252
Author(s):  
Zhi Xin Wang ◽  
Yong Kui Han ◽  
Yong Qiu Chen
Keyword(s):  
Cross Section ◽  
Heat Affected Zone ◽  
Metal Cutting ◽  
Cutting Speed ◽  
Pressure Vessels ◽  
Manufacturing Industries ◽  
Cutting Process ◽  
Pure Oxygen ◽  
Cutting Processes ◽  
34Crnimo6 Steel

Many metal-manufacturing industries include oxyfuel gas cutting among their manufacturing processes because cutting was often used in metal-cutting processes, specifically in the large castings and forgings and the fabrication of pressure vessels. The oxyfuel gas cutting process uses controlled chemical reactions to remove preheated metal by rapid oxidation in a stream of pure oxygen. Previous research has demonstrated microstructure in heat-affected zone varied depending on the gas used for the combustion as well as the cutting speed (Vc) used during the process. In this research, 34CrNiMo6 steel of 900 mm in thickness and 45 carbon steel of 450 mm in thickness were cut using an oxygen-propane flame cutting process. Then, macroscopic morphology and microstructure test were done to analyze the influence of the thickness of cutting cross-section. The results showed, in general, the width of heat-affected zone increased with the thickness of cutting cross-section. Also, it was demonstrated that heat-affected zone in the bottom and top section was wider than others.

Effect of Cutting Temperature on Phase Transformation in Cutting of NiTi Alloy

2020 ◽  
Author(s):  
Hao Yang ◽  
Katsuhiko Sakai ◽  
Hiroo Shizuka ◽  
Kunio Hayakawa ◽  
Tetsuo Nagare
Keyword(s):  
Phase Transformation ◽  
Phase State ◽  
Niti Alloy ◽  
Cutting Temperature ◽  
Cutting Speed ◽  
Cutting Process ◽  
Maximum Temperature ◽  
Machined Surface ◽  
Speed Condition ◽  
Work Material

Abstract In this study, the effect of cutting temperature on phase transformation in cutting of room temperature austenitic NiTi alloy was investigated by X-ray diffraction (XRD) and temperature measurements. Results from XRD reveals that after cutting process, the phase state of work material near the machined surface transformed from austenite to martensite at relatively low cutting speed conditions while the phase state of work material did not undergo any form of transformation at the highest cutting speed condition. Temperature measurement results measured with temperature indicating paint showed that the maximum temperature of work material near the machined surface in cutting process exceeded the Md temperature at the highest cutting speed condition. However, there was no phase transformation observed in cutting chips after cutting at all cutting speed conditions as the temperature of cutting chips was much higher than the Md temperature under all cutting speed conditions.

Rapid On-Substrate Curing of Thick Protective Package Sealing for Automotive Assembly

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000573-000615
Author(s):  
John Moore ◽  
Jevon Spencer
Keyword(s):  
Integrated Circuits ◽  
Stress Test ◽  
High Volume ◽  
Electronic Packages ◽  
Automotive Electronics ◽  
Reactive Diluents ◽  
Automotive Assembly ◽  
Assembly Floor ◽  
Sealing Materials ◽  
Material Temperature

Protective encapsulant and sealing materials that cure upon delivery are desired for high volume automotive assembly. Unlike many coatings created for electronics, these materials are milimeters thick and have desirable elastomeric properties to withstand decades of stress. While the Automotive Electronics Council (AEC) stress test qualification for integrated circuits (AEC Q100, 1994) may set material temperature resistance at 150C, targets of 200C or 250C are desirable. The ideal polymer exhibits low permeability, effectively creating a barrier to moisture, chemicals, and gases that may emanate anywhere on the chassis. While conventional Buna and Viton rubbers represent a major share of gasketing to protect electronic packages, their design and manufacturing infrastructure cannot meet the pace of prototyping. Polymer compositing with reactive diluents now makes it possible to use CAD fed delivery tools that cure on-contact. Such robotic operated equipment delivers by variable syringe head design on vertical, overhead, or irregular surface contours. Sealant forms that once took months with costly quantity orders, now take seconds in the lab and on the assembly floor. Daetec has created a technology that meets these rapid assembly requirements with properties that exceed the current AEC targets. A complete process will be presented with state of the art LED fiber optic curing on the substrate. Data and application results using comparative specimens will be presented.

scholarly journals Compression-Assisted Adaptive ECC and RAID Scattering for NAND Flash Storage Devices

Sensors ◽  
2020 ◽  
Vol 20 (10) ◽  
pp. 2952 ◽  
Author(s):  
Seung-Ho Lim ◽  
Ki-Woong Park
Keyword(s):  
Flash Memory ◽  
Error Recovery ◽  
Recovery Phase ◽  
Error Correction Codes ◽  
Nand Flash ◽  
Nand Flash Memory ◽  
Flash Storage ◽  
Storage Devices ◽  
Complementary Method ◽  
Compressed Data

NAND flash memory-based storage devices are vulnerable to errors induced by NAND flash memory cells. Error-correction codes (ECCs) are integrated into the flash memory controller to correct errors in flash memory. However, since ECCs show inherent limits in checking the excessive increase in errors, a complementary method should be considered for the reliability of flash storage devices. In this paper, we propose a scheme based on lossless data compression that enhances the error recovery ability of flash storage devices, which applies to improve recovery capability both of inside and outside the page. Within a page, ECC encoding is realized on compressed data by the adaptive ECC module, which results in a reduced code rate. From the perspective of outside the page, the compressed data are not placed at the beginning of the page, but rather is placed at a specific location within the page, which makes it possible to skip certain pages during the recovery phase. As a result, the proposed scheme improves the uncorrectable bit error rate (UBER) of the legacy system.

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