scholarly journals Design, Simulation, and Analysis of Micro/Nanoelectromechanical System Rotational Devices

2021 ◽  
Vol 2021 ◽  
pp. 1-13
Author(s):  
A. R. Kalaiarasi ◽  
T. Deepa ◽  
S. Angalaeswari ◽  
D. Subbulekshmi ◽  
Raja Kathiravan
Keyword(s):  
Melting Point ◽  
Yield Strength ◽  
Current Density ◽  
Work Design ◽  
Temperature Analysis ◽  
Microelectromechanical System ◽  
Rotary Actuator ◽  
Motion Performance ◽  
Nanoelectromechanical System ◽  
Material Temperature

This work is focused on design and simulation of microelectromechanical system (MEMS)/nanoelectromechanical system (NEMS) rotational devices such as micro/nanothermal rotary actuator and micro/nanogear. MEMS/NEMS technologies have allowed the development of advanced miniaturized rotational devices. MEMS/NEMS-based thermal actuator is a scaled version of movable device which will produce amplified motion when it is subjected to thermal forces. One of the applications of such thermal micro/nanoactuator is integrating it into micro/nanomotor that makes a thermal actuated micro/nanomotor. In this work, design and simulation of micro/nanothermal rotary actuator are done using MEMS/NEMS technology. Stress, current density, and temperature analysis are done for microthermal rotary actuator. The performance of the device is observed by varying the dimensions and materials such as silicon and polysilicon. Stress analysis is used to calculate the yield strength of the material. Current density is used to calculate the safer limit of the material. Temperature analysis is used to calculate the melting point of the material. Also, in this work, design and simulation of microgear have been done. Micro/nanogears are devices that can be used to improve motion performance. The essential is that it transmits rotational motion to a different axis.

Resistance Welding by Inserting Wires between Joint Interfaces

2007 ◽  
Vol 127 ◽  
pp. 343-347
Author(s):  
Takeshi Terajima ◽  
Toshio Kuroda
Keyword(s):  
Stainless Steel ◽  
Melting Point ◽  
Base Material ◽  
Resistance Welding ◽  
Joint Interface ◽  
Base Materials ◽  
Steel Wires ◽  
Material Temperature ◽  
Type 316L Stainless Steel

Butt resistance welding of super duplex stainless steel by inserting type 316L stainless steel wires was investigated. When the base material temperature was increased from room temperature to 1100 oC at the heating rate of 550 oC /sec, base materials were jointed through the insert wires and HAZ (heat affected zone) of the joint interface were less than 80 μm. In this joining technique, the insert wires played a role of concentrating current on the wires and increasing their temperature up to melting point or near melting point. When the welding was performed at a load of 10 N, the insert wires consisted of ferrite and austenite growing along the ferrite grain boundary. When the welding was performed at a load of 70N, insert wire remained austenite. That is because the contact resistance between insert wire and base materials at 70 N was lower than that of 10 N, and consequently the insert wire were not adequately heated.

Sonoelectroplating of Sn - Bi Solder Film from EDTA Bath

2007 ◽  
Vol 29-30 ◽  
pp. 99-102
Author(s):  
Atsushi Chiba ◽  
T. Kojima ◽  
Wen Chang Wu
Keyword(s):  
Melting Point ◽  
Current Density ◽  
Environmental Concerns ◽  
Striking Difference ◽  
Buffer Solution ◽  
Solution Ph ◽  
Ultrasonic Agitation ◽  
Free Solder ◽  
Surface Morphologies ◽  
A Current

This study concerns the development of Pb free solder plating due to environmental concerns. The composition of the bath was 0.1 mol/dm3 SnY and 0.1 mol/dm3 BiY- in 2 mol/dm3 CH3COOH - 2 mol/dm3 CH3COONa buffer solution (pH 4.0). The bath used 100 cm3 of solution. Plating was carried out at a current density of 50 mA/cm2 using ultrasonic agitation (sonication) at 28 kHz (100 W). Various percentages of a Sn - Bi alloy could be plated. A 41wt.%Sn - 59 wt.%Bi alloy with a melting point of 415 K was obtained from a [BiY-]/[BiY-+SnY] = 0.3 bath. The surface morphologies of the plated films showed a striking difference in accordance with a change of composition.

Precise Resistance Welding with Wire Insert

2007 ◽  
Vol 539-543 ◽  
pp. 3900-3905
Author(s):  
Takeshi Terajima ◽  
Toshio Kuroda
Keyword(s):  
Stainless Steel ◽  
Melting Point ◽  
Base Material ◽  
Resistance Welding ◽  
Joint Interface ◽  
Base Materials ◽  
Steel Wires ◽  
Material Temperature ◽  
Wire Insert

Butt resistance welding of super duplex stainless steel type 329J4L with inserting type 316L stainless steel wires was investigated. When the base material temperature was increased from room temperature to 1373 K at the heating rate of 550 K /sec, base materials were jointed through the insert wires. HAZ (heat affected zone) of the joint interface were less than 80 μm. In this jointing technique, the insert wires played an important role of concentrating current on the wires and increasing their temperature up to melting point or near melting point. Thermal analysis using thermography revealed that insert wires were adequately heated just after current started at a load of 10 N. When the welding was performed at a load of 70 N, joint area was increased by plastic deformation of the base material. That led to decrease of current concentration. Consequently insert wires were jointed in the solid state.

scholarly journals PENGARUH PENINGKATAN % REDUKSI TERHADAP PENGHALUSAN BUTIR DAN SIFAT MEKANIK PADUAN Cu-Zn 70/30 SETELAH DEFORMASI PADA SUHU 400°C

2016 ◽  
Vol 10 (3) ◽  
pp. 163-172
Author(s):  
Eka Febriyanti ◽  
Amin Suhadi ◽  
Rini Riastuti ◽  
Dedi Priadi
Keyword(s):  
Tensile Strength ◽  
Melting Point ◽  
Ultimate Tensile Strength ◽  
Yield Strength ◽  
Warm Rolling ◽  
Double Pass

 Paduan Cu-Zn 70/30 banyak digunakan dalam berbagai aplikasi industri karena memiliki sifat yang unggul dan belum ada penggantinya. Untuk memperoleh paduan Cu-Zn 70/30 dengan sifat mekanik yang tinggi maka dilakukan riset baik modifikasi dari jenis material yang sudah ada ataupun material baru agar sesuai dengan kebutuhan industri. Untuk mengurangi biaya produksi, namun tetap menghasilkan sifat mekanik yang baik tanpa penambahan paduan maka dikembangkan metode penghalusan butir. Salah satu alternatif proses fabrikasi untuk mengoptimalkan sifat mekanik paduan Cu-Zn 70/30 yaitu dengan metode warm rolling. Warm rolling yang dilakukan pada pelat paduan Cu-Zn 70/30 menggunakan % reduksi sebanyak 29,03%, 34,4%, dan 38,16% pada suhu 400°C secara double pass reversible. Untuk paduan Cu-Zn 70/30, rentang pengerjaan warm rolling berada pada suhu 0,4 s/d 0,6 Tm (melting point) yaitu berkisar antara 382°C-573°C. Hasil metalografi didapat ukuran butir yang semakin menurun sebesar 30,03 µm di bagian tepi dan 33,45 µm di bagian tengah pada % reduksi 38,16%. Hasil uji tarik dengan % reduksi 38,16% menghasilkan nilai ultimate tensile strength (UTS) sebesar 478 MPa, yield strength (YS) sebesar 434 MPa, dan persentase elongasi sebesar 9%. Untuk hasil uji kekerasan menghasilkan nilai kekerasan sebesar 135,8 HV di bagian tepi dan 128,4 HV di bagian tengah pada % reduksi 38,16%. 

Activated Prominences; Mechanisms for Activation and Eruption

1979 ◽  
Vol 44 ◽  
pp. 307-313
Author(s):  
D.S. Spicer
Keyword(s):  
Pressure Gradient ◽  
Density Gradient ◽  
Current Density ◽  
Convective Instability ◽  
Tearing Mode ◽  
Magnetic Shear ◽  
Long Wavelength ◽  
Ideal Mhd ◽  
Gradient Change ◽  
Accelerated Particles

A possible relationship between the hot prominence transition sheath, increased internal turbulent and/or helical motion prior to prominence eruption and the prominence eruption (“disparition brusque”) is discussed. The associated darkening of the filament or brightening of the prominence is interpreted as a change in the prominence’s internal pressure gradient which, if of the correct sign, can lead to short wavelength turbulent convection within the prominence. Associated with such a pressure gradient change may be the alteration of the current density gradient within the prominence. Such a change in the current density gradient may also be due to the relative motion of the neighbouring plages thereby increasing the magnetic shear within the prominence, i.e., steepening the current density gradient. Depending on the magnitude of the current density gradient, i.e., magnetic shear, disruption of the prominence can occur by either a long wavelength ideal MHD helical (“kink”) convective instability and/or a long wavelength resistive helical (“kink”) convective instability (tearing mode). The long wavelength ideal MHD helical instability will lead to helical rotation and thus unwinding due to diamagnetic effects and plasma ejections due to convection. The long wavelength resistive helical instability will lead to both unwinding and plasma ejections, but also to accelerated plasma flow, long wavelength magnetic field filamentation, accelerated particles and long wavelength heating internal to the prominence.

Voids in Irradiated Tungsten and Molybdenum

1969 ◽  
Vol 27 ◽  
pp. 190-191
Author(s):  
Robert C. Rau ◽  
Robert L. Ladd
Keyword(s):  
Melting Point ◽  
Fast Neutron ◽  
Neutron Irradiation ◽  
Elevated Temperatures ◽  
Irradiation Temperature ◽  
The Body ◽  
Face Centered Cubic ◽  
Body Centered Cubic ◽  
Cubic Metals ◽  
Face Centered

Recent studies have shown the presence of voids in several face-centered cubic metals after neutron irradiation at elevated temperatures. These voids were found when the irradiation temperature was above 0.3 Tm where Tm is the absolute melting point, and were ascribed to the agglomeration of lattice vacancies resulting from fast neutron generated displacement cascades. The present paper reports the existence of similar voids in the body-centered cubic metals tungsten and molybdenum.

Microstructural characterization of YBa2Cu3O7-x thin films formed by metalorganic CVD

1991 ◽  
Vol 49 ◽  
pp. 1080-1081
Author(s):  
P. Lu ◽  
W. Huang ◽  
C.S. Chern ◽  
Y.Q. Li ◽  
J. Zhao ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Film Growth ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Ion Milling ◽  
Conventional Grinding

The YBa2Cu3O7-x thin films formed by metalorganic chemical vapor deposition(MOCVD) have been reported to have excellent superconducting properties including a sharp zero resistance transition temperature (Tc) of 89 K and a high critical current density of 2.3x106 A/cm2 or higher. The origin of the high critical current in the thin film compared to bulk materials is attributed to its structural properties such as orientation, grain boundaries and defects on the scale of the coherent length. In this report, we present microstructural aspects of the thin films deposited on the (100) LaAlO3 substrate, which process the highest critical current density.Details of the thin film growth process have been reported elsewhere. The thin films were examined in both planar and cross-section view by electron microscopy. TEM sample preparation was carried out using conventional grinding, dimpling and ion milling techniques. Special care was taken to avoid exposure of the thin films to water during the preparation processes.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

The observation of nano-voids in Au thin films

1987 ◽  
Vol 45 ◽  
pp. 366-367
Author(s):  
William Krakow
Keyword(s):  
Thin Films ◽  
Melting Point ◽  
Present Author ◽  
Stacking Faults ◽  
Damage Threshold ◽  
Ionic Species ◽  
Rare Gases ◽  
Chain Defects ◽  
Vacancy Chains ◽  
Au Thin Films

It has long been known that defects such as stacking faults and voids can be quenched from various alloyed metals heated to near their melting point. Today it is common practice to irradiate samples with various ionic species of rare gases which also form voids containing solidified phases of the same atomic species, e.g. ref. 3. Equivalently, electron irradiation has been used to produce damage events, e.g. ref. 4. Generally all of the above mentioned studies have relied on diffraction contrast to observe the defects produced down to a dimension of perhaps 10 to 20Å. Also all these studies have used ions or electrons which exceeded the damage threshold for knockon events. In the case of higher resolution studies the present author has identified vacancy and interstitial type chain defects in ion irradiated Si and was able to identify both di-interstitial and di-vacancy chains running through the foil.

Sign in / Sign up

Export Citation Format

Share Document