Deposition of Smooth Thin Cu Films in Deep Submicron Trench by Plasma CVD Reactor with H Atom Source

2000 ◽  
Vol 612 ◽  
Author(s):  
Masaharu Shiratani ◽  
Hong Jie Jin ◽  
Yasuhiro Nakatake ◽  
Kazunori Koga ◽  
Toshio Kinoshita ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Grain Orientation ◽  
Surface Reaction ◽  
Deep Submicron ◽  
Source Material ◽  
Plasma Cvd ◽  
Cu Films ◽  
Dissociation Degree ◽  
Atom Source

AbstractEffects of H irradiation on purifying Cu films and improving their surface roughness as well as size and orientation of Cu grains in the films have been examined using a newly developed plasma CVD reactor equipped with an H atom source, in which Cu(hfac)2 is supplied as the source material. The H irradiation is effective in purifying the Cu films, increasing the grain size, and reducing the surface roughness, while it has no effect on the grain orientation. The decrease in dissociation degree of material gas leads to reduction of the surface reaction probability of Cu- containing radicals, which is important to realize conformal deposition in fine trenches. Using the control of dissociation degree of material gas independent of H irradiation, we have demonstrated conformal deposition of smooth Cu films in the trench using the developed plasma CVD reactor.

scholarly journals Investigation of Damage Evolution in Heterogeneous Rock Based on the Grain-Based Finite-Discrete Element Model

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3969
Author(s):  
Shirui Zhang ◽  
Shili Qiu ◽  
Pengfei Kou ◽  
Shaojun Li ◽  
Ping Li ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Tensile Strength ◽  
Grain Orientation ◽  
Damage Evolution ◽  
Discrete Element ◽  
Uniaxial Tensile ◽  
Tensile Cracks ◽  
Rock Heterogeneity ◽  
Heterogeneous Rock

Granite exhibits obvious meso-geometric heterogeneity. To study the influence of grain size and preferred grain orientation on the damage evolution and mechanical properties of granite, as well as to reveal the inner link between grain size‚ preferred orientation, uniaxial tensile strength (UTS) and damage evolution, a series of Brazilian splitting tests were carried out based on the combined finite-discrete element method (FDEM), grain-based model (GBM) and inverse Monte Carlo (IMC) algorithm. The main conclusions are as follows: (1) Mineral grain significantly influences the crack propagation paths, and the GBM can capture the location of fracture section more accurately than the conventional model. (2) Shear cracks occur near the loading area, while tensile and tensile-shear mixed cracks occur far from the loading area. The applied stress must overcome the tensile strength of the grain interface contacts. (3) The UTS and the ratio of the number of intergrain tensile cracks to the number of intragrain tensile cracks are negatively related to the grain size. (4) With the increase of the preferred grain orientation, the UTS presents a “V-shaped” characteristic distribution. (5) During the whole process of splitting simulation, shear microcracks play the dominant role in energy release; particularly, they occur in later stage. This novel framework, which can reveal the control mechanism of brittle rock heterogeneity on continuous-discontinuous trans-scale fracture process and microscopic rock behaviour, provides an effective technology and numerical analysis method for characterizing rock meso-structure. Accordingly, the research results can provide a useful reference for the prediction of heterogeneous rock mechanical properties and the stability control of engineering rock masses.

Study of a Novel Honeycomb Continuous Flocculator

2014 ◽  
Vol 1033-1034 ◽  
pp. 435-438
Author(s):  
Ming Dong ◽  
Qiong Fang Shao
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Flow Resistance ◽  
Separation Efficiency ◽  
Sewage Treatment ◽  
Internal Surface ◽  
Industrial Fermentation ◽  
Fermentation Liquid ◽  
Solid Liquid ◽  
Solid Liquid Separation

The continuous flocculator described in this article refers to a kind of continuous flocculation device designed to flocculate fermentation liquid. The honeycomb continuous flocculator is composed of a vessel and built-in trapezoid subassemblies, which divide the space within the vessel into multiple honeycomb channels. The length ratio between the longest diagonal of the regular hexagon and the axial length of the channel is within the range 0.01–0.04; and the internal surface roughness (Ra) of the channels should be 0 < Ra ≤ 0.2 μm. In contrast to current flocculator designs, the channels of the honeycomb continuous flocculator could control the floc grain size, grain fineness distribution in the fermentation liquid and flocculating time and decrease the flow resistance of the flocculating fermentation liquid and increase handling capacity. These capabilities improve solid-liquid separation efficiency for fermentation liquids. The flocculator could be used either for purification of industrial fermentation liquids or sewage treatment.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

scholarly journals Distinguishing characteristics of Diamictons at the Margin of the Matanuska Glacier, Alaska

1981 ◽  
Vol 2 ◽  
pp. 78-84 ◽  
Author(s):  
Daniel E. Lawson
Keyword(s):  
Grain Size ◽  
Size Distribution ◽  
Internal Structure ◽  
Grain Size Distribution ◽  
Source Material ◽  
Basal Ice ◽  
Gravel Size ◽  
Sediment Flow ◽  
Matanuska Glacier ◽  
Stratigraphic Sequences

The origins of diamictons deposited at the Matanuska Glacier are identified in stratigraphic sequences mainly by the presence or absence of a pebble fabric, internal structure, and variation in gravel-size clast distribution. These properties correlate with major differences in depositional mechanisms and source material. Melt-out till mostly inherits fabric, internal structure, and grain-size distribution from its debris-laden basal ice source. Sediment flow deposits and ice-slope colluvium (deposited by ablational slope processes) have properties developed by resedimentation mechanisms. Melt-out till ranges from structureless to stratified with interspersed lenses and discontinuous laminae, and generally possesses a well-defined pebble fabric. Sediment flow deposits show various combinations of six sedimentologic units with distinct sedimentary features and clast dispersion. Pebble fabric is absent or poorly defined, depending upon the unit's origin. Ice-slope colluvium is usually featureless, except for randomly-dispersed laminated lenses and irregularly-shaped gravelly zones in an otherwise disarrayed assemblage of particles, and is without a pebble fabric.

Effect of Microstructure on the Dissolution Kinetics of Copper Thin Films in Dilute Aqueous Solutions of Cupric Chloride

1993 ◽  
Vol 323 ◽  
Author(s):  
L. Harper Walsh ◽  
N. B. Feilchenfeld ◽  
J. A. Schwarz
Keyword(s):  
Grain Size ◽  
Grain Orientation ◽  
Dissolution Kinetics ◽  
Surface Region ◽  
Practical Method ◽  
Reaction Rates ◽  
Near Surface ◽  
Dilute Aqueous Solutions ◽  
Microelectronics Industry ◽  
Kinetics Of

ABSTRACTMicrostructural differences in copper deposited by four techniques commonly used in the microelectronics industry were previously reported. [1] The reaction rates were predicted using either grain size or grain orientation as the dominant microstructure characteristic. A practical method to monitor copper speciation was developed.[2] This technique was used to measure the reaction rates for the different copper films under two different etching conditions. The results are explained using grain size, grain orientation and near surface region composition.

Grain Structure and Surface Roughness of Four Commercial NiTi Orthodontic Archwires

2017 ◽  
Vol 266 ◽  
pp. 257-263
Author(s):  
Wassana Wichai ◽  
Rutchadakorn Isarapatanapong ◽  
Niwat Anuwongnukroh ◽  
Surachai Dechkunakorn
Keyword(s):  
Surface Roughness ◽  
Grain Size ◽  
Optical Microscope ◽  
Grain Structure ◽  
Wire Surface ◽  
Average Grain Size ◽  
Electron Mode ◽  
The Mean ◽  
The Wire ◽  
Orthodontic Archwires

This study investigated four commercially available NiTi orthodontic archwires from different manufactures for their grain structure and surface roughness.Four commercially available pre-formed NiTi orthodontic archwire (Ormco, Sentalloy, Highland and NIC) with diameter 0.016 x 0.022 inch2 were tested. The wire samples were polished and etched to evaluate the morphology and structure of wire surface. Each NiTi archwire was investigated under a reflected light microscope of an Optical Microscope to analyze its grain structure and size, in longitudinal surfaces. The surfaces of wire were qualitatively examined in the secondary electron mode at common magnification (500X). The surface roughness was also evaluated by a surface roughness tester. The descriptive statistic was evaluated the mean and standard deviation of surface roughness and Medcale T-Test was to test the mean difference of the surface roughness in each brands. This study showed an average grain size of 2-8 μm for each NiTi archwire. The wire surface of Ormco and Highland showed straiations along the longitudinal axes, however Sentalloy and NIC showed small pores on the wire surface. The surface roughness was 0.09 μm for Highland, 0.25 μm for Sentalloy, 0.28 μm for Ormco and 0.46 μm for NIC archwire. The Highland was smoothest and NIC was the roughest. There were in significant (p < 0.05) difference of surface roughness of each brands. The results showed that the four manufactures NiTi archwires were different in grain size, wire surface and surface roughness. During clinical application, these archwires may exhibit different mechanical properties, such as strength, hardness, ductity, and friction because of their microstructure.

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