Non-Destructive Method in Determining the Barley Grain Vitreousity

2021 ◽  
pp. 144-154
Author(s):  
D.E. Troshkin ◽  
A.N. Chertov ◽  
E.V. Gorbunova ◽  
T.V. Meledina ◽  
L.V. Sevastyanova ◽  
...  
Keyword(s):  
Grain Orientation ◽  
Digital Processing ◽  
Barley Grain ◽  
Objective Criterion ◽  
Inspection Method ◽  
Group Boundaries ◽  
Software Complex ◽  
Near Ir ◽  
Non Destructive ◽  
High Repeatability

Possibilities of non-destructive express-evaluation of the barley grain vitreousity using machine vision and digital image processing methods were studied. The study was carried out with the proprietary design hardware and software complex on barley samples of three different varieties provided by the LLC "Nosters". Transmittance in the near IR wavelength range was used as the objective criterion in classifying grains as vitreous, partially vitreous and better use powdery. Classification group boundaries were determined empirically by the cross-section inspection method. The optimal filming mode was experimentally selected, and the algorithm for digital processing of grain images was developed in order to determine the number of better use powdery grains in a sample. In addition to classifying grains by vitreousity, the proposed approach also makes it possible to evaluate uniformity of a sample by this indicator and, thus, to identify a grain of higher quality. It was found out that grain orientation introduces an error of not more than 5 %, and high repeatability of the results and, as a consequence, accuracy of the algorithm are characterized by the variation coefficient of 1.1 %

Non-destructive Inspection Method for Defects in Epoxy Resin by using THz Wave

2020 ◽  
Author(s):  
Rieko Mizuuchi ◽  
Yuji Hisazato ◽  
Hiroaki Cho ◽  
Yusuke Nakamura ◽  
Yuichi Sumimoto ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Inspection Method ◽  
Thz Wave ◽  
Non Destructive

scholarly journals Pipeline In-Line Inspection Method, Instrumentation and Data Management

Sensors ◽  
2021 ◽  
Vol 21 (11) ◽  
pp. 3862
Author(s):  
Qiuping Ma ◽  
Guiyun Tian ◽  
Yanli Zeng ◽  
Rui Li ◽  
Huadong Song ◽  
...  
Keyword(s):  
Data Management ◽  
Petroleum Products ◽  
Metal Loss ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Inspection Method ◽  
Safety Issues ◽  
Pipeline Inspection ◽  
Inspection Systems ◽  
Non Destructive

Pipelines play an important role in the national/international transportation of natural gas, petroleum products, and other energy resources. Pipelines are set up in different environments and consequently suffer various damage challenges, such as environmental electrochemical reaction, welding defects, and external force damage, etc. Defects like metal loss, pitting, and cracks destroy the pipeline’s integrity and cause serious safety issues. This should be prevented before it occurs to ensure the safe operation of the pipeline. In recent years, different non-destructive testing (NDT) methods have been developed for in-line pipeline inspection. These are magnetic flux leakage (MFL) testing, ultrasonic testing (UT), electromagnetic acoustic technology (EMAT), eddy current testing (EC). Single modality or different kinds of integrated NDT system named Pipeline Inspection Gauge (PIG) or un-piggable robotic inspection systems have been developed. Moreover, data management in conjunction with historic data for condition-based pipeline maintenance becomes important as well. In this study, various inspection methods in association with non-destructive testing are investigated. The state of the art of PIGs, un-piggable robots, as well as instrumental applications, are systematically compared. Furthermore, data models and management are utilized for defect quantification, classification, failure prediction and maintenance. Finally, the challenges, problems, and development trends of pipeline inspection as well as data management are derived and discussed.

scholarly journals Numerical Simulation and Experimental Study of Capacitive Imaging Technique as a Non-Destructive Testing Method

2021 ◽  
Author(s):  
Farima Abdollahi Mamoudan ◽  
Sebastien Savard ◽  
Tobin Filleter ◽  
Clemente Ibarra-Castanedo ◽  
Xavier Maldague
Keyword(s):  
Numerical Simulation ◽  
Surface Defects ◽  
Capacitive Sensor ◽  
Experimental Result ◽  
Destructive Testing ◽  
Fe Modelling ◽  
Inspection Method ◽  
Physical Experiments ◽  
Imaging Performance ◽  
Non Destructive

It was recently demonstrated that a co-planar capacitive sensor could be applied to the evaluation of materials without the disadvantages associated with the other techniques. This technique effectively detects changes in the dielectric properties of the materials due to, for instance, imperfections or variations in the internal structure, by moving a set of simple electrodes on the surface of the specimen. An AC voltage is applied to one or more electrodes and signals are detected by others. This is a promising inspection method for imaging the interior structure of the numerous materials, without the necessity to be in contact with the surface of the sample. In this paper, Finite Element (FE) modelling was employed to simulate the electric field distribution from a co-planar capacitive sensor and the way it interacts with a non-conducting sample. Physical experiments with a prototype capacitive sensor were also performed on a Plexiglas sample with sub-surface defects, to assess the imaging performance of the sensor. A good qualitative agreement was observed between the numerical simulation and experimental result.

scholarly journals Digital processing of leaf area of soybeans, subjected to different treatments of seeds

2020 ◽  
Vol 13 (3) ◽  
pp. 24
Author(s):  
M. L. V. Passos ◽  
J. B. C. Souza ◽  
E. A. Silva ◽  
C. A. A. C. Silva ◽  
W. S. Sousa ◽  
...  
Keyword(s):  
Image Processing ◽  
Computer Program ◽  
Leaf Area ◽  
Seed Treatment ◽  
Digital Camera ◽  
Digital Processing ◽  
Thiophanate Methyl ◽  
Beneficial Effects ◽  
Non Destructive

Digital image processing, when applied to the study of leaf area, allows the integration of the direct measurement and non-destructive, and thus preserves the integrity of the plant. The objective was the quantification of the leaf area of soybean, cv. FTS Paragominas RR, submitted to different treatments of seed with the use of the computer program ImageJ, and basic presuppositions of image processing. The experiment was conducted at the Center of Agrarian Sciences and Environmental, Federal University of Maranhão, in Chapadinha (MA), in the period from February to June 2018. The seeds of soybean 'Paragominas RR' were submitted to the technique of seed treatment, consisting of three fungicides of the active ingredients, thiophanate methyl + fluazinam, fludioxonil and carbendazim + tiram, an insecticide active ingredient fipronil and the control. The leaf area was analyzed in the growth phase, through the use of digital camera and ImageJ®. The use of the routines in the computer program ImageJ® were effective for the determination of leaf area of the soybean submitted to different treatments of the seed. The thiophanate methyl + fluazinam in the dose 200 mL per 100 kg of seeds showed beneficial effects on growth of the cv. FTS Paragominas RR, as estimated by the leaf area.

Innovative digital inspection methodology

2020 ◽  
Vol 60 (1) ◽  
pp. 77
Author(s):  
Stephen A Anderson
Keyword(s):  
Laser Scanning ◽  
Design Parameters ◽  
Destructive Testing ◽  
Inspection Method ◽  
Digital Twin ◽  
3D Space ◽  
Twin Models ◽  
Quality Programs ◽  
Non Destructive ◽  
Digital Record

The paper describes an innovative digital inspection methodology that combines 3D laser scanning, metrology and advanced non-destructive testing data that is merged in 3D space to provide a digital record of the condition and mechanical integrity of critical assets. This advanced inspection method supports condition-based maintenance programs and digital twin models to determine future equipment condition, work scope and inspection schedules, while maintaining a digital record throughout the equipment lifecycle. Testing of the methodology includes 3D scanning of drill platforms, baseline scanning of blowout preventers and sheaves, for quality purposes, and the use of augmented reality for viewing scans. Phased array testing has been conducted on sub-components such as slew ring bolting. Data are combined into digital reports that show 3D images of the equipment with precise dimensional data and identified inspection areas. Such reports can be combined with digital twin models to confirm integrity of the equipment for certificate of conformance and baseline data for future integrity comparisons as equipment ages. This innovative inspection methodology will set a new standard for how equipment data are captured, stored and represented. The process provides a range of benefits for OEMs, drilling contractors and operators alike, including digital quality programs to baseline new equipment condition and compare with design parameters, delivering condition and integrity assessments of critical equipment items in-situ or on deck, providing a consistent methodology for inspection and dimensional control of operational equipment items, and providing precise equipment data that can complement digital twin and real time monitoring programs.

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

2005 ◽  
Author(s):  
Yuhki Sato ◽  
Hideo Miura
Keyword(s):  
Nondestructive Evaluation ◽  
Flip Chip ◽  
Evaluation Method ◽  
Local Deformation ◽  
Blue Laser ◽  
Inspection Method ◽  
Bonding Structure ◽  
Small Change ◽  
Non Destructive ◽  
Adhesion Condition

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.

Automated Weld Integrity Analysis Using 3D Point Data

2010 ◽  
Author(s):  
Matthew Swanson ◽  
Eric Johnson ◽  
Alexander Stoytchev
Keyword(s):  
Camera System ◽  
Inspection Method ◽  
Control Applications ◽  
3D Images ◽  
Weld Toe ◽  
Point Data ◽  
Integrity Analysis ◽  
Manufacturing Environments ◽  
Non Destructive

This paper describes a method for non-destructive evaluation of the quality of welds from 3D point data. The method uses a stereo camera system to capture high-resolution 3D images of deposited welds, which are then processed in order to extract key parameters of the welds. These parameters (the weld angle and the radius of the weld at the weld toe) can in turn be used to estimate the stress concentration factor of the weld and thus to infer its quality. The method is intended for quality control applications in manufacturing environments and aims to supplement, and even eliminate, the manual inspections which are currently the predominant inspection method. Experimental results for T-fillet welds are reported.

Sign in / Sign up

Export Citation Format

Share Document