A New Methodology for Electrical Debugging Short in Packages with the Modified Daisy-Chain Die

2007 ◽  
Author(s):  
Steve K. Hsiung ◽  
Kevan V. Tan ◽  
John Soopikian
Keyword(s):  
Quantum Interference ◽  
Stress Testing ◽  
Time Domain Reflectometry ◽  
Superconducting Quantum Interference Device ◽  
Difficult Time ◽  
Reference Device ◽  
Ic Packaging ◽  
Scanning Squid ◽  
Non Destructive ◽  
The Magnetic Field

Abstract Packages with the Modified Daisy-chain (MDC) die have been used increasingly to accelerate reliability stress testing of IC packaging during package development, qualification, and evaluation and reliability monitor programs [1]. Utilizing this approach in essence eliminates chip circuit failure mechanisms. Unlike packages with active die, in packages with the MDC die, when short occurred between two daisy-chain pairs of I/Os, there are four possibilities that can attribute to each pin of the two daisy-chain pairs. That makes the isolation of short failure difficult. Time Domain Reflectometry (TDR) is a well-described technique to characterize package discontinuity (open or short failure). By using a bare package substrate and a reference device, an analyst can characterize the discontinuity and localize it: within the package, the die-package interconnects, or on the die [2]. Scanning SQUID (Superconducting Quantum Interference Device) Microscopy, known as SSM, is a non-destructive technique that detects magnetic fields generated by current. The magnetic field, when converted to current density via Fast Fourier Transform (FFT), is particularly useful to detect shorts and high resistance (HR) defects [3]. In this paper, a new methodology that combines Resistance Analysis, TDR Isolation and SSM Identification for electrical debugging short in packages with the MDC die will be presented. Case studies will also be discussed.

Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry

2013 ◽  
Author(s):  
W. Qiu ◽  
M.S. Wei ◽  
J. Gaudestad ◽  
V.V. Talanov
Keyword(s):  
Quantum Interference ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Superconducting Quantum Interference Device ◽  
Isolation Method ◽  
Space Domain ◽  
Open Faults ◽  
Scanning Squid ◽  
Non Destructive

Abstract Space-domain reflectometry (SDR) utilizing scanning superconducting quantum interference device (SQUID) microscopy is a newly developed non-destructive failure analysis (FA) technique for open fault isolation. Unlike the conventional open fault isolation method, time-domain reflectometry (TDR), scanning SQUID SDR provides a truly two-dimensional physical image of device under test with spatial resolution down to 30 μm [1]. In this paper, the SQUID SDR technique is used to isolate dead open faults in flip-chip devices. The experimental results demonstrate the capability of SDR in open fault detection

Localization of Dead Open in a Solder Bump by Space Domain Reflectometry

2012 ◽  
Author(s):  
David P. Vallett ◽  
Daniel A. Bader ◽  
Vladimir V. Talanov ◽  
Jan Gaudestad ◽  
Nicolas Gagliolo ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Quantum Interference ◽  
Flip Chip ◽  
Solder Bump ◽  
Frequency Range ◽  
Superconducting Quantum Interference Device ◽  
Space Domain ◽  
Non Destructive ◽  
The Magnetic Field

Abstract Space Domain Reflectometry (SDR) is a newly developed non-destructive failure analysis (FA) technique for localizing open defects in both packages and dies through mapping in space domain the magnetic field produced by a radio frequency (RF) current induced in the sample, herein the name Space Domain Reflectometry. The technique employs a scanning superconducting quantum interference device (SQUID) RF microscope operating over a frequency range from 60 to 200 MHz. In this paper we demonstrate that SDR is capable of locating defective micro bumps in a flip-chip device.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

scholarly journals Influence of Resonances on the Noise Performance of SQUID Susceptometers

Sensors ◽  
2019 ◽  
Vol 20 (1) ◽  
pp. 204 ◽  
Author(s):  
Samantha I. Davis ◽  
John R. Kirtley ◽  
Kathryn A. Moler
Keyword(s):  
Quantum Interference ◽  
Noise Performance ◽  
Superconducting Quantum Interference Device ◽  
Noise Characteristics ◽  
Current Voltage ◽  
Electromagnetic Resonances ◽  
Current Voltage Characteristics ◽  
Local Magnetic Fields ◽  
Scanning Squid ◽  
Further Development

Scanning Superconducting Quantum Interference Device (SQUID) Susceptometry simultaneously images the local magnetic fields and susceptibilities above a sample with sub-micron spatial resolution. Further development of this technique requires a thorough understanding of the current, voltage, and flux ( I V Φ ) characteristics of scanning SQUID susceptometers. These sensors often have striking anomalies in their current–voltage characteristics, which we believe to be due to electromagnetic resonances. The effect of these resonances on the performance of these SQUIDs is unknown. To explore the origin and impact of the resonances, we develop a model that qualitatively reproduces the experimentally-determined I V Φ characteristics of our scanning SQUID susceptometers. We use this model to calculate the noise characteristics of SQUIDs of different designs. We find that the calculated ultimate flux noise is better in susceptometers with damping resistors that diminish the resonances than in susceptometers without damping resistors. Such calculations will enable the optimization of the signal-to-noise characteristics of scanning SQUID susceptometers.

A New Type of Instrument with Its Special Excited Input-Signal in Inspecting Residual Stress

2005 ◽  
Vol 490-491 ◽  
pp. 177-182
Author(s):  
Gang Huang ◽  
Lu Ming Li ◽  
Yi Ping Cao ◽  
Xing Chen
Keyword(s):  
Magnetic Field ◽  
Input Signal ◽  
Stress Testing ◽  
High Sensitivity ◽  
Aviation Industry ◽  
Conducting Materials ◽  
New Type ◽  
Field Sensor ◽  
Non Destructive ◽  
The Magnetic Field

The issue of nondestructive testing in aeronautical structures is of considerable importance in the aviation industry today. And a high sensitivity magnetic field sensor, which has recently been developed is designed for non-destructive stress testing. It is based on idea of the magnetic field produced by pulsed currents and perturbed by the presence of stress. The sensor can be effectively utilized for the detection of defects and stress concentration in conducting materials using eddy current testing measurements. The principle of the measuring technique is based on the unbalance of the magnetic field where the stress or cracks exist. Also, the excited input-signal is special designed. A pulsed current was inputted and changed into a self-attenuation signal which does the effect in the probe.

scholarly journals Observation of scissors modes in solid state systems with a SQUID

2016 ◽  
Vol 23 (2) ◽  
pp. 560-565 ◽  
Author(s):  
Keisuke Hatada ◽  
Kuniko Hayakawa ◽  
Fabrizio Palumbo ◽  
Augusto Marcelli
Keyword(s):  
Magnetic Field ◽  
Quantum Interference ◽  
Resolving Power ◽  
Wide Energy Range ◽  
Resonance Fluorescence ◽  
Superconducting Quantum Interference Device ◽  
Unit Cells ◽  
Wide Energy ◽  
The Magnetic Field ◽  
Very High

The occurrence of scissors modes in crystals that have deformed ions in their unit cells was predicted some time ago. The theoretical value of their energy is rather uncertain, however, ranging between ten and a few tens of eV, with the corresponding widths of 10−7to 10−6 eV. Their observation by resonance fluorescence experiments therefore requires a photon spectrometer covering a wide energy range with a very high resolving power. Here, a new experiment is proposed and discussed in which such difficulties are overcome by measuring with a superconducting quantum interference device (SQUID) the variation of the magnetic field associated with the excitation of scissors modes.

Integration of SQUID Microscopy into FA Flow

2001 ◽  
Author(s):  
Rajen Dias ◽  
Lars Skoglund ◽  
Zhiyong Wang ◽  
David Smith
Keyword(s):  
Failure Analysis ◽  
Quantum Interference ◽  
Superconducting Quantum Interference Device ◽  
High Tc ◽  
Superconducting Quantum Interference ◽  
Current Path ◽  
Scanning Squid ◽  
Silicon Device ◽  
Scanning Squid Microscopy

Abstract Scanning superconducting quantum interference device (SQUID) microscopy using high-TC SQUID sensor has been slowly gaining acceptance in the failure analysis (FA) community as a number of silicon device manufacturers are applying the tool and technique to an ever-broadening spectrum of silicon technologies for detecting the location of leakage and short failures by imaging the current path through the die and package. This paper will present the application of scanning SQUID microscopy to short isolation on die and explore the integration of this technique into the FA flow. From the examples presented in this paper, it can be seen that die level short isolation has been possible even when the separation from SQUID sensor to current is about 800-900µm. Several potentially useful techniques that will increase the accuracy of locating the die level short nondestructively are also discussed.

Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy

1999 ◽  
Author(s):  
L. A. Knauss ◽  
B. M. Frazier ◽  
H. M. Christen ◽  
S. D. Silliman ◽  
K. S. Harshavardhan ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Integrated Circuit ◽  
Quantum Interference ◽  
Flip Chip ◽  
Near Field ◽  
Current Density Distribution ◽  
Scanning Squid ◽  
Tools And Techniques ◽  
The Magnetic Field

Abstract As process technologies of integrated circuits become more complex and the industry moves toward flipchip packaging, present tools and techniques are having increasing difficulty in meeting failure analysis needs. One of the most common failures in these types of ICs and packages is power shorts, both during fabrication and in the field. Many techniques such as Emission Microscopy and Liquid Crystal are either not able to locate power shorts or are inhibited in their effectiveness by multiple layers of metal and flip-chip type packaging. A scanning SQUID microscope can overcome some of these difficulties. A SQUID (Superconducting Quantum Interference Device) is a very sensitive magnetic sensor that can image magnetic fields generated by magnetic materials or currents (such as those in an integrated circuit). The current density distribution in the sample can then be calculated from the magnetic field image, and resolutions approaching 5 times the near field limit can be obtained. We present here the application of a SQUID microscope to physical failure analysis and compare it with other techniques to detect shorted current paths in flip-chip mounted ICs and packages.

Scanning SQUID microscope study of vortex states and phases in superconducting mesoscopic dots, antidots, and other structures

2017 ◽  
Author(s):  
T. Nishio ◽  
Y. Hata ◽  
S. Okayasu ◽  
J. Suzuki ◽  
S. Nakayama ◽  
...  
Keyword(s):  
Thin Films ◽  
High Temperature ◽  
High Resolution ◽  
Microscope Study ◽  
Quantum Interference ◽  
High Temperature Superconductors ◽  
Superconducting Quantum Interference Device ◽  
Vortex States ◽  
Mesoscopic Superconductors ◽  
Scanning Squid

This article investigates vortex states and phases in superconducting mesoscopic dots, antidots, and other structures using a scanning superconducting quantum interference device (SQUID) microscope. It begins with an introduction to the phenomenology of superconductivity and the fundamentals of vortex confinement in mesoscopic superconductors. It then provides a background on the SQUID microscope, followed by a discussion of how a high-resolution scanning SQUID microscope was developed. It also describes what the scanning SQUID microscopy revealed about quantized flux in superconducting rings, as well as vortex confinement in microscopic superconducting disks, triangles, and squares. Finally, it presents the results of direct observation of an extended penetration depth in thin films and vortex states in high-temperature superconductors.

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