scholarly journals Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

2020 ◽  
Vol 6 (2) ◽  
pp. 26 ◽  
Author(s):  
Jacob S. Lewis ◽  
Timothy Perrier ◽  
Amirmahdi Mohammadzadeh ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Performance Enhancement ◽  
Thermal Characteristics ◽  
Single Layer Graphene ◽  
Flash Method ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Power Cycling ◽  
Interface Materials

We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers. The performance and reliability of graphene composites have been investigated in up to 500 power cycling measurements. The tested composites were prepared with an epoxy resin base and randomly oriented fillers consisting of a mixture of few-layer and single-layer graphene. The power cycling treatment procedure was conducted with a custom-built setup, while the thermal characteristics were determined using the “laser flash” method. The thermal conductivity and thermal diffusivity of these composites do not degrade but instead improve with power cycling. Among all tested filled samples with different graphene loading fractions, an enhancement in the thermal conductivity values of 15% to 25% has been observed. The obtained results suggest that epoxy-based thermal interface materials with graphene fillers undergo an interesting and little-studied intrinsic performance enhancement, which can have important implications for the development of next-generation thermal interface materials.

Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials

2009 ◽  
Author(s):  
Reza H. Khiabani ◽  
Yogendra Joshi ◽  
Cyrus Aidun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Thermal Characteristics ◽  
Thermal Conductivity Ratio ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden Thermal Interface Materials (TIMs) are used extensively in thermal packaging of electronic components to enhance the heat transfer between heat dissipating components and the thermal management layers. In this paper, the thermal performance of particle laden TIMs is studied numerically, using the Lattice Boltzmann method. The effect of particle volume fraction, particle size and the thermal conductivity ratio on the thermal performance of particle laden TIMs are examined. The results for the effective thermal conductivity of particle laden greases are in agreement with the existing analytical and experimental results reported in the literature.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

Advanced Thermal Interface Materials

2006 ◽  
Vol 968 ◽  
Author(s):  
Yimin Zhang ◽  
Allison Xiao ◽  
Jeff McVey
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Energy ◽  
Heat Sink ◽  
Electronic Device ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Current State ◽  
Interface Materials ◽  
State Of Art

ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs. This paper discusses the current state-of-art TIM solutions, particularly fusible particles for improved thermal conductivity. The paper will address the benefits and limitations of this approach, and describe a system with unique filler morphology. Thermal resistance and diffusivity/conductivity characterization techniques are also discussed.

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

2005 ◽  
Author(s):  
Gary Lehmann ◽  
Hao Zhang ◽  
Arun Gowda ◽  
David Esler
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Thermal Resistance ◽  
Bond Line ◽  
Surface Conductance ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bond Line Thickness ◽  
Matrix Surface ◽  
Interface Materials

Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different adhesive materials. These model TIMs have a common matrix material and are distinguished by their particle size distributions. Bond-lines are formed in a three-layer assembly consisting of a substrate-TIM-substrate structure. The thermal resistance of the bond-line is measured, as a function of bond-line thickness, using the laser flash-technique. A linear variation of resistance with bond-line thickness is observed; Rbl = β · Lbl + Ro. A model is presented that predicts the effective thermal conductivity of the composite as a function of the particle and matrix conductivity, the particle-matrix surface conductance, the particle volume fraction and the particle size distribution. Specifically a method is introduced to account for a broad, continuous size distribution. A particle-matrix surface conductance value of ∼10W/mm2K is found to give good agreement between the measured and predicted effective thermal conductivity values of the composite TIMs.

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