Measurement Method for Quality Control of Cylinders in Roll-to-Roll Printing Machines

This paper describes a measurement method for the quality control of cylinders for printing machines based on roll-to-roll presses. If the surface finishing of the cylinders is not adequate, the printing is unacceptable, and the defective cylinders must be reworked. The performed quality check of the cylinder surface roughness by means of contact methods was unable to identify the cylinder defects, and acceptance of the manufactured cylinders before integration was demanded to the visual inspection performed by trained operators. In this work a contactless measurement method based on the eddy current displacement sensor was proposed and validated as a tool for quality check as an alternative to optical roughness measurements. A test bench for the characterization of printer cylinders was designed and manufactured, allowing for the validation of the proposed method on different batches of cylinders and the identification of a threshold to guide the acceptance of tested cylinders prior to mounting on the roll-to-roll press.

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Proposal of an Improved Contactless Measurement Method Using an Advanced LED Displacement Sensor for Vibration Stress of Piping Systems

Journal of Pressure Vessel Technology ◽

10.1115/1.4051929 ◽

2021 ◽

Author(s):

Akira Maekawa ◽

Takashi Tsuji ◽

Tsuneo Takahashi

Keyword(s):

Mode Shape ◽

Measurement Method ◽

Previous Method ◽

Measuring System ◽

Displacement Sensor ◽

Contactless Measurement ◽

Piping System ◽

Bending Mode ◽

Piping Systems ◽

Vibration Stress

Abstract The present paper proposes an improved contactless measurement method for vibration stress of piping systems, by which the measurement time is shorter and the measuring works are more simple. The proposed method includes two processes, in which the bending mode shape of piping vibration is identified by a transmission-type light emitting diode (LED) displacement sensor and the vibration stress is calculated based on beam theory using the approximated curve of the bending mode shape. The proposed method uses one advanced LED displacement sensor to measure the vibration stress though multiple conventional LED sensors must be used in the previous method developed by the authors. Therefore, the measuring system could be reduced in size and a light-weight and portable measurement instrument was developed. The measurement accuracy and reliability of the new method were validated by the vibration experiment using a mock-up piping system.

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Development of a Contactless Measurement Method Using an LED-Optical Displacement Sensor for Vibration Stress of Piping Systems

Volume 7: Operations, Applications and Components ◽

10.1115/pvp2015-45094 ◽

2015 ◽

Cited By ~ 2

Author(s):

Akira Maekawa ◽

Takashi Tsuji ◽

Tsuneo Takahashi

Keyword(s):

Measurement Method ◽

Previous Method ◽

Measuring System ◽

Displacement Sensor ◽

Contactless Measurement ◽

Curvature Radius ◽

Piping System ◽

Optical Displacement ◽

Piping Systems ◽

Vibration Stress

The present paper proposes an efficient contactless measurement method for vibration stress of piping systems, by which the measurement tasks are performed within an extremely short time and the measured stress can be evaluated immediately after the measurement. The proposed method includes two processes, in which the bending shape of a pipe induced by vibration response is identified by a transmission-type optical displacement sensor and the vibration stress is calculated based on beam theory using the curvature radius estimated by approximating the bending shape. The proposed method uses only one LED-optical sensor to measure the vibration stress though multiple sensors must be used in the previous method developed by the authors. Therefore, the measuring system could be reduced in size and a light-weight and portable measurement instrument was developed. The measurement accuracy and reliability of the new method were verified by the vibration experiment using a mock-up piping system.

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Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2008p0121 ◽

2008 ◽

Author(s):

Nicholas Randall ◽

Rahul Premachandran Nair

Keyword(s):

Mechanical Properties ◽

Quality Control ◽

Integrated Circuits ◽

Integrated Circuit ◽

Manufacturing Process ◽

Solder Bumps ◽

Initial Work ◽

Circuit Components ◽

Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

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Faculty Opinions recommendation of Characterization of rapidly degraded polypeptides in mammalian cells reveals a novel layer of nascent protein quality control.

Faculty Opinions – Post-Publication Peer Review of the Biomedical Literature ◽

10.3410/f.1029300.343663 ◽

2005 ◽

Author(s):

Peter Van Endert

Keyword(s):

Quality Control ◽

Mammalian Cells ◽

Protein Quality ◽

Protein Quality Control

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Faculty Opinions recommendation of Characterization of an ERAD gene as VPS30/ATG6 reveals two alternative and functionally distinct protein quality control pathways: one for soluble Z variant of human alpha-1 proteinase inhibitor (A1PiZ) and another for aggregates of A1PiZ.

Faculty Opinions – Post-Publication Peer Review of the Biomedical Literature ◽

10.3410/f.1028958.342448 ◽

2005 ◽

Author(s):

Daniel Klionsky

Keyword(s):

Quality Control ◽

Proteinase Inhibitor ◽

Protein Quality ◽

Protein Quality Control

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Analytical profile of Arka Taila - An Ayurvedic oil based medicine used in Karnasrava (Otomycosis)

Journal of Ayurveda and Integrated Medical Sciences (JAIMS) ◽

10.21760/jaims.v2i3.8212 ◽

2017 ◽

Vol 2 (3) ◽

Author(s):

Komal D. Jani ◽

Dharmendra P. Jani

Keyword(s):

Quality Control ◽

Fungal Infections ◽

Curcuma Longa ◽

Calotropis Procera ◽

Control Parameters ◽

Scientific Evaluation ◽

Quality Control Parameters ◽

Quality Check ◽

Based Medicine ◽

Excessive Accumulation

Otomycosis denotes diffuse otitis externa due to fungal infections. The fungii are usually secondary invaders of the tissue rendered susceptible by bacterial infection, physical injury or excessive accumulation of cerumen in the external auditory canal. Karnasraava means discharge from ear which can be correlated with otorrhoea. Karnasraava (discharge) is one of symptom of otomycosis. Arka Taila has been mentioned in Shaarangadhara is very simple formula having ingredients i.e. Haridraa (Curcuma longa), Arka Patra Swarasa (Calotropis procera) and Sarshapa Taila (Brassica campetries). The quality control parameters resulted after scientific evaluation of Arka Taila can be used as reference standard for quality control or quality assurance of a pharmaceutical industry in order to have a proper quality check over its preparation and processing.

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Effect of Mechanical Surface Treatments on the Surface State and Passive Behavior of 304L Stainless Steel

Metals ◽

10.3390/met11010135 ◽

2021 ◽

Vol 11 (1) ◽

pp. 135

Author(s):

Kathleen Jaffré ◽

Benoît Ter-Ovanessian ◽

Hiroshi Abe ◽

Nicolas Mary ◽

Bernard Normand ◽

...

Keyword(s):

Electron Microscopy ◽

Stainless Steel ◽

Surface State ◽

Electrochemical Impedance ◽

Passive Films ◽

Surface Finishing ◽

Ultrafine Grain ◽

304L Stainless Steel ◽

Passive Behavior

The effect of dry grinding on 304L stainless steel’s passive behavior is compared to two other surface finishing (mechanical polishing down to 2400 with SiC emery paper and 1 µm with diamond paste, respectively). The characterization of the surface state was performed using scanning electron microscopy, transmission electron microscopy, 3D optical profilometer, and X-ray diffraction. Results indicate that each surface treatment leads to different surface states. The ground specimens present an ultrafine grain layer and a strong plastic deformation underneath the surface, while an ultrafine grain layer characterizes the subsurface of the polished specimens. Grinding induces high residual compressive stresses and high roughness compared to polishing. The characterization of the passive films was performed by electrochemical impedance spectroscopy and Mott–Schottky analysis. The study shows that the semiconductor properties and the thickness of the passive films are dependent on the surface state of the 304L stainless steel.

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