scholarly journals The Effect of Laser Energy and Nitrogen Flow in Solder Joints Properties of Head Gimbal Assembly

2020 ◽  
Vol 9 (3) ◽  
pp. 388-394
Keyword(s):  
Shear Strength ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Laser Energy ◽  
Energy Levels ◽  
Nitrogen Flow ◽  
Effect Analysis ◽  
Bonding System ◽  
Head Gimbal Assembly ◽  
The Difference

The objective of this research is to study the effect of laser energy and Nitrogen flow on the solder joints of the Head Gimbal Assembly (HGA). The soldering of the HGA components isn't the same as general semiconductors. Since the soldering figure perpendicular to each other so that, it was used the laser solder jet bonding system. The solder jet bonding system uses a solder ball consisting of Sn-2.0Ag-0.7Cu (SAC207) is used for connection of the HGA pad made from a Cu trace coated with Au. The growth of intermetallic compounds (IMCs) and shear strength will be analyzed to investigate the effects of laser energy and Nitrogen flow on solder joint reliability. In this research, laser energy levels since 2, 2.5, 3, 3.5, 4, and 4.5 mJ and keep the Nitrogen flow value at 90 mbar. As for the Nitrogen flow effect analysis, the Nitrogen flow level was used at 80, 100, 120, and 140 mbar and keep the laser energy value 3.5 mJ. The results of the study show that the increased levels of laser energy can inhibit the growth of intermetallic compounds as well as the AuSn4 phase that can present benefit to solder joints with results showing within the shear strength to increase significantly. The increase in Nitrogen flow levels has the same effect as the increase in laser energy levels, which can decreases the growth of intermetallic compounds and AuSn4 phase also including increased shear strength. The difference between laser energy and Nitrogen flow increasing shows the level of laser energy can clearly distinct the effect on each level. But the increase in Nitrogen flow level is statistically insignificant from each level.

Effects of Bismuth Content on the Microstructure, Shear Strength and Thermal Properties of Sn-0.7Cu-0.05Ni Solder Joints

2020 ◽  
Vol 982 ◽  
pp. 115-120
Author(s):  
Phairote Sungkhaphaitoon ◽  
Tanyaporn Suwansukho
Keyword(s):  
Shear Strength ◽  
Thermal Properties ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Interfacial Layer ◽  
Solder Joints ◽  
Peak Temperature ◽  
Cu Substrate ◽  
Bismuth Content ◽  
Pasty Range

The effects of bismuth content on the microstructure, shear strength and thermal properties of Sn-0.7Cu-0.05Ni solder joints were investigated. Adding 2 wt% elemental Bi to Sn-0.7Cu-0.05Ni solder joints reduced peak temperature by about 6.7 °C, increased pasty range by 4.2 °C and raised undercooling by 3.1 °C. The microstructure of the interfacial layer between solder and Cu substrate was composed of (Cu,Ni)6Sn5 and (Cu,Ni)3Sn intermetallic compounds (IMCs). The solder joint included a phase of SnBi and Cu6Sn5 IMCs. The addition of elemental Bi increased shear strength and suppressed the growth of IMCs in the interfacial layer of the solder joints.

Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages

2004 ◽  
Vol 19 (10) ◽  
pp. 2897-2904 ◽  
Author(s):  
M.N. Islam ◽  
Y.C. Chan ◽  
A. Sharif
Keyword(s):  
Growth Rate ◽  
Shear Strength ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Extended Time ◽  
Reflow Time ◽  
Ternary Intermetallic Compounds ◽  
Ball Grid Array Packages

Lead-free solders with high Sn content cause excessive interfacial reactions at the interface with under-bump metallization during reflow. The interface formed after reflow affects the reliability of the solder joint. For this paper, we investigated the interfacial reactions of Sn0.7Cu and Sn36Pb2Ag solder on electrolytic Ni layer for different reflow times. The traditionally used Sn36Pb2Ag solder was used as a reference. It was found that during as-reflowed, the formation of Cu-rich Sn–Cu–Ni ternary intermetallic compounds (TIMCs) at the interface of Sn0.7Cu solder with electrolytic Ni is much quicker, resulting in the entrapment of some Pb (which is present as impurity in the Sn–Cu solder) rich phase in the TIMCs. During extended time of reflow, high (>30 at.%), medium (30-15 at.%) and low (<15 at.%) Cu TIMCs formed at the interface. The amount of Cu determined the growth rate of TIMCs. Cu-rich TIMCs had higher growth rate and consumed more Ni layer. By contrast, the growth rate of the Ni–Sn binary intermetallic compounds (BIMCs) in the Sn36Pb2Ag solder joint was slower, and the Ni–Sn BIMC was more stable and adherent. The dissolution rate of electrolytic Ni layer for Sn0.7Cu solder joint was higher than the Sn36Pb2Ag solder joints. Less than 3 μm of the electrolytic Ni layer was consumed during molten reaction by the higher Sn containing Sn0.7Cu solder in 180 min at 250 °C. The shear strength of Sn–Pb–Ag solder joints decreased within 30 min of reflow time from 1.938 to 1.579 kgf due to rapid formation of ternary Ni–Sn–Au compounds on the Ni–Sn BIMCs. The shear strength of Sn0.7Cu solder joint is relatively stable from 1.982 to 1.861 kgf during extended time reflow. Cu prevents the resettlement of Au at the interface. The shear strength does not depend on the thickness of intermetallic compounds (IMCs) and reflow time. Ni/Sn–Cu solder system has higher strength and can be used during prolonged reflow.

Effect Analysis of Nitrogen Injection on the Variation of “Oxidation Zone” in Coal Mine Gob Based on Numerical Simulation

2016 ◽  
Vol 9 (1) ◽  
pp. 47-54
Author(s):  
Jing Shen ◽  
Mingran Chang
Keyword(s):  
Numerical Simulation ◽  
Coal Mine ◽  
Heat Dissipation ◽  
Spontaneous Combustion ◽  
Oxidation Zone ◽  
Effect Analysis ◽  
Mine Fire ◽  
Nitrogen Injection ◽  
The Difference ◽  
Residual Coal

One of the main reasons for coal mine fire is spontaneous combustion of residual coal in gob. As the difference of compaction degree of coal and rock, the underground gob can be considered as a porous medium and divided into “three zones” in accordance with the criteria. The “three zones” are “heat dissipation zone”, “oxidation zone” and “choking zone”, respectively. Temperature programming experiments are taken and numerical simulation with obtained experimental data is utilized to analyze the distribution of “three zones” in this paper. Different width and depth of “oxidation zone” are obtained when the inlet air velocity is changed. As the nitrogen injection has inhibition effect on spontaneous combustion of residual coal in gob, nitrogen is injected into the gob. The widths of “oxidation zone” are compared before and after nitrogen injection. And ultimately the optimum location and volume of nitrogen injection are found out.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

scholarly journals The role of L/W in the solar radiation for Saharian cities

2019 ◽  
Vol 91 ◽  
pp. 05006
Author(s):  
Rami Qaoud ◽  
Alkama Djamal
Keyword(s):  
Solar Radiation ◽  
Solar Energy ◽  
Energy Levels ◽  
Direct Solar Radiation ◽  
Test Field ◽  
Natural Lighting ◽  
The Difference ◽  
The Impact ◽  
The Relationship

The urban fabric of the desert cities is based on the principle of reducing the impact of urban canyons on direct solar radiation. Here comes this research, which is based on a comparative study of the periods of direct solarisation and values of the solar energy of urban canyons via two urban fabrics that have different building densities, where the ratio between L/W is different. In order to obtain the real values of the solar energy (thermal, lighting), the test field was examined every two hours, each three consecutive days. The measurement stations are positioned by the three types of the relationship between L/W, (L≥2w, L=w, L≤0.5w). According to the results, we noticed and recorded the difference in the periods of direct solarization between the types of urban engineering canyons, reaching 6 hours a day, the difference in thermal values of air, reaching 4 °C, and the difference in periods of direct natural lighting, reaching 6 hours. It should be noted that the role of the relationship between L/W is to protect the urban canyons by reducing the impact of direct solar radiation on urban canyons, providing longer hours of shading, and reducing solar energy levels (thermal, lighting) at the urban canyons. This research is classified under the research axis (the studies of external spaces in the urban environment according to the bioclimatic approach and geographic approach). But this research aims to focus on the tracking and studying the distribution of the solar radiation - thermal radiation and lighting radiation - in different types of street canyons by comparing the study of the direct solarization periods of each type and the quantity of solar energy collected during the solarization periods.

scholarly journals The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 518 ◽  
Author(s):  
Congcong Cao ◽  
Keke Zhang ◽  
Baojin Shi ◽  
Huigai Wang ◽  
Di Zhao ◽  
...  
Keyword(s):  
Shear Strength ◽  
Fracture Mechanism ◽  
Thermal Cycle ◽  
Solder Joints ◽  
Joint Interface ◽  
Interface Microstructure ◽  
Average Thickness ◽  
Thermal Cycles ◽  
Initial State ◽  
Cycle Loading

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.

scholarly journals The Shear Strength Characteristics of Frozen Coarse Granular Debris

1984 ◽  
Vol 30 (106) ◽  
pp. 348-357 ◽  
Author(s):  
W.G. Nickling ◽  
L. Bennett
Keyword(s):  
Shear Strength ◽  
Normal Load ◽  
Strength Characteristics ◽  
Shear Tests ◽  
Critical Limit ◽  
Load Rate ◽  
Polycrystalline Ice ◽  
Saturated Sample ◽  
The Difference ◽  
Ice Content

AbstractThe effect of ice content and normal load on the shear strength characteristics of a frozen coarse granular debris was investigated. 31 shear tests were carried out in a modified shearbox allowing a sample temperature of (–1.0 ± 0.2)° C and a load rate of 9.63 × 10−4 cm/min. The tests showed that as the ice content of the frozen debris was increased from 0% (under-saturated) to 25% (saturated), sample shear strength was markedly increased. In contrast, sample shear strength was reduced as ice content was increased from 25% (saturated) to 100% (supersaturated). The changes in shear strength with increasing ice content were attributed directly to changes in internal friction and the cohesive effects of the pore ice. The shear tests also indicate that shear strength increases with increasing normal load up to a critical limit. Above this limit, dilatancy is suppressed causing the shear strength to decrease or remain relatively constant with increased normal load.The stress-strain curves of the 31 tests indicated that samples with higher ice contents tended to reach peak strength (τP) with less displacement during shear. Moreover, the difference between τp and τr (residual strength) was lowest for pure polycrystalline ice and highest for ice-saturated samples. The Mohr-Coulomb failure envelopes displayed very distinctive parabolic curvilinearity. The degree of curvature is thought to be a function of ice creep at low normal loads and particle fracture and crushing at high normal loads.

scholarly journals SPECTRAL CORRELATIONS IN DISORDERED MESOSCOPIC METALS AND THEIR RELEVANCE FOR PERSISTENT CURRENTS

1996 ◽  
Vol 10 (28) ◽  
pp. 1397-1406 ◽  
Author(s):  
AXEL VÖLKER ◽  
PETER KOPIETZ
Keyword(s):  
Energy Levels ◽  
Three Dimensional ◽  
Average Density ◽  
Electron Interaction ◽  
Energy Window ◽  
Persistent Currents ◽  
Dependent Part ◽  
The Difference ◽  
Aharonov Bohm ◽  
Grand Canonical

We use the Lanczos method to calculate the variance σ2(E, ϕ) of the number of energy levels in an energy window of width E below the Fermi energy for noninteracting disordered electrons on a thin three-dimensional ring threaded by an Aharonov–Bohm flux ϕ. We confirm numerically that for small E the flux-dependent part of σ2(E, ϕ) is well described by the Altshuler–Shklovskii-diagram involving two Cooperons. However, in the absence of electron–electron interactions this result cannot be extrapolated to energies E where the energy-dependence of the average density of states becomes significant. We discuss consequences for persistent currents and argue that for the calculation of the difference between the canonical- and grand canonical current it is crucial to take the electron–electron interaction into account.

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