Compaction Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication

2013 ◽  
Vol 421 ◽  
pp. 267-271
Author(s):  
Muhammad Hafiz Zan Hazizi ◽  
M.A.A. Mohd Salleh ◽  
Zainal Ariffin Ahmad ◽  
A.M. Mustafa Al Bakri ◽  
A. Abdullah ◽  
...  
Keyword(s):  
Powder Metallurgy ◽  
Mechanical Alloying ◽  
Composite Solder ◽  
Compaction Pressure ◽  
Compaction Process ◽  
Thin Disc ◽  
Best Parameter ◽  
Porosity Percentage ◽  
Powder Metallurgy Route

The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully weighted, mixed and blended in a mechanical alloying machine. Si3N4 were added to the Sn-0.7Cu solder as reinforcement.After 6 hours of mixing and blending, the powders were later compacted into a thin disc at 5 different pressures. Densities and volumes of the compacted samples were then obtained by using MicromeriticsAccuPyc II 1340 Gas Pycnometer. All data were analyzed and compared with each other in order to select the best parameter for compaction pressure. Results showed that at 140 bars, the porosity percentage is the lowest. Hence, it was decided that 140 bars is the best parameter for compaction process.

Optimization of Warm Compaction Process Parameters in Synthesizing Carbon-Copper Composite Using Taguchi Method

2016 ◽  
Vol 701 ◽  
pp. 112-116
Author(s):  
Salina Budin ◽  
Mohd Afiq Nurul Hadi ◽  
Talib Ria Jaafar ◽  
Mohd Asri Selamat
Keyword(s):  
Powder Metallurgy ◽  
Taguchi Method ◽  
Rupture Strength ◽  
Compaction Pressure ◽  
Compaction Process ◽  
Compaction Temperature ◽  
Warm Compaction ◽  
Copper Composite ◽  
Best Parameters ◽  
Powder Metallurgy Route

Carbon–copper composites are attractive materials used for electrical applications, such as brushes for engines and generators, slip rings, switches, relays, lugs, contactor and current collector. Various methods can be used to prepare Carbon-copper composite, such as infiltration, sintering, cold pressing, hot pressing or isostatic pressing. However, powder metallurgy route is seen to be most favorable due to its possibility of producing uniform microstructure and excellent net shape product. In this work, carbon-copper composite is prepared using powder metallurgy route with warm compaction process. The compaction pressure (A), compaction temperature (B), post baking temperature (C) and compaction time (D) were optimized by Taguchi method. Hardness and transverse rupture strength (TRS) were used to assess the effect of warm compaction process. The experimental design is according to the L9 (34) orthogonal array. Signal to noise and analysis of variance (ANOVA) are employed to analyze the effect of warm compaction parameters. It is found that the best parameters and their levels are A3B2C3D2 for the main effect of hardness and the best parameters and their levels for TRS is A3B2C3D1. It is also notified that optimized parameters of A3, B2 and C3 are identical for hardness and TRS. However, for parameter D, the best level for hardness is D2 and for TRS is D1. The ANOVA analysis proved that compaction temperature parameter is significant to hardness and TRS value whereas the others parameters are not significant.

Design of Experiment (DOE) of Powder Metallurgy Technique in Fabricating SnCu/Carbon Lead-Free Composite Solder with Different Mixing Parameters

2014 ◽  
Vol 803 ◽  
pp. 269-272
Author(s):  
Sayyidah Amnah Musa ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
High Performance ◽  
Composite Solder ◽  
Mixing Time ◽  
Physical And Mechanical Properties ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Best Parameter ◽  
Free Solder

Physical and mechanical properties of a solder joint will be improved by adding the high performance of reinforcement particulates in the monolithic lead-free solder. In this study, 0.1wt% of activated carbon (AC) was added into Sn-0.7Cu lead-free solder which fabricated via powder metallurgy (PM) techniques. Various parameters used in PM technique such as mixing time, compacting load and sintering temperature has been carried out in fabricating the composite solder. In this study, the best mixing time has been optimized. The distribution of carbon in SnCu matrix for each mixing time was observed by using optical microscope. Microstructural observation showed that the increasing in mixing time has increased the number of AC particles to become agglomerated. It is found out that 1hour of mixing time is the best parameter to fabricate SnCu/AC composite solder via powder metallurgy route since the distribution of reinforcement particles has distributed uniformly at the grain boundaries without any agglomeration.

Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route

2012 ◽  
Vol 626 ◽  
pp. 791-796 ◽  
Author(s):  
Mohd Arif Anuar Mohd Salleh ◽  
Muhammad Hafiz Hazizi ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
N.Z. Noriman ◽  
Ramani Mayapan ◽  
...  
Keyword(s):  
Elevated Temperature ◽  
Powder Metallurgy ◽  
Solder Joint ◽  
Composite Solder ◽  
Lead Free ◽  
Mixed Powder ◽  
Solder Joint Reliability ◽  
Solder Material ◽  
Joint Reliability ◽  
Powder Metallurgy Route

Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder materials developed by composite approach showed improvement in their properties and importantly it improved their service performance when compared with solder materials developed by other methods. This paper reviews the solder properties of various types of composite lead-free solder that were fabricated via powder metallurgy route. The fabrication processes of the composite solder material by using powder metallurgy route which involved mixing the powder homogeneously, compaction of the mixed powder and sintering the green body were discussed in detail. The types of reinforcements used in order to enhance its properties and the roles of the reinforcement used were also discussed in detail. Properties of a desirable composite solder and the effects of the reinforcement addition to the composite solder microstructure, changes in its wettability and improvement of its mechanical properties were later discussed in this paper. In conclusion, by reviewing various research advances in composite solder material, a solder material with high solder joint reliability at elevated temperature have yet to be found. Thus, a novel composite solder material with higher solder joint reliability at room and elevated temperature was proposed.

Effects of SiC nanowires on reliability of Sn58Bi-0.05GNSs/Cu solder joints

2020 ◽  
pp. 2150007
Author(s):  
Nan Jiang ◽  
Liang Zhang ◽  
Kai-Kai Xu ◽  
Mu-Lan Li ◽  
Feng-Jiang Wang
Keyword(s):  
Shear Strength ◽  
Powder Metallurgy ◽  
Melting Temperature ◽  
Composite Solder ◽  
Solder Joints ◽  
Shear Properties ◽  
Wetting Behavior ◽  
Sic Nanowires ◽  
Reliability Of Solder Joints ◽  
Powder Metallurgy Route

In this work, SiC nanowires (SiC NWs) reinforced SBG (Sn-58Bi-0.05GNSs) composite solder was prepared using powder metallurgy route. The effect of SiC NWs on melting temperature, wetting behavior, shear properties, microstructure of the prepared solder joints and interfacial reaction were studied in detail. Results reveal that incorporating SiC NWs can develop the wetting behavior and shear properties of solder joint but has a little effect on melting temperature. The microstructure of solder is refined markedly with the addition of SiC NWs, which is one of the reasons for the increase in the shear strength of the solder joints. Additionally, the dimension of Cu6Sn5 IMC grains diminishes with the doping of SiC NWs, which resulted in the thinning of Cu6Sn5 IMC layer. Thence, the addition of SiC NWs may be an effective way to improve the reliability of solder joints.

scholarly journals Iron-based intermetallic particles formation in Al-Zn-Si alloy through powder metallurgy route

2021 ◽  
Vol 8 (12) ◽  
pp. 36-42
Author(s):  
Khaliq et al. ◽  
Keyword(s):  
Powder Metallurgy ◽  
Mechanical Alloying ◽  
Ball Milling ◽  
X Ray Diffraction ◽  
Mechanically Alloyed ◽  
Cold Pressing ◽  
X Ray ◽  
Steel Strips ◽  
Intermetallic Particles ◽  
Powder Metallurgy Route

Corrosion of the steel products is one of the significant challenges which is managed by coating with Al-Zn-based alloys. The Galvalume alloy (Al-55%, 43.5%-Zn, Si-1.5%) is coated on steel strips via a hot-dipping process. The dissolution of iron (Fe) from steel strips and the formation of Fe-based intermetallic particles is an inevitable phenomenon during the hot-dip coating process. These intermetallic particles are a primary source of massive bottom dross build-up in the coating pot and metal spot defects in the coated steel products. Therefore, it is important to investigate the formation of Fe-based intermetallic particles. In this study, Fe-based intermetallic particles are produced via the powder metallurgy route. High energy ball milling was used for mechanical alloying of aluminum (Al), iron (Fe), silicon (Si), and zinc (Zn) powders. Optimized ball milling conditions were identified after a series of trials. After cold pressing, the mechanically alloyed samples (pellets) were sintered at various conditions in a high vacuum sintering furnace. The X-ray diffraction (XRD) and scanning electron microscope (SEM) equipped with energy-dispersive X-ray diffraction (EDS) were used for the analysis of raw material, mechanically alloyed powders, and sintered pellets. It is concluded that the mechanical alloying of 6h and cold pressing at 9 tons for 30 min is sufficient to produce a dense compact material. It was found that Fe-based intermetallic particles were successfully fabricated which were α-AlFeSi. However, intermetallic particles similar to those found in the bottom dross of the coating pot are difficult to fabricate through the powder metallurgy route due to the volatilization of Zn during the sintering process.

Use of Cenosphere for Making Metal-Microspheres Syntactic Foam through Powder Metallurgy Route

2015 ◽  
Vol 830-831 ◽  
pp. 75-79
Author(s):  
D.P. Mondal ◽  
R. Dasgupta ◽  
Ajay Kumar Barnwal ◽  
Shaily Pandey ◽  
Hemant Jain
Keyword(s):  
Powder Metallurgy ◽  
Relative Density ◽  
Uniform Distribution ◽  
Compaction Pressure ◽  
Syntactic Foam ◽  
Syntactic Foams ◽  
Plateau Stress ◽  
Stress Energy ◽  
Strength And Stiffness ◽  
Powder Metallurgy Route

Cenospheres are very cheap, and are reasonably strong and thermally stable upto 1200°C. In view of this attempt has been made to use these cenosphere for making Titanium syntactic foams with varying relative densities. Precautions were taken for selecting cold compaction pressure to minimize cenosphere crushing. The sintered samples were then characterized in terms of microstructures primarily to see the extent of cenosphere crushing, distribution of cenosphere, and extent of sintering. The foams made using optimized pressure and sintering parameters, exhibits uniform distribution of cenosphere without any significant crushing. The plateau stress, energy absorption and modulus of these foams are varying with the cenosphere content or the relative density, and these parameters can be engineered by varying cenosphere content in the foam. These foams exhibit considerably higher strength and stiffness than the conventional foam and show the possibility of using them for biomedical and engineering applications.

Mixing Optimization of Sn-Cu-Si3N4 via Powder Metallurgy Route for Composite Solder Fabrication

2013 ◽  
Vol 594-595 ◽  
pp. 765-769
Author(s):  
Muhammad Hafiz Zan Hazizi ◽  
M.A.A. Mohd Salleh ◽  
Zainal Ariffin Ahmad
Keyword(s):  
Powder Metallurgy ◽  
Composite Solder ◽  
Horizontal Tube ◽  
Average Particle ◽  
Mixing Process ◽  
Mixed Powder ◽  
Particle Distributions ◽  
Imagej Software ◽  
Horizontal Tube Furnace ◽  
Powder Metallurgy Route

The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4were carefully weighted, mixed and blended in a mechanical alloying machine. The speed of rotation for the jar was kept constant while the time of mixing was varied. Si3N4were added to the Sn-0.7Cu solder as reinforcement. Upon completion of mixing process, the mixed powders were later compacted into a thin disc. The compacted samples were then sintered in a horizontal tube furnace. Microstructural examinations by using SEM were conducted in order to analyze the distribution of Cu and Si3N4particles. With the assistance of ImageJ software, average particle distributions were calculated. Results showed that the best particle distributions were achieved when the mixed powder were blended for 6 hours.

Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation

2011 ◽  
Author(s):  
J. Wei ◽  
Y. D. Han ◽  
H. Y. Jing ◽  
S. M. L. Nai ◽  
L. Y. Xu
Keyword(s):  
Carbon Nanotubes ◽  
Powder Metallurgy ◽  
Room Temperature ◽  
Composite Solder ◽  
Creep Behaviour ◽  
Maximum Load ◽  
Percentage Reduction ◽  
Coated Carbon ◽  
Nanocomposite Solder ◽  
Powder Metallurgy Route

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into Sn-Ag-Cu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and Sn-Ag-Cu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 mN to 100 mN increased the percentage reduction in creep strain rate from 4% to 28%, for the composite compared to its monolithic counterpart after 300 s of holding.

Effect of Compaction Pressure on Microstructure and Properties of Copper-Based Composite Prepared by Mechanical Alloying and Powder Metallurgy

2013 ◽  
Vol 795 ◽  
pp. 343-346 ◽  
Author(s):  
Y. Mahani ◽  
Zuhailawati Hussain
Keyword(s):  
Electrical Conductivity ◽  
Powder Metallurgy ◽  
Mechanical Alloying ◽  
Tungsten Carbide ◽  
Compaction Pressure ◽  
Microstructure And Properties ◽  
Carbide Composite ◽  
Tungsten Carbide Composite

In this study, copper-tungsten carbide composite was produced by mechanical alloying and powder metallurgy. The compaction pressures were varied from 100 to 600 MPa for observation on microstructure and properties of the composite. The result showed the microstructure was densified with the increased of compaction pressure. Within compaction pressure no fracturing was occurred. Increasing compaction pressure increased the density, hardness and electrical conductivity of the composite which related to the reduced of porosity area.

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