Stress Relaxation of Ion Exchanged Float Aluminosilicate Glass at Different Temperature

2013 ◽  
Vol 650 ◽  
pp. 216-219 ◽  
Author(s):  
Liang Bao Jiang ◽  
Xiao Yu Li ◽  
Xin Tao Guo ◽  
Lei Li ◽  
Guan Li Zhang ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Ion Exchange ◽  
Time Dependence ◽  
Relaxation Rate ◽  
Exponential Function ◽  
Annealing Time ◽  
Annealing Temperature ◽  
Subsequent Treatment ◽  
Aluminosilicate Glass ◽  
Stress Layer

The effect of the annealing temperature (390°C, 410 °Cand 430°C) on the stress relaxation of air side and tin side of ion exchanged glasses was investigated. The annealing time dependence of stress at different temperature can be well fitted by a second order exponential function. The stress relaxation rate on tin side is larger than air side at the ion exchange temperature (410°C) or below (390°C) but smaller above the ion exchange temperature (430°C). The depths of stress layer (DOL) of all ion exchanged glasses increase with the increasing of annealing time and the DOL on air side is always larger than tin side. These provide useful information for subsequent treatment of ion exchanged glasses.

Effect of annealing temperature on the stress-relaxation rate in Ti-6.5 at% Nb alloy crystals

1995 ◽  
Vol 148 (1) ◽  
pp. K9-K12 ◽  
Author(s):  
M. K. Akhtar ◽  
F. A. Khwaja ◽  
M. Z. Butt
Keyword(s):  
Stress Relaxation ◽  
Relaxation Rate ◽  
Annealing Temperature

Crystalline Recovery after Activation Annealing of Al Implanted 4H-SiC

2008 ◽  
Vol 600-603 ◽  
pp. 585-590
Author(s):  
Ryo Hattori ◽  
Tomokatsu Watanabe ◽  
T. Mitani ◽  
Hiroaki Sumitani ◽  
Tatsuo Oomori
Keyword(s):  
Ion Implantation ◽  
Time Dependence ◽  
Annealing Time ◽  
Annealing Temperature ◽  
Annealing Process ◽  
Recovery Mechanism ◽  
Poly Type ◽  
Scattering Centers ◽  
Activation Annealing ◽  
Type Recovery

Crystalline recovery mechanism in the activation annealing process of Al implanted 4H-SiC crystals were experimentally investigated. Annealing temperature and annealing time dependence of acceptor activation and activated hole’s behavior were examined. Poly-type recovery from the implantation induced lattice disordering during the annealing was investigated. The existence of meta-stable crystalline states for acceptor activation, and related scattering centers due to annealing is reported To achieve 100% acceptor activation and to reduce strain after ion implantation, annealing at 2000°C for 10 min. was required.

Correlation of fatigue behavior and dynamic mechanical properties of hybrid composites of polypropylene/short glass fibers/hollow glass beads

2021 ◽  
pp. 089270572199319
Author(s):  
Gustavo B Carvalho
Keyword(s):  
Stress Relaxation ◽  
Flexural Strength ◽  
Relaxation Rate ◽  
Hybrid Composites ◽  
Fatigue Behavior ◽  
Glass Fibers ◽  
Glass Beads ◽  
Hollow Glass ◽  
Dynamic Mechanical ◽  
Short Glass

Ternary hybrid composites of Polypropylene (PP)/Short Glass Fibers (GF)/Hollow Glass Beads (HGB) were prepared using untreated and aminosilane-treated HGB, compatibilized with maleated-PP, and with varying total and relative GF/HGB contents. Static/short-term flexural strength properties data revealed, through lower flexural strength values, that the presence of untreated HGB particles induces to fiber-polymer interfacial decoupling at much higher extent than in the presence of aminosilane-treated HGB particles. This phenomenon is also evident when evaluating the data from displacement-controlled three-point bending fatigue tests. Monitored up to 106 cycles, the analyzed hybrid composites presented distinct performance relative to their fatigue stress relaxation rate: the lower the matrix-reinforcements’ interfacial adhesion, more pronounced the stress relaxation rate as a function of the number of fatigue cycles. Dynamic Mechanical Thermal Analysis (DMTA) results could successfully reveal the hybrid composites behavior at the microstructural level when they were submitted to both static flexural test and fatigue, depending on the degree of interfacial interactions between the polymer matrix of PP and the hybrid reinforcements of GF and HGB (with and without aminosilane surface treatment).

The Effect of Crystallinity of Nanoporous WO3 on the Intercalation and Deintercalation of Li+

2014 ◽  
Vol 1024 ◽  
pp. 128-131
Author(s):  
Ehsan Ahmadi ◽  
Mustaffa Ali Azhar ◽  
Dede Miftahul Anwar ◽  
Monna Rozana ◽  
Zainovia Lockman
Keyword(s):  
Ion Exchange ◽  
Constant Temperature ◽  
Annealing Time ◽  
Octahedral Coordination ◽  
Degree Of Crystallinity ◽  
Nanoporous Structure

Nanoporous anodic WO3 was annealed at three different times of 1h, 2h, and 3h at a constant temperature of 500oC. This was to investigate the intercalation and deintercalation behaviour of Li+ in this annealed nanoporous oxide. The as-anodised WO3 is amorphous and after annealing, monoclinic WO3 was observed with much higher degree of crystallinity when the time of annealing was increased from 1h to 3h. By electrodiffusion of Li+ in the nanoporous structure, an ion exchange between fully oxidized states (W6+) which is the octahedral coordination dominates (WO6) and Li+ could happen. This causes changing of the colour of the yellowish WO3 to bluish WO3.Li2O. This work showed the effect of annealing time on intercalation of Li+ ion with WO3, however crystallinity can play a good role for electron movement, it cause a decrease in Li+ ion interaction with WO3.

About the Electrical Activation of 1×1020 cm-3 Ion Implanted Al in 4H-SiC at Annealing Temperatures in the Range 1500 - 1950°C

2018 ◽  
Vol 924 ◽  
pp. 333-338 ◽  
Author(s):  
Roberta Nipoti ◽  
Alberto Carnera ◽  
Giovanni Alfieri ◽  
Lukas Kranz
Keyword(s):  
Activation Energy ◽  
Sheet Resistance ◽  
Annealing Time ◽  
Thermal Activation ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Thermal Activation Energy ◽  
Electrical Activation ◽  
Temperature Range ◽  
Annealing Temperatures

The electrical activation of 1×1020cm-3implanted Al in 4H-SiC has been studied in the temperature range 1500 - 1950 °C by the analysis of the sheet resistance of the Al implanted layers, as measured at room temperature. The minimum annealing time for reaching stationary electrical at fixed annealing temperature has been found. The samples with stationary electrical activation have been used to estimate the thermal activation energy for the electrical activation of the implanted Al.

Natural glycyrrhizic acid: improving stress relaxation rate and glass transition temperature simultaneously in epoxy vitrimers

2021 ◽  
Author(s):  
Jianqiao Wu ◽  
Liang Gao ◽  
Zhongkai Guo ◽  
Hao Zhang ◽  
Baoyan Zhang ◽  
...  
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Stress Relaxation ◽  
Relaxation Rate ◽  
Thermal Performance ◽  
Glycyrrhizic Acid

Epoxy vitrimers based on transesterification reactions (TERs) is a kind of recyclable thermosets which have been developed prosperously in recent years. However, the good thermal performance and the quick network...

Effect of Homogenization Annealing on Wear Properties of Thixo-Extrued Copper Alloy

2022 ◽  
Vol 327 ◽  
pp. 71-81
Author(s):  
Yun Xin Cui ◽  
Han Xiao ◽  
Chi Xiong ◽  
Rong Feng Zhou ◽  
Zu Lai Li ◽  
...  
Keyword(s):  
Friction Factor ◽  
Annealing Time ◽  
Copper Alloy ◽  
Loss Rate ◽  
Annealing Temperature ◽  
Brinell Hardness ◽  
Annealing Process ◽  
Wear Properties ◽  
Wear Performance ◽  
Semi Solid

The semi-solid extruded CuSn10P1 alloy bushings were homogenization annealed. The effects of annealing process on the hardness and wear properties of bushings were researched. The results show the Brinell hardness increases firstly and then decreases with the increase of annealing temperature and annealing time. With the annealing temperature increasing, the grinding loss rate and friction factor decrease firstly and then increase. At the annealing time of 120 min, the grinding loss rate decreases from 7% at the annealing temperature of 450 °C to 6% at 500 °C, and then increases from 6% at 500 °C to 12% at 600 °C. The friction factor decreases from 0.54 to 0.48 and then increases to 0.83. At the annealing temperature of 500 °C, the grinding loss rate decreases from 11% at the annealing time of 60 min to 6% at 120 min, and then increases to 15% at 150 min. The friction factor decreases from 0.67 to 0.48 and then increases to 0.72. The best wear performance and Brinell hardness can be obtained at annealing temperature of 500 °C for 120 min.

First Paper: The Effect of Heat Treatment on the Ductility of Alloy Steel Wires in a Cold Heading Process

1969 ◽  
Vol 184 (1) ◽  
pp. 875-884 ◽  
Author(s):  
P. F. Thomason
Keyword(s):  
Heat Treatment ◽  
Annealing Time ◽  
Annealing Temperature ◽  
Steel Wire ◽  
Groove Depth ◽  
Air Cooling ◽  
Steel Wires ◽  
Fracture Crack ◽  
Different Types ◽  
Process Annealing

Longitudinal grooves of various depths ranging from 0.001 in to 0.011 in were machined on the cylindrical surface of steel slugs prior to carrying out an automatic two-stage transfer heading operation. The longitudinal grooves were used to estimate the ‘critical groove depth’, which was defined as the depth of longitudinal groove that contained a ductile fracture crack just on the point of ‘opening out’ at the end of the heading process, thus giving a measure of the ductility of the wire. A half-replicate of a two-level factorial experiment was carried out to assess the effects and interactions of annealing temperature, annealing time, cooling rate and ageing temperature on the ductility of four different types of 1/2 in diameter cold heading steel wire. The results show that certain types of steel wires have optimum ductility in the ‘as-received’, cold-drawn, state. Other types of steel are shown to respond favourably to process annealing treatments, in which case annealing at 700°C for 1 hour followed by air cooling should give optimum ductility. It is shown that there is no general correlation between decreasing hardness and increasing ductility for steel wire.

Study of Donor Centres in n-InSb due to the Temperature Annealing

2005 ◽  
Vol 480-481 ◽  
pp. 197-200
Author(s):  
Y. Sayad ◽  
A. Nouiri
Keyword(s):  
Experimental Data ◽  
Activation Energy ◽  
Annealing Time ◽  
Annealing Temperature ◽  
Theoretical Study ◽  
Donor Concentration ◽  
Model Based ◽  
Proposed Model ◽  
Kinetics Of ◽  
Best Fit

An increasing of donor centres has been detected in n-InSb when it was submitted to anneal/quench with various annealing temperature (450 °C - 850 °C) and various annealing time (5 - 100 hours). A theoretical study of the kinetics of the conduction conversion of n-InSb at temperature annealing above 250 °C has been made. The present analysis indicates that the donor concentration increases with increasing of annealing time. In order to study this variation and to give a model for donor centres generated, a proposed model based on the simple kinetic is used to fit the variation of donor concentration as a function of annealing time. However, from the best fit of experimental data using the proposed model, the activation energy is determined.

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