X-Ray Image Reconstruction of Solder Joints by Using Several Algebraic Reconstruction Techniques

2009 ◽  
Vol 419-420 ◽  
pp. 281-284
Author(s):  
Dein Shaw ◽  
Po Yen Hsu ◽  
Shih Liang Chen
Keyword(s):  
Image Reconstruction ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Reconstruction Technique ◽  
X Ray ◽  
Pcb Assembly ◽  
Reconstruction Quality ◽  
Algebraic Reconstruction Techniques ◽  
Algebraic Reconstruction

In this study, several Algebraic Reconstruction Technique (ART) algorithms are used to construct the 3 D sliced images from several transparent X-ray images. The speed and quality of image reconstruction are two important requirements when doing the inspection in a printed circuit board (PCB) assembly line. . To fulfill the requirements, several methodologies are discussed. The image qualities of regular ART method, binary ART method and Mixed ART method are developed and compared. The binary ART method uses the property of x-ray absorb rate of metal, silicon and other non- metal material are extremely different. The absorb rates of non-metal part are assumed to be zero and metal parts are assumed to be a single value. By using this method the quality of image reconstruction is improved. The mixed ART method is the combination of the tradition ART method and binary ART. Due to the X-ray sensor’s framing time, a method to improve the image reconstruction quality due to effect of X-ray sensor framing time is also discussed. Finally, the best solution algorithm is found to be mixed binary steering ART when consider the signal noise of X-ray detector.

Thermal Model of Printed Circuit Board Plated-Through Hole under One-Sided Heating Conditions

2021 ◽  
Vol 26 (5) ◽  
pp. 426-431
Author(s):  
V.A. Sergeev ◽  
◽  
A.M. Khodakov ◽  
M.Yu. Salnikov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Thermal Resistance ◽  
Thermal Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Thermal Models ◽  
Printed Circuit ◽  
Plated Through Hole ◽  
Through Hole

Thermal methods of quality control of the plated-through hole (PTH) of printed circuit board (PCB) are based on thermal models. However, known thermal models of PTH take no account of heat transfer to PCB material thus not allowing for PTH heat characteristic tying up with adhesion quality. In this work, an axisymmetric thermal model of a single-layer PCB PTH under one-sided heating conditions is considered. It was shown that the ratio of the temperature increments of the upper (heated) and lower end of the PTH in the considered range of heating power does not depend on the power level. A linear thermal equivalent scheme of the PTH has been proposed, which includes the longitudinal thermal resistance of the PTH metallization, de-termined by the parameters and quality of the metallization layer, the thermal resistance, which determines the convection heat exchange between the ends of the PTH with the adjacent PCB surface and the environment, and the thermal resistance of the area of the PCB material adjacent to the PTH, depending on the quality of the metallization adhesion and the PCB dielectric. Thermal equivalent circuit parameters determined by the ratio of the temperature increment of the upper and lower ends of the PTH and their difference can serve as the basis for the development of a nondestructive inspection procedure for PTH quality control by way of its unilateral heating, for example, by a laser beam.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals Three-dimensional propagation in near-field tomographic X-ray phase retrieval

2016 ◽  
Vol 72 (2) ◽  
pp. 215-221 ◽  
Author(s):  
Aike Ruhlandt ◽  
Tim Salditt
Keyword(s):  
Phase Retrieval ◽  
Near Field ◽  
Three Dimensional ◽  
Three Dimensions ◽  
Current Phase ◽  
Computationally Efficient ◽  
X Ray ◽  
Reconstruction Quality ◽  
Consistency Constraints

This paper presents an extension of phase retrieval algorithms for near-field X-ray (propagation) imaging to three dimensions, enhancing the quality of the reconstruction by exploiting previously unused three-dimensional consistency constraints. The approach is based on a novel three-dimensional propagator and is derived for the case of optically weak objects. It can be easily implemented in current phase retrieval architectures, is computationally efficient and reduces the need for restrictive prior assumptions, resulting in superior reconstruction quality.

Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000034-000038 ◽  
Author(s):  
Piers Tremlett ◽  
Phil Elliot ◽  
Pablo Tena
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Real Life ◽  
Circuit Board ◽  
Calibration Data ◽  
Engine Fuel ◽  
Sensors And Actuators ◽  
Pcb Assembly ◽  
Operational Life ◽  
Mems Technology

Printed circuit board (PCB) assemblies must fit into unusual spaces for many real-life, high temperature applications such as sensors and actuators. This paper details the design and manufacture of a complex control circuit for a jet engine fuel flow valve. “Origami” was needed to fit this control circuitry into the tight space in the valve, this was achieved using a high temperature flex rigid PCB assembly. The valve was mounted on a hot section of the engine, and the assembly was tested for its capability to operate at 178°C and withstand multiple thermal cycles of −55°C and 175°C during its operational life. Various component joining media were investigated to extend the life of the assembly. The project also developed a one-time programmable (OTP) memory aimed at up to 300°C operation for on board memory to provide calibration data or boot memory for high temperature microcontrollers or processors. The device was based on Micro-Electro-Mechanical Systems (MEMS) technology.

Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000818-000824
Author(s):  
John Torok ◽  
Shawn Canfield ◽  
Yuet-Ying Yu ◽  
Jiantao Zheng
Keyword(s):  
Form Factor ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Circuit Board ◽  
Bottom Surface ◽  
Mechanical Shock ◽  
Analysis And Evaluation ◽  
Pcb Assembly

Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package multiple modules on a single printed circuit board (PCB) assembly, PCB cross-sections and their corresponding physical properties (e.g., flatness, etc.) as well as module bottom surface metallurgy (BSM) co-planarity require a more detailed understanding of impacts to the compliant as well as the soldered connector interfaces. Lastly, the migration to lead (Pb)-free solders has further complicated the issue given both the change in material properties as well as processing temperatures. In this paper we will discuss the mechanical stress analysis and evaluation tests assessment of a recently developed 50 mm square organic processor module, hybrid LGA attached to a multiple site PCB. The analysis presented will highlight the methodology to identify both connector soldered stress and predicted contact load variation across the module's mated interface. Key parameters discuss will include the PCB flatness, Organic substrate BSM co-planarity (both predicted and measured) and the Hybrid LGA as-soldered contact co-planarity. Corroborating predicted analytical results, we will discuss various evaluation tests performed to validate the design's integrity. Key tests include, pressure sensitive film (PSF) studies and environment stress exposures, including thermal shock, mechanical shock and vibration and seismic exposure. Post test electrical integrity and test sample construction analysis, including 3D x-ray and mechanical cross-section, will also be described. The analysis process and testing described will provide a method to evaluate more challenging hybrid LGA applications as both module sizes and/or number applied per PCB assembly increase and Pb-free assembly is introduced in future applications.

Evaluation of three-dimensional iterative image reconstruction in virtual monochromatic imaging at 40 kilo-electron volts: phantom and clinical studies to assess the image noise and image quality in comparison with other reconstruction techniques

2020 ◽  
Vol 93 (1110) ◽  
pp. 20190675
Author(s):  
Takuya Ishikawa ◽  
Shigeru Suzuki ◽  
Yoshiaki Katada ◽  
Tomoko Takayanagi ◽  
Rika Fukui ◽  
...  
Keyword(s):  
Clinical Study ◽  
Image Reconstruction ◽  
Image Quality ◽  
Three Dimensional ◽  
Image Noise ◽  
Reconstruction Technique ◽  
Iterative Image Reconstruction ◽  
Virtual Monochromatic Imaging ◽  
Monochromatic Imaging

Objective: The purpose of this study was to evaluate the image quality in virtual monochromatic imaging (VMI) at 40 kilo-electron volts (keV) with three-dimensional iterative image reconstruction (3D-IIR). Methods: A phantom study and clinical study (31 patients) were performed with dual-energy CT (DECT). VMI at 40 keV was obtained and the images were reconstructed using filtered back projection (FBP), 50% adaptive statistical iterative reconstruction (ASiR), and 3D-IIR. We conducted subjective and objective evaluations of the image quality with each reconstruction technique. Results: The image contrast-to-noise ratio and image noise in both the clinical and phantom studies were significantly better with 3D-IIR than with 50% ASiR, and with 50% ASiR than with FBP (all, p < 0.05). The standard deviation and noise power spectra of the reconstructed images decreased in the order of 3D-IIR to 50% ASiR to FBP, while the modulation transfer function was maintained across the three reconstruction techniques. In most subjective evaluations in the clinical study, the image quality was significantly better with 3D-IIR than with 50% ASiR, and with 50% ASiR than with FBP (all, p < 0.001). Regarding the diagnostic acceptability, all images using 3D-IIR were evaluated as being fully or probably acceptable. Conclusions: The quality of VMI at 40 keV is improved by 3D-IIR, which allows the image noise to be reduced and structural details to be maintained. Advances in knowledge: The improvement of the image quality of VMI at 40 keV by 3D-IIR may increase the subjective acceptance in the clinical setting.

Registration of the rotation axis in X-ray tomography

2015 ◽  
Vol 22 (2) ◽  
pp. 452-457 ◽  
Author(s):  
Yimeng Yang ◽  
Feifei Yang ◽  
Ferdinand F. Hingerl ◽  
Xianghui Xiao ◽  
Yijin Liu ◽  
...  
Keyword(s):  
Rotation Axis ◽  
Signal To Noise Ratio ◽  
Geological Samples ◽  
Signal To Noise ◽  
High Demand ◽  
X Ray ◽  
Data Registration ◽  
Reconstruction Quality ◽  
Tomographic Data

There is high demand for efficient, robust and automated routines for tomographic data reduction, particularly for synchrotron data. Registration of the rotation axis in data processing is a critical step affecting the quality of the reconstruction and is not easily implemented with automation. Existing methods for calculating the center of rotation have been reviewed and an improved algorithm to register the rotation axis in tomographic data is presented. The performance of the proposed method is evaluated using synchrotron-based microtomography data on geological samples with and without artificial reduction of the signal-to-noise ratio. The proposed method improves the reconstruction quality by correcting both the tilting error and the translational offset of the rotation axis. The limitation of this promising method is also discussed.

Modeling of Errors Counting System for PCB Soldered in the Wave Soldering Technology

2014 ◽  
Vol 874 ◽  
pp. 139-143 ◽  
Author(s):  
Jacek Pietraszek ◽  
Aneta Gądek-Moszczak ◽  
Tomasz Toruński
Keyword(s):  
Quality Assurance ◽  
Experimental Design ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Counting System ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Wave Soldering ◽  
Soldering Technology ◽  
Through Hole

PartnerTech provides printed circuit board (PCB) assembly on request. Wired elements are assembled in through-hole technology and soldered on the wave soldering machine. The PCB with inserted elements is passed across the pumped wave of melted solder. Typically this process is accompanied by some class of defects like cracks, cavities, wrong solder thickness and poor conductor. In PartnerTech Ltd. another type of defects was observed: dispersion of small droplets of solder around holes. Quality assurance department plans to optimize the process in order to reduce the number of defects. In the first stage, it was necessary to develop a methodology for counting defects. This paper presents experimental design and analysis related to this project.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

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