High Dose Al+ Implanted and Microwave Annealed 4H-SiC

2012 ◽  
Vol 717-720 ◽  
pp. 817-820
Author(s):  
Roberta Nipoti ◽  
A. Nath ◽  
Mulpuri V. Rao ◽  
Anders Hallén ◽  
F. Mancarella ◽  
...  
Keyword(s):  
Room Temperature ◽  
Electrical Activation ◽  
High Dose ◽  
Annealing Temperatures ◽  
Microwave Annealing ◽  
Post Implantation

A post implantation microwave annealing technique has been applied for the electrical activation of Al+ implanted ions in semi-insulating 4H-SiC. The annealing temperatures have been 2000-2100°C. The implanted Al concentration has varied from 5 x 1019 to 8 x 1020 cm-3. A minimum resistivity of 2 x 10-2 Ω∙cm and about 70% electrical activation of the implanted Al has been measured at room temperature for an implanted Al concentration of 8 x 1020 cm-3 and a microwave annealing at 2100°C for 30 s.

About the Electrical Activation of 1×1020 cm-3 Ion Implanted Al in 4H-SiC at Annealing Temperatures in the Range 1500 - 1950°C

2018 ◽  
Vol 924 ◽  
pp. 333-338 ◽  
Author(s):  
Roberta Nipoti ◽  
Alberto Carnera ◽  
Giovanni Alfieri ◽  
Lukas Kranz
Keyword(s):  
Activation Energy ◽  
Sheet Resistance ◽  
Annealing Time ◽  
Thermal Activation ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Thermal Activation Energy ◽  
Electrical Activation ◽  
Temperature Range ◽  
Annealing Temperatures

The electrical activation of 1×1020cm-3implanted Al in 4H-SiC has been studied in the temperature range 1500 - 1950 °C by the analysis of the sheet resistance of the Al implanted layers, as measured at room temperature. The minimum annealing time for reaching stationary electrical at fixed annealing temperature has been found. The samples with stationary electrical activation have been used to estimate the thermal activation energy for the electrical activation of the implanted Al.

Ion Implanted p+/n Diodes: Post-Implantation Annealing in a Silane Ambient in a Cold-Wall Low-Pressure CVD Reactor

2006 ◽  
Vol 527-529 ◽  
pp. 819-822
Author(s):  
Fabio Bergamini ◽  
Shailaja P. Rao ◽  
Antonella Poggi ◽  
Fabrizio Tamarri ◽  
Stephen E. Saddow ◽  
...  
Keyword(s):  
Room Temperature ◽  
Annealing Temperature ◽  
Low Pressure ◽  
Cold Wall ◽  
Current Voltage Characteristic ◽  
Process Yield ◽  
Annealing Temperatures ◽  
Current Voltage ◽  
Post Implantation

This work reports the realization and characterization of 4H-SiC p+/n diodes with the p+ anodes made by Al+ ion implantation at 400°C and post-implantation annealing in silane ambient in a cold-wall low-pressure CVD reactor. The Al depth profile was almost box shaped with a height of 6×1019 cm-3 and a depth of 160 nm. Implant anneals were performed in the temperature range from 1600°C to 1700°C. As the annealing temperature was increased, the silane flow rate was also increased. This annealing process yields a smooth surface with a roughness of the implanted area of 1.7 - 5.3 nm with increasing annealing temperature. The resistivity of the implanted layer, measured at room temperature, decreased for increasing annealing temperatures with a minimum value of 1.4 0-cm measured for the sample annealed at 1700°C. Considering only the current-voltage characteristic of a diode that could be modeled as an abrupt p/n junction within the frame of the Shockley theory, the diode process yield and the diode leakage current decreased, respectively, from 93% to 47% and from 2×10-7 Acm-2 to 1×10-8 Acm-2 at 100 V reverse bias, for increasing post implantation annealing temperature.

Modeling and Simulation of Electrical Activation of Acceptor-Type Dopants in Silicon Carbide

2018 ◽  
Vol 924 ◽  
pp. 192-195 ◽  
Author(s):  
Vito Šimonka ◽  
Andreas Hössinger ◽  
Josef Weinbub ◽  
Siegfried Selberherr
Keyword(s):  
Silicon Carbide ◽  
Process Simulation ◽  
Electrical Activation ◽  
Depth Profiles ◽  
Annealing Temperatures ◽  
Experimental Findings ◽  
P Type ◽  
Process Simulator ◽  
Post Implantation ◽  
Activation Behavior

We propose an empirical model to predict electrical activation ratios of aluminium- and boron-implanted silicon carbide with respect to various annealing temperatures. The obtained parameters and model extensions are implemented into Silvaco’s Victory Process simulator to enable accurate predictions of post-implantation process steps. The thus augmented simulator is used for numerous simulations to evaluate the activation behavior of p-type dopants as well as for the full process simulation of a pn-junction SiC diode to extract the carrier and acceptor depth profiles and compare the results with experimental findings.

Activation Energy for the Post Implantation Annealing of 1019 cm-3 and 1020 cm-3 Ion Implanted Al in 4H SiC

2019 ◽  
Vol 963 ◽  
pp. 416-419
Author(s):  
Roberta Nipoti ◽  
Maria Concetta Canino ◽  
Sergio Sapienza ◽  
Michele Bellettato ◽  
Giovanna Sozzi ◽  
...  
Keyword(s):  
Activation Energy ◽  
Annealing Temperature ◽  
Activation Energies ◽  
Electrical Activation ◽  
Substitutional Site ◽  
Annealing Temperatures ◽  
Implantation Temperature ◽  
Exponential Trend ◽  
Post Implantation ◽  
Ion Implanted

The activation energy for the electrical activation of 1x1019 cm-3 and of 1x1020 cm-3 ion implanted Al in 4H-SiC has been estimated. Ion implantation temperature and dose rate were in the range 430-500°C and around 1011 cm2s-1, respectively. Post implantation annealing temperatures varied between 1500 °C and 1950 °C. The annealing time per each annealing temperature was sufficiently long that the sheet resistance of the implanted layer could be equal to the stationary value at the applied annealing temperature. The Arrhenius plots of the room temperature sheet resistances with respect to the post implantation annealing temperatures featured an exponential trend for both the implanted Al concentrations. The activation energies of these plots are the activation energy for placing an implanted Al atom in a substitutional site, i.e. the electrical activation energy. Activation energies around 1 eV, equal within errors for the two implanted Al concentrations, were found.

Depth Profiling of SiC Lattice Damage Using Micro-Raman Spectroscopy

2001 ◽  
Vol 692 ◽  
Author(s):  
Iulia C. Muntele ◽  
Daryush Ila ◽  
Claudiu I. Muntele ◽  
David B. Poker ◽  
Dale K. Hensley
Keyword(s):  
Damage Evolution ◽  
Room Temperature ◽  
Depth Profiling ◽  
Annealing Temperatures ◽  
Absorption Spectrophotometry ◽  
Micro Raman Spectroscopy ◽  
Probing Depth ◽  
Lattice Damage ◽  
Silicon Islands ◽  
Post Implantation

AbstractDepth profiling for the amount of lattice damage using a Confocal Micro-Raman (CMR) spectrometer is demonstrated in this paper. Samples of n-type silicon carbide were implanted with 2 MeV He and O ions at both room temperature and 500 °C, and fluences between 1015 and 1017 ions/cm2. Post-implantation annealing at 1000 °C was also performed in order to study the damage evolution. Optical Absorption Spectrophotometry (OAS) was used for establishing the opacity (and therefore the probing depth) of the damaged layer to the 632.8 nm wavelength of the He-Ne laser used for CMR throughout this study. The methodology used and the results obtained are presented herein. Total dissipation of amorphous carbon islands was observed even at low annealing temperatures of the RT implanted samples, along with an increase in the size of the amorphous silicon islands.

Structural Changes of UHV Deposited Titanium Thin Films in Presence of Oxygen Flow and Temperature

2011 ◽  
Vol 110-116 ◽  
pp. 1094-1098
Author(s):  
Haleh Kangarlou ◽  
Mehdi Bahrami Gharahasanloo ◽  
Akbar Abdi Saray ◽  
Reza Mohammadi Gharabagh
Keyword(s):  
Room Temperature ◽  
Structural Changes ◽  
Annealing Temperature ◽  
Annealing Process ◽  
Oxygen Flow ◽  
Glass Substrates ◽  
Annealing Temperatures ◽  
Titanium Thin Films ◽  
Deposition Angle ◽  
Ti Films

Ti films of same thickness, and near normal deposition angle, and same deposition rate were deposited on glass substrates, at room temperature, under UHV conditions. Different annealing temperatures as 393K, 493K and 593K with uniform 8 cm3/sec, oxygen flow, were used for producing titanium oxide layers. Their nanostructures were determined by AFM and XRD methods. Roughness of the films changed due to annealing process. The gettering property of Ti and annealing temperature can play an important role in the nanostructure of the films.

A New Hafnium-Beryllium System Prioduced by Ion Implantation and Annealing Techniques

1983 ◽  
Vol 27 ◽  
Author(s):  
J.C. Soares ◽  
A.A. Melo ◽  
M.F. DA Silva ◽  
E.J. Alves ◽  
K. Freitag ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Single Crystals ◽  
Room Temperature ◽  
Low Dose ◽  
Correlation Method ◽  
High Dose ◽  
Tetrahedral Sites ◽  
Time Differential ◽  
Before And After ◽  
Beryllium Foil

ABSTRACTLow and high dose hafnium imolanted beryllium samoles have been prepared at room temperature by ion implantation of beryllium commercial foils and single crystals. These samples have been studied before and after annealing with the time differential perturbed angular correlation method (TDPAC) and with Rutherford backscattering and channeling techniques. A new metastable system has been discovered in TDPAC-measurements in a low dose hafnium implanted beryllium foil annealed at 500°C. Channeling measurements show that the hafnium atoms after annealing, are in the regular tetrahedral sites but dislocated from the previous position occupied after implantation. The formation of this system is connected with the redistribution of oxygen in a thin layer under the surface. This effect does not take place precisely at the same temperature in foils and in single crystals.

Continuum modeling of post-implantation damage and the effective plus factor in crystalline silicon at room temperature

2006 ◽  
Vol 504 (1-2) ◽  
pp. 269-273
Author(s):  
H.Y. Chan ◽  
M.P. Srinivasan ◽  
F. Benistant ◽  
K.R. Mok ◽  
Lap Chan ◽  
...  
Keyword(s):  
Room Temperature ◽  
Crystalline Silicon ◽  
Continuum Modeling ◽  
Implantation Damage ◽  
Post Implantation

Interaction of Copper Film with Silicides

1990 ◽  
Vol 181 ◽  
Author(s):  
Yow-Tzong Shy ◽  
Shyam P. Murarka ◽  
Carlton L. Shepard ◽  
William A. Lanford
Keyword(s):  
Sheet Resistance ◽  
Diffusion Barrier ◽  
Room Temperature ◽  
Copper Film ◽  
Furnace Annealing ◽  
Rutherford Back Scattering ◽  
Annealing Temperatures ◽  
Back Scattering ◽  
The Stability ◽  
Stable Structures

ABSTRACTBilayers of Cu with TiSi2 and TaSi2 were tested by furnace annealing at temperatures from 200 to 500°C. Rutherford Back Scattering (RBS) technique was used to investigate the interaction between various films and determine the stability of Cu on silicide structures. The sheet resistance was also monitored. The results show that Cu on TiSi2 and TaSi2 structures are extremely stable structures at annealing temperatures in the range of room temperature to 500 °C. In such structures, therefore, there will not be a need of any diffusion barrier between Cu and the silicide films.

Electrical and Structural Properties of Al-Implanted and Annealed 4H-SiC

2007 ◽  
Vol 556-557 ◽  
pp. 343-346 ◽  
Author(s):  
M. Obernhofer ◽  
Michael Krieger ◽  
Frank Schmid ◽  
Heiko B. Weber ◽  
Gerhard Pensl ◽  
...  
Keyword(s):  
Hall Effect ◽  
Structural Properties ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Rutherford Backscattering ◽  
Electrical Activation ◽  
Implantation Damage ◽  
Aluminum Ions

Aluminum ions (Al+) were implanted at room temperature or at 500°C into n-type 4HSiC. The implantation damage (displaced Si atoms) and the electrical activation of Al+ ions (concentration of Al acceptors) were determined by Rutherford backscattering in channeling mode and Hall effect, respectively, as a function of the annealing temperature.

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