Optical Transmission of p-Type a-Si:H Thin Film Deposited by PECVD on ITO-Coated Glass

2019 ◽  
Vol 966 ◽  
pp. 72-76
Author(s):  
Soni Prayogi ◽  
Malik Anjelh Baqiya ◽  
Yoyok Cahyono ◽  
Darminto
Keyword(s):  
Thin Film ◽  
Indium Tin Oxide ◽  
Transmission Spectrum ◽  
Chemical Vapor ◽  
Type A ◽  
Deposition Process ◽  
Atomic Force ◽  
Frequency Plasma ◽  
Large Period ◽  
P Type

A p-type thin film of hydrogenated amporphous silicon (a-Si:H) has successfully been fabricated by radio frequency-plasma enhanced chemical vapor deposition (RF-PECVD) technique. Substrate used in the deposition process is indium tin oxide (ITO) layer coated having size of 10 x10 cm2 and being cleaned with 97% alcohol using ultrasonic bath. According to Atomic Force Microscope (AFM) observation, the layer thickness of p-type a-Si: H film was 150 nm. The Transmission spectrum at room temperature obtained from UV-Vis measurement demonstrates a large period modulation, which is due to the interference within the film. At wavelength longer than 1000 nm (or energy <1 eV), the interference modulation in the transmission spectrum of the film is seen to broaden. It is shown in a zoomed - scale around the related band gap area that one may find an exciton structure.

scholarly journals The Effect of Increased Methane Flow Rate on Electronic Correlation of Amorphous Silicon Carbon (a-SiC: H)

2021 ◽  
Author(s):  
soni Prayogi ◽  
Ayunis Sholehah ◽  
Yoyok Cahyono ◽  
Darminto D
Keyword(s):  
Refractive Index ◽  
Flow Rate ◽  
Indium Tin Oxide ◽  
Complex Refractive Index ◽  
Chemical Vapor ◽  
Type A ◽  
Electronic Correlation ◽  
Type Layer ◽  
P Type ◽  
Methane Flow

Abstract In this study, we report for the first time that the addition of methane (CH4) flow rate in the p-type a-SiC: H layer greatly affects the electronic correlation in increasing the conversion efficiency of solar cells. The a-SiC: H p-type layer was grown using Plasma Enhanced Chemical Vapor Deposition (PECVD) on Indium Tin Oxide (ITO) substrate with various methane flow rates. The a-SiC: H p-type layer was characterized including the complex dielectric properties and the complex refractive index using Ellipsometric Spectroscopy (ES), while the surface roughness morphology was used Atomic Force Microscopy (AFM). In sample P-2 there is a change in the form of a decrease in the value of the refractive index < n > and the E0 energy in the lower energy compared to the P-1 sample with a change of 0.3 eV, an increase in the optical gap and a decrease in the value of the real and imaginary dielectric function. While the influence of an increase in the carbon composition of the amorphous network order shows the addition of amorphous tissue disorder. Our results, show that the optical magnitude of the p-type a-SiC: H layer is not only affected by the amount of carbon in the film but also the hydrogen which is thought to contribute.

Effect of Gas Dilution Ratios and Substrate Temperature on the Structural Transition of a-Si/μc-Si Thin-Film Solar Cell Using PECVD

2018 ◽  
Vol 786 ◽  
pp. 373-383
Author(s):  
Heba R. Abd El-Aaty ◽  
Osama Tobail ◽  
Madiha A. Shoeib ◽  
Iman El-Mahallawi
Keyword(s):  
Thin Film ◽  
Substrate Temperature ◽  
Indium Tin Oxide ◽  
Structural Transition ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Force Microscopy ◽  
Atomic Force ◽  
Ito Glass ◽  
Gas Dilution

Thin films of mixed amorphous/ microcrystalline-phases have been researched during the last decade, for manufacturing silicon solar cells. In this work the Plasma Enhanced Chemical Vapor Deposition PECVD process parameters; namely dilution ratios and substrate temperature, were controlled to build i-layer at low dilution ratios with moderate substrate temperatures. In this work an intrinsic layer was deposited on Indium Tin Oxide ITO glass by PECVD technique, with different dilution ratios of silane in hydrogen to study the transition from amorphous to microcrystalline phase. The Si:H thin film was evaluated by field emission scanning electron microscopy, x-ray diffraction and atomic force microscopy. The structural transition between a-Si:H to μc-Si:H achieved at dilution ratio 13.3 and substrate temperature 250°C with surface roughness 22.5 nm.

Reaction couples of ceramic thin films prepared by CVD

1988 ◽  
Vol 46 ◽  
pp. 798-799
Author(s):  
D.W. Susnitzky ◽  
S.R. Summerfelt ◽  
C.B. Carter
Keyword(s):  
Thin Film ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Solid State Reactions ◽  
Spatial Distributions ◽  
Diffusion Couples ◽  
Kinetics Studies ◽  
Ceramic Thin Films ◽  
Initial Stage

Solid-state reactions have traditionally been studied in the form of diffusion couples. This ‘bulk’ approach has been modified, for the specific case of the reaction between NiO and Al2O3, by growing NiAl2O4 (spinel) from electron-transparent Al2O3 TEM foils which had been exposed to NiO vapor at 1415°C. This latter ‘thin-film’ approach has been used to characterize the initial stage of spinel formation and to produce clean phase boundaries since further TEM preparation is not required after the reaction is completed. The present study demonstrates that chemical-vapor deposition (CVD) can be used to deposit NiO particles, with controlled size and spatial distributions, onto Al2O3 TEM specimens. Chemical reactions do not occur during the deposition process, since CVD is a relatively low-temperature technique, and thus the NiO-Al2O3 interface can be characterized. Moreover, a series of annealing treatments can be performed on the same sample which allows both Ni0-NiAl2O4 and NiAl2O4-Al2O3 interfaces to be characterized and which therefore makes this technique amenable to kinetics studies of thin-film reactions.

scholarly journals CVD and PVD coating process modelling by using artificial neural networks

2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos
Keyword(s):  
Thin Film ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Film Coating ◽  
Deposition Process ◽  
Thin Film Coating ◽  
Mlp Neural Network ◽  
Titanium Thin Film ◽  
Pvd Coating

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.

DEPOSITION OF WIDE BAND GAP DLC FILMS USING R.F. PECVD AT VERY LOW POWER

2011 ◽  
Vol 25 (29) ◽  
pp. 3941-3949 ◽  
Author(s):  
P. K. BARHAI ◽  
RISHI SHARMA ◽  
B. B. NAYAK
Keyword(s):  
Band Gap ◽  
Chemical Vapor ◽  
Wide Band ◽  
Carbon Films ◽  
Wide Band Gap ◽  
Force Microscopy ◽  
Atomic Force ◽  
Frequency Plasma ◽  
Bending Modes ◽  
Deposited Films

Wide band gap diamond-like carbon films (DLCs) are deposited on silicon (1 0 0) substrates using capacitive coupled radio frequency plasma-enhanced chemical vapor deposition (R.F. PECVD) technique. The deposition of films is carried out at a constant pressure (~5×10-2 mbar ) using acetylene precursor diluted with argon at constant R.F. power of 5 W. Raman spectroscopy of deposited DLC films shows broad G peak near 1550 cm-1 and a weak D peak near 1320 cm1. FTIR plot of DLC films shows a peak near 2900 cm-1 corresponding to C–H stretching mode and peaks below 2000 cm-1 corresponding to C–C modes and C–H bending modes. Maximum hardness of the deposited films is found to be ~15 GPa. Band gap of the DLC films is ~3.5 eV. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) pictures show that the deposited films are amorphous. Deposition mechanism of wide band gap DLC film is explained on the basis of subplantation model.

Transparent Conducting Indium-Tin-Oxide Thin Film with Extremely Flatted Surface

2001 ◽  
Vol 666 ◽  
Author(s):  
Hiromichi Ohta ◽  
Masahiro Orita ◽  
Masahiro Hirano ◽  
Hideo Hosono
Keyword(s):  
Thin Film ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Film Growth ◽  
Oxide Thin Film ◽  
Force Microscopy ◽  
Atomic Force ◽  
Out Of Plane ◽  
Key Factor ◽  
Surface Microstructures

ABSTRACTIndium-tin-oxide films were grown hetero-epitaxially on YSZ surface at a substrate temperature of 900 °C, and their surface microstructures were observed by using atomic force microscopy. ITO films grown on (111) surface of YSZ exhibited very high crystal quality; full width at half maximum of out-of-plane rocking curve was 54 second. The ITO was grown spirally, with flat terraces and steps corresponding to (222) plane spacing of 0.29 nm. Oxygen pressure during film growth is another key factor to obtain atomically flat surfaced ITO thin film.

Metalorganic Deposition (MOD): A Nonvacuum, Spin-on, Liquid-Based, Thin Film Method

MRS Bulletin ◽  
1989 ◽  
Vol 14 (10) ◽  
pp. 48-53 ◽  
Author(s):  
J.V. Mantese ◽  
A.L. Micheli ◽  
A.H. Hamdi ◽  
R.W. Vest
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Substrate Surface ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Organic Precursor ◽  
Metalorganic Deposition ◽  
Constituent Elements ◽  
Film Method

There are many methods of depositing thin film materials: thermal evaporation, sputtering, electron or laser beam evaporation, chemical vapor deposition (CVD), and molecular beam epitaxy (MBE). A good survey of many of the deposition methods appears in the 1988 November and December issues of the MRS BULLETIN. One method not included in that survey, however, is metalorganic deposition (MOD), a powerful method for depositing a variety of materials.Metalorganic deposition is not to be confused with metalorganic chemical vapor deposition (MOCVD), which is a gaseous deposition method. MOD is a nonvacuum, liquid-based, spin-on method of depositing thin films. A suitable organic precursor, dissolved in solution, is dispensed onto a substrate much like photoresist. The substrate is spun at a few thousand revolutions per minute, removing the excess fluid, driving off the solvent, and uniformly coating the substrate surface with an organic film a few microns thick. The soft metalorganic film is then pyrolyzed in air, oxygen, nitrogen, or other suitable atmosphere to convert the metalorganic precursors to their constituent elements, oxides, or other compounds. Figure 1 shows a schematic of the deposition process including a prebake and annealing (if necessary).

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