Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs

Author(s):  
Tunir Dey ◽  
Kazunari Koga ◽  
Humair Mandavia

As design complexity increases with 3DICs and time-to-market becomes a critical component in the automotive, wearables and IoT segments, reducing design cycle time while maintaining accuracy of analysis has become all the more important. To address this, a system level co-design approach in step with multi-physics analysis is presented. To mitigate errors due to manual exchange of data between various engineering teams spread across chip, package and board with design and analysis adding further level of exchange, a design flow incorporating simplification at the layout level is shown. The flow enables various levels of simplified models to be used, wherein data transfer between the complex 3D structures in layout to the thermal analysis tool is automated. The efficacy of the model simplification is verified through a test case showing comparable results for the simplified and full models.

Author(s):  
Kartika S

High level language termed as SystemC language is recently gaining popularity in VLSI industries especially in Hardware-Software co-design. Using SystemC, Hardware IPs can be modeled at system level which helps to reduce the time to market for SOCs. In most applications SystemC is utilized to verify functionality of the design. However there has been relatively less work done on the synthesis of equivalent hardware from SystemC. In this paper, Finite Impulse Response Filter and Greatest Common divisor are designed as examples in SystemC language and their corresponding synthesis flow from SystemC to FPGA is proposed. The proposed method of synthesis would be time saving than the conventional design and synthesis using HDL in RTL perspective.


2011 ◽  
Vol 134 (1) ◽  
Author(s):  
Andreas Peters ◽  
Zoltán S. Spakovszky

Due to their inherent noise challenge and potential for significant reductions in fuel burn, counter-rotating propfans (CRPs) are currently being investigated as potential alternatives to high-bypass turbofan engines. This paper introduces an integrated noise and performance assessment methodology for advanced propfan powered aircraft configurations. The approach is based on first principles and combines a coupled aircraft and propulsion system mission and performance analysis tool with 3D unsteady, full-wheel CRP computational fluid dynamics computations and aeroacoustic simulations. Special emphasis is put on computing CRP noise due to interaction tones. The method is capable of dealing with parametric studies and exploring noise reduction technologies. An aircraft performance, weight and balance, and mission analysis was first conducted on a candidate CRP powered aircraft configuration. Guided by data available in the literature, a detailed aerodynamic design of a pusher CRP was carried out. Full-wheel unsteady 3D Reynolds-averaged Navier-Stokes (RANS) simulations were then used to determine the time varying blade surface pressures and unsteady flow features necessary to define the acoustic source terms. A frequency domain approach based on Goldstein’s formulation of the acoustic analogy for moving media and Hanson’s single rotor noise method was extended to counter-rotating configurations. The far field noise predictions were compared to measured data of a similar CRP configuration and demonstrated good agreement between the computed and measured interaction tones. The underlying noise mechanisms have previously been described in literature but, to the authors’ knowledge, this is the first time that the individual contributions of front-rotor wake interaction, aft-rotor upstream influence, hub-endwall secondary flows, and front-rotor tip-vortices to interaction tone noise are dissected and quantified. Based on this investigation, the CRP was redesigned for reduced noise incorporating a clipped rear-rotor and increased rotor-rotor spacing to reduce upstream influence, tip-vortex, and wake interaction effects. Maintaining the thrust and propulsive efficiency at takeoff conditions, the noise was calculated for both designs. At the interaction tone frequencies, the redesigned CRP demonstrated an average reduction of 7.25 dB in mean sound pressure level computed over the forward and aft polar angle arcs. On the engine/aircraft system level, the redesigned CRP demonstrated a reduction of 9.2 dB in effective perceived noise (EPNdB) and 8.6 EPNdB at the Federal Aviation Regulations (FAR) 36 flyover and sideline observer locations, respectively. The results suggest that advanced open rotor designs can possibly meet Stage 4 noise requirements.


2008 ◽  
Vol 1102 ◽  
Author(s):  
Terry J Hendricks ◽  
Naveen K. Karri

AbstractAdvanced, direct thermal energy conversion technologies are receiving increased research attention in order to recover waste thermal energy in advanced vehicles and industrial processes. Advanced thermoelectric (TE) systems necessarily require integrated system-level analyses to establish accurate optimum system designs. Past system-level design and analysis has relied on well-defined deterministic input parameters even though many critically important environmental and system design parameters in the above mentioned applications are often randomly variable, sometimes according to complex relationships, rather than discrete, well-known deterministic variables. This work describes new research and development creating techniques and capabilities for probabilistic design and analysis of advanced TE power generation systems to quantify the effects of randomly uncertain design inputs in determining more robust optimum TE system designs and expected outputs. Selected case studies involving stochastic TE .material properties demonstrate key stochastic material impacts on power, optimum TE area, specific power, and power flux in the TE design optimization process. Magnitudes and directions of these design modifications are quantified for selected TE system design analysis cases.


Author(s):  
N. Gupta ◽  
D. Saini ◽  
H. Saini

Object-oriented programming consists of several different levels of abstraction, namely, the algorithmic level, class level, cluster level, and system level. In this article, we discuss a testing technique to generate test cases at class level for object-oriented programs. The formal object oriented class specification is used to develop a test model. This test model is based on finite state machine specification. The class specification and the test model is analyzed to select a set of test data for each method of the class, and finally the test cases can be generated using other testing techniques like finite-state testing or data-flow testing.


2019 ◽  
Vol 2019 (1) ◽  
pp. 000284-000288
Author(s):  
Bill Acito ◽  

Abstract Just as we transitioned from simplistic lead frames to large ball grid arrays decades ago, we find ourselves again at another inflection point in design. Originally a derivative of PCB design, IC package design finds itself straddling both PCB-style design and traditional IC design. Dimensions have shrunk to place IC package design squarely in the same design dimensions as integrated circuits. Likewise, with Moore's law rapidly losing steam to support SoC's as a system integration vehicle, advanced package technologies have been asked to fill the system enablement gap. We now see advanced packaging technologies with silicon content as the system enabler in 2.5D, 3D and fanout wafer-level packaging. Because of the silicon and small geometries, IC design flows and signoff mechanisms are being used to design the next-generation of packaged systems. Package design now finds itself in the forefront of system-level design enablement. Where once system aggregation was done in a SoC at the silicon level, packaging is being used to build a system from technology-optimized die from each functional area (memory, processing, and interfaces). Silicon is no longer just a substrate material for IC manufacturing but a “package” substrate and functional integration vehicle. As such, package design teams find themselves adding IC-based design flows and methodologies. Package designers must look to the IC tools for routing, DRC, and signoff capabilities. Designers are looking for next-generation EDA tools to support these new integration and design challenges, including LVS-like validation checks and IC-based design rules. Rather than transitioning the design team from traditional packaging tools to IC tools entirely, we propose that users can leverage complete design flows that merge the best-in-class capabilities from each of their respective design domains. Is this regard, the best-in-class capabilities can remain in their respective domains, and a design flow can be created that relies on tight integration between both domains. These flows can also leverage a single point of entry for design capture and system level management. Flows based on the system management tool and the appropriate features in each of the domains can be created that enable and optimize complex designs that meet physical, signal integrity, cost and performance requirements. We will describe how capabilities can be leveraged from both domains in a tightly coupled flow, overseen by a design system-management tool, to address the challenges of advanced-technology and silicon-based system.


Ocean Science ◽  
2019 ◽  
Vol 15 (2) ◽  
pp. 291-305
Author(s):  
Luc Vandenbulcke ◽  
Alexander Barth

Abstract. Traditionally, in order for lower-resolution, global- or basin-scale (regional) models to benefit from some of the improvements available in higher-resolution subregional or coastal models, two-way nesting has to be used. This implies that the parent and child models have to be run together and there is an online exchange of information between both models. This approach is often impossible in operational systems where different model codes are run by different institutions, often in different countries. Therefore, in practice, these systems use one-way nesting with data transfer only from the parent model to the child models. In this article, it is examined whether it is possible to replace the missing feedback (coming from the child model) by data assimilation, avoiding the need to run the models simultaneously. Selected variables from the high-resolution simulation will be used as pseudo-observations and assimilated into the low-resolution models. This method will be called “upscaling”. A realistic test case is set up with a model covering the Mediterranean Sea, and a nested model covering its north-western basin. Under the hypothesis that the nested model has better prediction skills than the parent model, the upscaling method is implemented. Two simulations of the parent model are then compared: the case of one-way nesting (or a stand-alone model) and a simulation using the upscaling technique on the temperature and salinity variables. It is shown that the representation of some processes, such as the Rhône River plume, is strongly improved in the upscaled model compared to the stand-alone model.


2018 ◽  
Vol 140 (10) ◽  
Author(s):  
Zhen Hu ◽  
Zissimos P. Mourelatos

Testing of components at higher-than-nominal stress level provides an effective way of reducing the required testing effort for system reliability assessment. Due to various reasons, not all components are directly testable in practice. The missing information of untestable components poses significant challenges to the accurate evaluation of system reliability. This paper proposes a sequential accelerated life testing (SALT) design framework for system reliability assessment of systems with untestable components. In the proposed framework, system-level tests are employed in conjunction with component-level tests to effectively reduce the uncertainty in the system reliability evaluation. To minimize the number of system-level tests, which are much more expensive than the component-level tests, the accelerated life testing (ALT) design is performed sequentially. In each design cycle, testing resources are allocated to component-level or system-level tests according to the uncertainty analysis from system reliability evaluation. The component-level or system-level testing information obtained from the optimized testing plans is then aggregated to obtain the overall system reliability estimate using Bayesian methods. The aggregation of component-level and system-level testing information allows for an effective uncertainty reduction in the system reliability evaluation. Results of two numerical examples demonstrate the effectiveness of the proposed method.


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