Smart Passivation Materials with a Microencapsulated Liquid Metal for Self-Healing Conductors in Sustainable Electronic Devices

Abstract Passivation and self-healing of electric circuits are of importance in the area of electronic packaging for improving durability of devices. In particular, flexible or stretchable devices are vulnerable to mechanical stimuli, such as cutting, piercing, scratching, and pressing. The damage to a circuit results in the breakdown of devices. Therefore, a passivation layer has been essential to preserve the soft circuits and provide self-healing of the electrical pathways after they are damaged.

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Self-healing and stretchable conductor based on embedded liquid metal patterns within imprintable dynamic covalent elastomer

Journal of Materials Chemistry C ◽

10.1039/d1tc05087g ◽

2022 ◽

Author(s):

Xiaoliang Chen ◽

Peng Sun ◽

Hongmiao Tian ◽

Xiangming Li ◽

Chunhui Wang ◽

...

Keyword(s):

Liquid Metal ◽

Electronic Devices ◽

Electronic Systems ◽

Self Healing ◽

Next Generation ◽

Critical Elements ◽

Stretchable Conductors ◽

Stretchable Conductor

Flexible and stretchable conductors are critical elements for constructing soft electronic systems and have recently attracted tremendous attention. Next generation electronic devices call for self-healing conductors that can mimic the...

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Practical Work or Simulations? Voices of Millennial Digital Natives

Journal of Educational Technology Systems ◽

10.1177/00472395211018967 ◽

2021 ◽

pp. 004723952110189

Author(s):

Promail K.Y. Leung ◽

Maurice M.W. Cheng

Keyword(s):

Virtual World ◽

Electronic Devices ◽

Digital Natives ◽

Practical Work ◽

Group Interview ◽

Experiment Study ◽

Electric Circuits ◽

Online Simulations ◽

Validated Instrument ◽

Quasi Experiment Study

Students nowadays grow up with electronic devices and are adept at navigating the virtual world. Practical activities may be more of a novelty for them than simulations. Using the topic of electric circuits as a context, we examined the ways in which Grade 11 students perceived and learned from practical work and simulations, respectively. In this quasi-experiment study, a group of 19 students used a free online simulations package “Circuit Construction Kit,” while another group of 17 students learnt through practical work. We administered a validated instrument to both groups and found that practical work and simulations supported students’ learning in similar ways. The interventions were then reversed so that all participants experienced both practical work and simulations. Finally, seven students from each group were selected for a group interview. Through the interviews, we identified features of simulations and practical work respectively that students believed contributed to their learning.

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Utilizing in situ alloying reaction to achieve the self-healing, high energy density and cost-effective Li||Sb liquid metal battery

Journal of Power Sources ◽

10.1016/j.jpowsour.2021.230578 ◽

2021 ◽

Vol 514 ◽

pp. 230578

Author(s):

Shuai Yan ◽

Xianbo Zhou ◽

Haomiao Li ◽

Yi Shen ◽

Yaling He ◽

...

Keyword(s):

Energy Density ◽

Liquid Metal ◽

Cost Effective ◽

High Energy ◽

The Self ◽

High Energy Density ◽

Self Healing ◽

Liquid Metal Battery

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Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

Journal of Heat Transfer ◽

10.1115/1.4050404 ◽

2021 ◽

Author(s):

Guilin Liu ◽

Jing Liu

Keyword(s):

Heat Transfer ◽

Melting Point ◽

Liquid Metal ◽

High Performance ◽

Flow Resistance ◽

Heat Dissipation ◽

Liquid Metals ◽

Electronic Devices ◽

Convective Cooling ◽

Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

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