Studying the Impact of Return Current Path on the EM Simulation of High-speed Package Designs
Three-dimensional electromagnetic simulation models are often simplified in order to reduce the simulation time and memory requirements without sacrificing the accuracy of the results. A commonly adopted methodology in the simulation of electronic package designs is to truncate the size of the package model leaving only a few important features surrounding the nets of interest. In this paper we demonstrate that this simplification can have a significant impact of the simulation results if it is not performed carefully and it can introduce spurious/non physical resonances. The interaction between cavities and signals is first studied using a simple coupled differential via test structure. It is demonstrated that the return currents generated by these vias excite cavity resonances in power-ground plane pairs causing them to behave as parallel-plate waveguides. The role of interplane shorting vias in suppressing cavity resonances is then investigated and the impact of boundary conditions on the simulation results of package models is also shown and discussed. Finally, a realistic complex multilayer package model is analyzed and it is demonstrate that through proper truncation of the geometry, accurate results can be obtained.