scholarly journals Development of Brake High Speed Fade Test Mode of KIC(Korea International Circuit) Driving Level Using Brake Dynamometer

2021 ◽  
Vol 29 (2) ◽  
pp. 127-131
Author(s):  
Duckhyun Yu ◽  
Pilgu Lee
2018 ◽  
Vol 2 (6) ◽  
pp. 44-49
Author(s):  

: This paper presents the systematical approach to generate lab test mode using a brake dynamometer to estimate performance drop of brake pads under the circuit driving condition. AUDI R8 with cast iron disc brake system is used as the reference vehicle. Brake pad performance drop is characterized by driving vehicle on F1 circuit, performing a subjective and objective evaluation of the brake performance, analyzing the evolution of the significant parameters related with brake performance drop. Taking into account all the data and information gathered in vehicle test, a well correlated brake pad lab test mode is developed.


2019 ◽  
Vol 142 (3) ◽  
Author(s):  
Xin Quan ◽  
Jiliang Mo ◽  
Bo Huang ◽  
Bin Tang ◽  
Huajiang Ouyang ◽  
...  

Abstract In this study, experiments are conducted to evaluate the effects of friction block shapes and installation angles on the brake noise of high-speed trains on a customized small-scale brake dynamometer. Friction blocks in three different shapes (circle, triangle, and hexagon) and triangular/hexagonal friction blocks at different installation angles are used in the tests. The results indicate that the circular and triangular blocks exhibit low sound pressure with multiple harmonics, whereas the hexagonal friction block produces the highest sound pressure with a single dominant frequency. This difference is attributed to the high contact pressure and severe wear on the surface of the hexagonal friction block. Differences in the installation angle of the triangular/hexagonal friction blocks affect wear debris behavior, distribution of contact pressure, and contact state of the friction interface, consequently influencing noise performance.


2015 ◽  
Vol 8 (11) ◽  
pp. 19-30
Author(s):  
Horea Bacanu

Abstract In the international circuit of fictional texts from the last fifty years (perhaps even one hundred years, in some cases), several independent international organizations, academic and editorial platforms of critique and debate have been established. They have been organizing international contests, fine authorities of critical appreciation, evaluation and awarding of most prolific authors and most successful fictional texts: novels, short stories, stories or utopian and dystopian fictions. The allotment on cultural corridors, the geographical identification of both author and title dynamics which have been nominated at the most prestigious international awards for fiction demonstrates an increased emergence of several zones where wide international circulation texts were seldom, fifty years ago. In this paper, we suggest a reinterpretation and a comprehension of the political context from the contemporary fiction, by regrouping in one category, the three classical genres (historic novel, social novel, political novel) and also the universal fiction which implies characters and relations of power. Thus, we create a category which is known as „political fiction”. The increased individualization of this literary macro-genre called „political fiction” is also a creative answer to the high speed of circulation and at the general international amplitude with which contemporary socio-political novels are distributed.


Author(s):  
Benjamin M. Mauck ◽  
Vishnumohan Ravichandran ◽  
Usman Azeez Mughal

Abstract Parametric analysis of microprocessor SRAM through special design for test features (DFT) is used extensively by fault isolation and failure analysis engineers to find and characterize defects. While regular raster and special cache patterns (i.e. weak-write test mode) detect many stuck-at faults, a parametric analysis is needed to identify which defect mechanism is the cause of a cache failure. Pico-probing is the most common method of parametric analysis on SRAM cells, but is becoming increasingly difficult on smaller geometries. These curves can also be taken non-destructively by muxing any bitline (BL) and bitline_bar (BL#) of an internal cache to an I/O pin and sweeping these pins with an external PMU (a test mode known as low yield analysis, or LYA). Unfortunately, a growing amount of leakage on each new process is distorting these LYA testmode I-V curves, making it increasingly difficult to find and differentiate defects. The goal of this paper is to discuss the simulation and silicon results of a concept On-Die LYA (ODLYA) circuit implemented in a 65 nm CMOS process technology. ODLYA is used to curve-trace individual transistors within an SRAM cell and read out results in an automated fashion. Taking measurements on-die eliminates interconnect-dominated IR drop and leakage distortion from several levels of multiplexing. The proposed implementation enables non-destructive high-speed parametric analysis with less dependency on growing cache sizes, number of cores, and scaling process technologies.


Author(s):  
E.D. Wolf

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.


Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.


Author(s):  
William Krakow

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.


Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.


Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions


Author(s):  
Brian Cross

A relatively new entry, in the field of microscopy, is the Scanning X-Ray Fluorescence Microscope (SXRFM). Using this type of instrument (e.g. Kevex Omicron X-ray Microprobe), one can obtain multiple elemental x-ray images, from the analysis of materials which show heterogeneity. The SXRFM obtains images by collimating an x-ray beam (e.g. 100 μm diameter), and then scanning the sample with a high-speed x-y stage. To speed up the image acquisition, data is acquired "on-the-fly" by slew-scanning the stage along the x-axis, like a TV or SEM scan. To reduce the overhead from "fly-back," the images can be acquired by bi-directional scanning of the x-axis. This results in very little overhead with the re-positioning of the sample stage. The image acquisition rate is dominated by the x-ray acquisition rate. Therefore, the total x-ray image acquisition rate, using the SXRFM, is very comparable to an SEM. Although the x-ray spatial resolution of the SXRFM is worse than an SEM (say 100 vs. 2 μm), there are several other advantages.


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