Metallographic preparation for electron backscattered diffraction

AccessScience ◽  
2015 ◽  
2006 ◽  
Vol 12 (S02) ◽  
pp. 1610-1611 ◽  
Author(s):  
G Vander Voort ◽  
W Van Geertruyden ◽  
S Dillon ◽  
E Manilova

Extended abstract of a paper presented at Microscopy and Microanalysis 2006 in Chicago, Illinois, USA, July 30 – August 3, 2005


2011 ◽  
Vol 702-703 ◽  
pp. 578-581
Author(s):  
Patrick Voos

Electron Backscatter Diffraction measurement can provide much analytical information, such as the phase orientation or material identification. The “Quality” rating of the backscatter diffraction depends on the success rate of indexing. To achieve this, a deformation-free preparation is essential. In recent years most preparation methods have been optimized to contain on average only three to four sample preparation steps. The sample quality is excellent when reflected light microscopy is used. Due to the low information depth of the EBSD measurement (20-100nm), the standard method must be modified. The preparation method must remove the scratches and the underlying damage in order to obtain a high quality EBSD pattern. The optimization can be done by chemo-mechanical polishing, electrolytic polishing or vibratory polishing. Examples are used to show where the limits of the technologies are and to give helpful ‘Hints’ for EBSD sample preparation.


Author(s):  
Carl Nail

Abstract To overcome the obstacles in preparing high-precision cross-sections of 'blind' bond wires in integrated circuits, this article proposes a different technique that generates reliable, repeatable cross-sections of bond wires across most or all of their lengths, allowing unencumbered and relatively artifact-free analysis of a given bond wire. The basic method for cross-sectioning a 'blind' bond wire involves radiographic analysis of the sample and metallographic preparation of the sample to the plane of interest. This is followed by tracking the exact location of the plane on the original radiograph using a stereomicroscope and finally darkfield imaging in which the wire is clearly visible with good resolution.


2011 ◽  
Author(s):  
Joshua B. Ratchford ◽  
Bruce A. Poese ◽  
Cynthia L. Lundgren ◽  
Jan L. Allen ◽  
Jeff Wolfenstine

Materials ◽  
2019 ◽  
Vol 12 (15) ◽  
pp. 2496 ◽  
Author(s):  
Kai Zhu ◽  
Shoujiang Qu ◽  
Aihan Feng ◽  
Jingli Sun ◽  
Jun Shen

Multidirectional isothermal forging (MDIF) was used on a Ti-44Al-4Nb-1.5Cr-0.5Mo-0.2B (at. %) alloy to obtain a crack-free pancake. The microstructural evolution, such as dynamic recovery and recrystallization behavior, were investigated using electron backscattered diffraction and transmission electron microscopy methods. The MDIF broke down the initial near-lamellar microstructure and produced a refined and homogeneous duplex microstructure. γ grains were effectively refined from 3.6 μm to 1.6 μm after the second step of isothermal forging. The ultimate tensile strength at ambient temperature and the elongation at 800 °C increased significantly after isothermal forging. β/B2→α2 transition occurred during intermediate annealing, and α2 + γ→β/B2 transition occurred during the second step of isothermal forging. The refinement mechanism of the first-step isothermal forging process involved the conversion of the lamellar structure and discontinuous dynamic recrystallization (DDRX) of γ grains in the original mixture-phase region. The lamellar conversion included continuous dynamic recrystallization and DDRX of the γ laths and bugling of the γ phase. DDRX behavior of γ grains dominated the refinement mechanism of the second step of isothermal forging.


Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3970
Author(s):  
Wojciech J. Nowak

An electron backscattered diffraction (EBSD) method provides information about the crystallographic structure of materials. However, a surface subjected to analysis needs to be well-prepared. This usually requires following a time-consuming procedure of mechanical polishing. The alternative methods of surface preparation for EBSD are performed via electropolishing or focus ion beam (FIB). In the present study, plasma etching using a glow discharge optical emission spectrometer (GD-OES) was applied for surface preparation for EBSD analysis. The obtained results revealed that plasma etching through GD-OES can be successfully used for surface preparation for EBSD analysis. However, it was also found that the plasma etching is sensitive for the alloy microstructure, i.e., the presence of intermetallic phases and precipitates such as carbides possess a different sputtering rate, resulting in non-uniform plasma etching. Preparation of the cross-section of oxidized CM247 revealed a similar problem with non-uniformity of plasma etching. The carbides and oxide scale possess a lower sputtering rate than the metallic matrix, which caused formation of relief. Based on obtained results, possible resolutions to suppress the effect of different sputtering rates are proposed.


Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 36
Author(s):  
Munir Al-Saadi ◽  
Wangzhong Mu ◽  
Christopher N. Hulme-Smith ◽  
Fredrik Sandberg ◽  
Pär G. Jönsson

Alloy 825 is widely used in several industries, but its useful service life is limited by both mechanical properties and corrosion resistance. The current work explores the effect of the addition of magnesium on the recrystallization and mechanical behavior of alloy 825 under hot compression. Compression tests were performed under conditions representative of typical forming processes: temperatures between 1100 and 1250 °C and at strain rates of 0.1–10 s−1 to a true strain of 0.7. Microstructural evolution was characterized by electron backscattered diffraction. Dynamic recrystallization was found to be more prevalent under all test conditions in samples containing magnesium, but not in all cases of conventional alloy 825. The texture direction ⟨101⟩ was the dominant orientation parallel to the longitudinal direction of casting (also the direction in which the samples were compressed) in samples that contained magnesium under all test conditions, but not in any sample that did not contain magnesium. For all deformation conditions, the peak stress was approximately 10% lower in material with the addition of magnesium. Furthermore, the differences in the peak strain between different temperatures are approximately 85% smaller if magnesium is present. The average activation energy for hot deformation was calculated to be 430 kJ mol−1 with the addition of magnesium and 450 kJ mol−1 without magnesium. The average size of dynamically recrystallized grains in both alloys showed a power law relation with the Zener–Hollomon parameter, DD~Z−n, and the exponent of value, n, is found to be 0.12. These results can be used to design optimized compositions and thermomechanical treatments of alloy 825 to maximize the useful service life under current service conditions. No experiments were conducted to investigate the effects of such changes on the service life and such experiments should now be performed.


2021 ◽  
Vol 21 (3) ◽  
Author(s):  
Przemysław Snopiński ◽  
Mariusz Król ◽  
Marek Pagáč ◽  
Jana Petrů ◽  
Jiří Hajnyš ◽  
...  

AbstractThis study investigated the impact of the equal channel angular pressing (ECAP) combined with heat treatments on the microstructure and mechanical properties of AlSi10Mg alloys fabricated via selective laser melting (SLM) and gravity casting. Special attention was directed towards determining the effect of post-fabrication heat treatments on the microstructural evolution of AlSi10Mg alloy fabricated using two different routes. Three initial alloy conditions were considered prior to ECAP deformation: (1) as-cast in solution treated (T4) condition, (2) SLM in T4 condition, (3) SLM subjected to low-temperature annealing. Light microscopy, transmission electron microscopy, X-ray diffraction line broadening analysis, and electron backscattered diffraction analysis were used to characterize the microstructures before and after ECAP. The results indicated that SLM followed by low-temperature annealing led to superior mechanical properties, relative to the two other conditions. Microscopic analyses revealed that the partial-cellular structure contributed to strong work hardening. This behavior enhanced the material’s strength because of the enhanced accumulation of geometrically necessary dislocations during ECAP deformation.


2014 ◽  
Vol 513-517 ◽  
pp. 281-285
Author(s):  
Cheng Sun ◽  
Min Ju Ding ◽  
Yong Feng Zhang ◽  
Xun Tan ◽  
Peng Wang ◽  
...  

A variety of electrical apparatus used in daily life can cause fires because of internal or external factors. During cause identification of an electrical fire, the first short circuit melted marks of copper wire have been considered highly important because they are direct proofs. Additionally, overloaded short circuit caused by the overload of current due to excessive electrical usage can give rise to an electrical fire. Despite extensive research on the first short circuit in fire scenes, the overloaded short circuit remains difficult to be distinguished because of the limitation of commonly used testing methods. Conventional metallographic method is intuitionistic and simple, but may not provide detailed data of crystals such as misorientation of grains. Here a new method (electron backscattered diffraction, EBSD) is applied for identification of the first and overloaded short-circuited melted marks of copper wires in electrical fire scenes. Results show obvious morphological distinctions in melted marks of copper wires between the first and overloaded short circuits. Qualitative and Quantitative differences obtained from the contrast of the above two short circuit situations may assist for cause identification of electrical fires in the future.


2021 ◽  
Vol 58 (1) ◽  
pp. 4-31
Author(s):  
C. Fleißner-Rieger ◽  
T. Pogrielz ◽  
D. Obersteiner ◽  
T. Pfeifer ◽  
H. Clemens ◽  
...  

Abstract Additive manufacturing processes allow the production of geometrically complex lightweight structures with specific material properties. However, by contrast with ingot metallurgy methods, the manufacture of components using this process also brings about some challenges. In the field of microstructural characterization, where mostly very fine structures are analyzed, it is thus indispensable to optimize the classic sample preparation process and to furthermore implement additional preparation steps. This work focuses on the metallography of additively manufactured Ti‑6Al‑4V components produced in a selective laser melting process. It offers a guideline for the metallographic preparation along the process chain of additive manufacturing from the metal powder characterization to the macro- and microstructural analysis of the laser melted sample. Apart from developing preparation parameters, selected etching methods were examined with regard to their practicality.


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