This paper examines the practical challenges of simplified setups aimed at achieving high-power IGBTs’ IC–VCE curve. The slope of this I–V curve (which is defined as on-resistance RCE) and the point where the VCE–VGE curve visibly bends (threshold gate voltage) can be suitable failure precursor parameters to determine an IGBT’s health condition. A simplified/affordable design for these specific measurements can be used for in-situ condition monitoring or field testing of switching devices. First, the possible I–V curve measurement methods are discussed in detail in order to prevent self-heating. The selected design includes two IGBTs in which the high-side IGBT was the device under test (DUT) with a constant gate voltage (VGE) of 15 V. Then, the low-side IGBT was switched by a short pulse (50 μs) to impose a high-current pulse on the DUT. The VCE–VGE curve was also extracted as an important failure-precursor indicator. In the next stage, a power-cycling test was performed, and the impact of degradation on the IGBT was analyzed by these measurement methods. The results show that after 18,000 thermal cycles, a visible shift in I–V curve can be seen. The internal resistance increased by 13%, while the initial collector-emitter voltage and voltage at the knee point in the VCE–VGE curve slightly changed. It is likely that in our case, during the performed power-cycling test and aging process, the bond wires were most affected, but this hypothesis needs further investigation.
Conjugate Heat Transfer and Thermal Mechanical Analysis for Liquid Metal Targets for High Power Electron Beams.
