Reducing Logic Locking Key Leakage through the Scan Chain

Author(s):  
Kyle Juretus ◽  
Ioannis Savidis
Keyword(s):  
2021 ◽  
Vol 26 (4) ◽  
pp. 1-27
Author(s):  
M Sazadur Rahman ◽  
Adib Nahiyan ◽  
Fahim Rahman ◽  
Saverio Fazzari ◽  
Kenneth Plaks ◽  
...  

Logic locking has emerged as a promising solution to protect integrated circuits against piracy and tampering. However, the security provided by existing logic locking techniques is often thwarted by Boolean satisfiability (SAT)-based oracle-guided attacks. Criteria for successful SAT attacks on locked circuits include: (i) the circuit under attack is fully combinational, or (ii) the attacker has scan chain access. To address the threat posed by SAT-based attacks, we adopt the dynamically obfuscated scan chain (DOSC) architecture and illustrate its resiliency against the SAT attacks when inserted into the scan chain of an obfuscated design. We demonstrate, both mathematically and experimentally, that DOSC exponentially increases the resiliency against key extraction by SAT attack and its variants. Our results show that the mathematical estimation of attack complexity correlates to the experimental results with an accuracy of 95% or better. Along with the formal proof, we model DOSC architecture to its equivalent combinational circuit and perform SAT attack to evaluate its resiliency empirically. Our experiments demonstrate that SAT attack on DOSC-inserted benchmark circuits timeout at minimal test time overhead, and while DOSC requires less than 1% area and power overhead.


Author(s):  
Rommel Estores ◽  
Pascal Vercruysse ◽  
Karl Villareal ◽  
Eric Barbian ◽  
Ralph Sanchez ◽  
...  

Abstract The failure analysis community working on highly integrated mixed signal circuitry is entering an era where simultaneously System-On-Chip technologies, denser metallization schemes, on-chip dissipation techniques and intelligent packages are being introduced. These innovations bring a great deal of defect accessibility challenges to the failure analyst. To contend in this era while aiming for higher efficiency and effectiveness, the failure analysis environment must undergo a disruptive evolution. The success or failure of an analysis will be determined by the careful selection of tools, data and techniques in the applied analysis flow. A comprehensive approach is required where hardware, software, data analysis, traditional FA techniques and expertise are complementary combined [1]. This document demonstrates this through the incorporation of advanced scan diagnosis methods in the overall analysis flow for digital functionality failures and supporting the enhanced failure analysis methodology. For the testing and diagnosis of the presented cases, compact but powerful scan test FA Lab hardware with its diagnosis software was used [2]. It can therefore easily be combined with the traditional FA techniques to provide stimulus for dynamic fault localizations [3]. The system combines scan chain information, failure data and layout information into one viewing environment which provides real analysis power for the failure analyst. Comprehensive data analysis is performed to identify failing cells/nets, provide a better overview of the failure and the interactions to isolate the fault further to a smaller area, or to analyze subtle behavior patterns to find and rationalize possible faults that are otherwise not detected. Three sample cases will be discussed in this document to demonstrate specific strengths and advantages of this enhanced FA methodology.


Author(s):  
Guillaume Celi ◽  
Sylvain Dudit ◽  
Thierry Parrassin ◽  
Philippe Perdu ◽  
Antoine Reverdy ◽  
...  

Abstract For Very Deep submicron Technologies, techniques based on the analysis of reflected laser beam properties are widely used. The Laser Voltage Imaging (LVI) technique, introduced in 2009, allows mapping frequencies through the backside of integrated circuit. In this paper, we propose a new technique based on the LVI technique to debug a scan chain related issue. We describe the method to use LVI, usually dedicated to frequency mapping of digital active parts, in a way that enables localization of resistive leakage. Origin of this signal is investigated on a 40nm case study. This signal can be properly understood when two different effects, charge carrier density variations (LVI) and thermo reflectance effect (Thermal Frequency Imaging, TFI), are taken into account.


Author(s):  
Ray Talacka ◽  
Nandu Tendolkar ◽  
Cynthia Paquette

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.


Author(s):  
T. Kiyan ◽  
C. Boit ◽  
C. Brillert

Abstract In this paper, a methodology based upon laser stimulation and a comparison of continuous wave and pulsed laser operation will be presented that localizes the fault relevant sites in a fully functional scan chain cell. The technique uses a laser incident from the backside to inject soft faults into internal nodes of a master-slave scan flip-flop in consequence of localized photocurrent. Depending on the illuminated type of the transistors (n- or p-type), injection of a logic ‘0’ or ‘1’ into the master or the slave stage of a flip-flop takes place. The laser pulse is externally triggered and can easily be shifted to various time slots in reference to clock and scan pattern. This feature of the laser diode allows triggering the laser pulse on the rising or the falling edge of the clock. Therefore, it is possible to choose the stage of the flip-flop in which the fault injection should occur. It is also demonstrated that the technique is able to identify the most sensitive signal condition for fault injection with a better time resolution than the pulse width of the laser, a significant improvement for failure analysis of integrated circuits.


Author(s):  
Ruifeng Guo ◽  
Srikanth Venkataraman

Abstract In this paper, we present a scan chain fault diagnosis procedure. The diagnosis for a single scan chain failure is performed in three steps. The first step uses special chain test patterns to determine both the faulty chain and the fault type in the faulty chain. The second step uses a novel procedure to generate special test patterns to identify the suspect scan cell within a range of scan cells. Unlike previously proposed methods that restrict the location of the faulty scan cell only from the scan chain output side, our method restricts the location of the faulty scan cell from both the scan chain output side and the scan chain input side. Hence the number of suspect scan cells is reduced significantly in this step. The final step further improves the diagnostic resolution by ranking the suspect scan cells inside this range. The proposed technique handles both stuck-at and timing failures (transition faults and hold time faults). The experimental results based on simulation and silicon units for several products show the effectiveness of the proposed method.


Author(s):  
Peter Ouimet ◽  
Jason Goertz ◽  
Olivier Rinaudo ◽  
Lousinda Long ◽  
Simon Yeung

Abstract This paper describes case histories of 0.13 um bulk CMOS technology analyses using Time Resolved Light Emission (TRLEM). Using this technique, scan chain, timing, and logic failures are shown to be quickly and decisively identified thereby meeting the need for rapid feedback on 1st silicon failures and process excursions.


2013 ◽  
Vol 26 (7) ◽  
pp. 586-590
Author(s):  
Wei Wang ◽  
Xin Li ◽  
Tian Chen ◽  
Jun Liu ◽  
Fang Fang ◽  
...  

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