On the power dissipation in dynamic threshold silicon-on-insulator CMOS inverter

2002 ◽  
Author(s):  
Wei Jin ◽  
P.C.H. Chan ◽  
M. Chan
Keyword(s):  
Power Dissipation ◽  
Silicon On Insulator ◽  
Dynamic Threshold ◽  
Cmos Inverter

scholarly journals Performance Analysis of CMOS Circuits using Shielded Channel Dual Gate Stack Silicon on Nothing Junctionless Transistor

2021 ◽  
Vol 10 (6) ◽  
pp. 1-10
Author(s):  
S.C. Wagaj ◽  
◽  
S.C. Patil ◽  
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Silicon On Insulator ◽  
Cmos Circuits ◽  
Gate Stack ◽  
Cmos Inverter ◽  
Short Channel ◽  
Junctionless Transistor ◽  
Dual Gate ◽  
Static Power

In this paper it has been demonstrated that a shielded channel made by varying the side gate length in silicon-on-nothing junctionless transistor not only improves the short channel effect but also improve the performance of CMOS circuits of this device. The proposed device shielded channel dual gate stack silicon on nothing junctionless transistor (SCDGSSONJLT) drain induced barrier lowering (DIBL), cut-off frequency and subthreshold slope are improved by 20%, 39% and 20% respectively over the single material gate silicon on insulator junctionless transistor (SMG SOI JLT). The proposed device CMOS inverter fall time Tf (pS) and noise margin improves by 50% and 10% compare to shielded channel silicon on insulator junctionless transistor (SCSOIJLT). It has been observed that circuit simulation of CMOS inverter, NAND and NOR of proposed device. The static power dissipation in the case of proposed SCDGSSONJLT device are reduced by 45%, 81% and 83% respectively over the SMGSOIJLT. Thus, significant improvement in DIBL, cut-off frequency, propagation delay and static power dissipation at low power supply voltage shows that the proposed device is more suitable for low power CMOS circuits.

scholarly journals A Low-Power and In Situ Annealing Technique for the Recovery of Active Devices After Proton Irradiation

2018 ◽  
Vol 170 ◽  
pp. 01006 ◽  
Author(s):  
Laurent A. Francis ◽  
Amor Sedki ◽  
Nicolas André ◽  
Valéria Kilchytska ◽  
Pierre Gérard ◽  
...  
Keyword(s):  
Low Power ◽  
Field Effect Transistors ◽  
Silicon On Insulator ◽  
Oxide Semiconductor ◽  
High Dose ◽  
Partial Recovery ◽  
Proton Radiation ◽  
Cmos Inverter ◽  
Inversion Point

In this paper, we study the recovery of onmembrane semiconductor components, such as N-type Field-Effect Transistors (FETs) available in two different channel widths and a Complementary Metal-Oxide-Semiconductor (CMOS) inverter, after the exposure to high dose of proton radiation. Due to the ionizing effect, the electrical characteristics of the components established remarkable shifts, where the threshold voltages showed an average shift of -480 mV and -280 mV respectively for 6 μm and 24 μm N-channel transistors, likewise the inversion point of the inverter showed an important shift of -690 mV. The recovery concept is based mainly on a micro-hotplate, fabricated with backside MEMS micromachining structure and a Silicon-On-Insulator (SOI) technology, ensuring rapid, low power and in situ annealing technique, this method proved its reliability in recent works. Annealing the N-channel transistors and the inverter for 16 min with a temperature of the heater up to 385 °C, guaranteed a partial recovery of the semiconductor based components with a maximum power consumption of 66 mW.

Control of tube parameters on SWCNT bundle interconnect delay and power dissipation

2013 ◽  
Vol 31 (1) ◽  
pp. 24-31 ◽  
Author(s):  
Mayank Kumar Rai ◽  
Rajesh Khanna ◽  
Sankar Sarkar
Keyword(s):  
Power Dissipation ◽  
Tube Bundle ◽  
Vlsi Circuits ◽  
Cmos Inverter ◽  
Spice Simulation ◽  
Single Walled Carbon Nanotube ◽  
Content Type ◽  
Swcnt Bundle ◽  
Copper Interconnect ◽  
Interconnect Delay

Purpose – This paper aims to propose to study the control of tube parameters in terms of diameter, separation between adjacent tubes and length, on delay and power dissipation in single-walled carbon nanotube (SWCNT) bundle interconnect for VLSI circuits. Design/methodology/approach – The paper considers a distributed-RLC model of interconnect. A CMOS-inverter driving a distributed-RLC model of interconnect with load of 1 pF. A 0.1 GHz pulse of 2 ns rise time provides input to the CMOS-inverter. For SPICE simulation, predictive technology model (PTM) is used for the CMOS-driver. The performance of this setup is studied by SPICE simulation in 22 nm technology node. The results are compared with those of currently used copper interconnect. Findings – SPICE simulation results reveal that delay increases with increase in separation between tubes and diameter whereas the reverse is true for power dissipation. The authors also find that SWCNT bundle interconnects are of lower delay than copper interconnect at various lengths and higher power dissipation due to dominance of larger capacitance of tube bundle. Originality/value – The investigations show that tube parameters can control delay and this can also be utilized to decrease power dissipation in SWCNT bundle interconnects for VLSI applications.

Analytical Modeling of D.C. Parameters of Double Gate Junctionless MOSFET in Near and Subthreshold Regime for RF Circuit Application

2020 ◽  
Vol 10 (4) ◽  
pp. 457-470 ◽  
Author(s):  
Dipanjan Sen ◽  
Savio J. Sengupta ◽  
Swarnil Roy ◽  
Manash Chanda ◽  
Subir K. Sarkar
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Circuit Design ◽  
Power Dissipation ◽  
Supply Voltage ◽  
Dominant Factor ◽  
Double Gate ◽  
Cmos Inverter ◽  
Ultra Low Power ◽  
Voltage Swing

Aims:: In this work, a Junction-Less Double Gate MOSFET (JLDG MOSFET) based CMOS inverter circuit is proposed for ultra-low power applications in the near and sub-threshold regime operations. Background:: D.C. performances like power, delay and voltage swing of the proposed Inverter have been modeled analytically and analyzed in depth. JLDG MOSFET has promising features to reduce the short-channel effects compared to the planner MOSFET because of better gate control mechanism. So, proposed Inverter would be efficacious to offer less power dissipation and higher speed. Objective:: Impact of supply voltage, temperature, High-k gate oxide, TOX, TSI on the power, delay and voltage swing of the Inverter circuits have been detailed here. Methods: Extensive simulations using SILVACO ATLAS have been done to validate the proposed logic based digital circuits. Besides, the optimum supply voltage has been modelled and verified through simulation for low voltage operations. In depth analysis of voltage swing is added to measure the noise immunity of the proposed logic based circuits in Sub & Near-threshold operations. For ultra-low power operation, JLDG MOSFET can be an alternative compared to conventional planar MOSFET. Result:: Hence, the analytical model of delay, power dissipation and voltage swing have been proposed of the proposed logic based circuits. Besides, the ultra-low power JLDG CMOS inverter can be an alternative in saving energy, reduction of power consumption for RFID circuit design where the frequency range is a dominant factor. Conclusion:: The power consumption can be lowered in case of UHF, HF etc. RF circuits using the Double Gate Junction-less MOSFET as a device for circuit design.

Subthreshold Current Modeling of Stacked Dielectric Triple Material Cylindrical Gate All Around (SD-TM-CGAA) Junctioless MOSFET For Low Power Applications

2021 ◽  
Author(s):  
Prashant Kumar ◽  
Munish Vashisht ◽  
Neeraj Gupta ◽  
Rashmi Gupta
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Future Generation ◽  
Threshold Current ◽  
Cmos Inverter ◽  
Drive Current ◽  
Subthreshold Current ◽  
Pmos Transistor ◽  
Good Agreement ◽  
The Ideal

Abstract Stacked Dielectric Triple Material Cylindrical Gate All Around (SD-TM-CGAA) Junctioless MOSFET has been explored for low power applications. This paper presents an analytical model of subthreshold current of Stacked Dielectric Triple Material Cylindrical Gate All Around (SD-TM-CGAA) Junctioless MOSFET. The analytical results were compared with TMSG MOSFET and good agreement was obtained. The sub-threshold current of the device is very low and consider for the implementation of CMOS inverter. A PMOS transistor is designed and the drive current of the PMOS transistor is tuned with the NMOS device to obtain the ideal matching in the drive current. A CMOS inverter has been designed. The transient and DC behavior of the device have been examined. The power dissipation of the CMOS inverter has been computed and compared with CMOS DMG-SOI JLT inverter. The power dissipation is 5 times less in proposed device as compared to CMOS DMG-SOI JLT inverter. This exhibits an excellent improvement in power dissipation which is useful for making low power future generation devices.

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