The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

1998 ◽  
Vol 120 (4) ◽  
pp. 342-348 ◽  
Author(s):  
S. Rzepka ◽  
M. A. Korhonen ◽  
E. Meusel ◽  
C.-Y. Li
Keyword(s):  
Finite Element Analysis ◽  
Room Temperature ◽  
Flip Chip ◽  
Solder Joints ◽  
Element Analysis ◽  
Ultimate Failure ◽  
Simulation Results ◽  
Substrate Surfaces ◽  
Major Crack ◽  
Perfect Adhesion

The stresses occurring in the solder joints during thermal loads have been studied by finite element analysis. Besides the cases of no underfill and perfect adhesion, underfill delaminations at the interfaces to the solder, to the chip, and to the substrate surfaces, respectively, have been considered. The simulation results indicate that rapid failing of the flip-chip modules due to delamination can be prevented effectively by using an underfill that has a high Young’s modulus at room temperature (even 20 GPa are not too high) and a CTE slightly lower than solder. Since the ultimate failure is always caused by growing of a major crack, the damage integral concept is valid for lifetime estimations even in the case of FC modules with underfill.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Dynamic Finite Element Analysis of a Cylindrical Roller Bearing

2011 ◽  
Vol 143-144 ◽  
pp. 437-442
Author(s):  
Bao Hong Tong ◽  
Yin Liu ◽  
Xiao Qian Sun ◽  
Xin Ming Cheng
Keyword(s):  
Numerical Simulation ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Roller Bearing ◽  
Element Analysis ◽  
Dynamic Finite Element ◽  
Dynamic Finite Element Analysis ◽  
Simulation Results ◽  
Cylindrical Roller Bearing ◽  
Cylindrical Roller

A dynamic finite element analysis model for cylindrical roller bearing is developed, and the complex stress distribution and dynamic contacting nature of the bearing are investigated carefully based on ANSYS/LS-DYNA. Numerical simulation results show that the stress would be bigger when the element contacting with the inner or outer ring than at other times, and the biggest stress would appear near the area that roller contacting with the inner ring. Phenomenon of stress concentration on the roller is found to be very obvious during the operating process of the bearing system. The stress distributions of different elements are uneven on the same side surface of roller in its axis direction. Numerical simulation results can give useful references for the design and analysis of rolling bearing.

Effect of Strain Rate on the Simulation of MEMS Safety and Arming Device

2014 ◽  
Vol 609-610 ◽  
pp. 849-855
Author(s):  
Wen Rui Ma ◽  
Guang He
Keyword(s):  
Finite Element Analysis ◽  
Strain Rate ◽  
Impact Load ◽  
Simulation Models ◽  
Strain Rate Effect ◽  
Rate Effect ◽  
Experimental Results ◽  
Analysis Software ◽  
Element Analysis ◽  
Simulation Results

Under launch impact load, LIGA nickel that manufacturing MEMS fuze safety and arming (S&A) device will have obvious strain rate effect. By using finite element analysis software ANSYS/LS-DYNA, simulation models of a small-caliber ammunition MEMS fuze setback S&A device with strain rate effect and without strain rate effect were respectively established. The results of the two simulation modules were quite different. Comparisons between experimental results and simulation results show that simulation results considering strain rate effect agree well with experimental results, which proves strain rate effect should not be ignored in the simulation of MEMS S&A device.

scholarly journals Analisis Perancangan Frame Gokart dari Pengaruh Pembebanan dengan Menggunakan CAD Solidworks 2016

Jurnal METTEK ◽  
2021 ◽  
Vol 7 (1) ◽  
pp. 1
Author(s):  
Angga Restu Pahlawan ◽  
Rizal Hanifi ◽  
Aa Santosa
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Safety Factor ◽  
Frame Structure ◽  
Maximum Displacement ◽  
Element Analysis ◽  
Aisi 1045 ◽  
Steel Aisi ◽  
Simulation Results ◽  
Manual Calculation

Frame adalah salah satu komponen yang sangat penting dalam sebuah kendaraan, yang berfungsi sebagai penopang penumpang, mesin, suspensi, sistem kelistrikan dan lain-lain. Melihat fungsi dari frame sangat penting, maka dalam merancang sebuah frame harus diperhitungkan dengan baik. Banyak sekali jenis pengujian yang sering dipakai dalam perancangan sebuah struktur frame, salah satunya adalah digunakannya metode komputasi dengan menggunakan metode Finite Element Analysis (FEA). Tujuan dari penelitian ini adalah untuk mengetahui distribusi tegangan, regangan, displacement, dan safety factor dari hasil pembebanan statis pada frame gokar. Struktur frame didesain dan dianalisis menggunakan software Solidworks 2016. Material yang digunakan frame adalah baja AISI 1045 hollow tube 273,2 mm, dengan menggunakan pembebanan pengendara sebesar 50 kg dan 70 kg. Hasil dari perhitungan manual didapatkan tegangan maksimum sebesar 4,735  107 N/m2, sedangkan dari simulasi didapatkan sebesar 4,516  107 N/m2. Regangan maksimum didapatkan dari perhitungan manual sebesar 2,310  10-4. Displacement maksimum didapatkan dari perhitungan manual sebesar 1,864  108 mm, sedangkan dari simulasi didapatkan sebesar 1,624  108 mm. Safety factor minimum didapatkan dari perhitungan manual sebesar 11,193, dan perhitungan simulasi didapatkan sebesar 11,736. The frame is one of the most important components in a vehicle, which functions as a support for passengers, engines, suspensions, electrical systems and others. Seeing the function of the frame is very important, so designing a frame must be taken into account well. There are many types of tests that are often used in the design of a frame structure, one of which is the use of computational methods using the Finite Element Analysis (FEA) method. The purpose of this study was to determine the distribution of stress, strain, displacement, and safety factor from the results of static loading on the kart frame. The frame structure was designed and analyzed using Solidworks 2016 software. The material used in the frame is steel AISI 1045 hollow tube 27  3,2 mm, using a rider load of 50 kg and 70 kg. The result of manual calculation shows that the maximum stress is 4,735  107 N/m2, while the simulation results are 4,516  107 N/m2. The maximum strain is obtained from manual calculation of 2,310  10-4. The maximum displacement is obtained from manual calculations of 1,864  108 mm, while the simulation results are 1,624  108 mm. The minimum safety factor obtained from manual calculation is 11,193, and the simulation calculation is 11,736.

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

Finite Element Analysis and Experimental Study of an Electromagnetic Shell Part with Flow Control Forming

2013 ◽  
Vol 690-693 ◽  
pp. 2982-2989
Author(s):  
Zhi Wei Huang ◽  
Yuan Yuan Wan ◽  
Yan Bin Wang ◽  
Lu Chang Che ◽  
Chuan Lin Liu ◽  
...  
Keyword(s):  
Flow Control ◽  
Room Temperature ◽  
Steel Sheet ◽  
Equivalent Stress ◽  
Metal Flow ◽  
Practical Method ◽  
Element Analysis ◽  
One Step ◽  
Simulation Results ◽  
Shell Part

In this paper, an electromagnetic shell part was studied with the design of die, simulation and the flow control forming (FCF) method. The important technology of FCF was the design of cavity die to control metal flow. The simulation results indicate that pyramidal faces of cavity die exerted a significant influence on qualities of parts. The simulation results also revealed that the effective stresses of the sheet were inhomogeneous and the distributions of the equivalent stress were lamellar with obvious gradients. Experimental results show that steel sheet (08Al) could be formed in one step into intricate shapes at room temperature. This confirmed that FCF is a safe, clean and practical method for the near net forming of parts.

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

2011 ◽  
Author(s):  
Vikram Venkatadri ◽  
Mark Downey ◽  
Xiaojie Xue ◽  
Dipak Sengupta ◽  
Daryl Santos ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Flexible Substrate ◽  
High Density ◽  
Design Solution ◽  
Design Parameters ◽  
Optimized Design ◽  
Element Analysis ◽  
Bonding Parameters

System-On-Film (SOF) module is a complex integration of a fine pitch high density die and surface mounted discrete devices on a polyimide (PI) film laminate. The die is connected to the film using a thermo-compression flip-chip bonding (TCB) process which is capable of providing a very high density interconnect at less than 50um pitch. Several design and bonding parameters have to be controlled in order to achieve a reliable bond between the Au bumps on the die and the Sn plated Cu traces on the PI film. In the current work, the TCB process is studied using Finite Element Analysis (FEA) to optimize the design parameters and assure proper process margins. The resultant forces acting on the bump-to-trace interfaces are quantified across the different potential geometrical combinations. Baseline simulations showed higher stresses on specific bump locations and stress gradients acting on the bumps along the different sides of the die. These observations were correlated to both the failures and near failures on the actual test vehicles. Further simulations were then utilized to optimize and navigate design tradeoffs at both the die and flexible substrate design levels for a more robust design solution. Construction analysis performed on parts built using optimized design parameters showed significant improvements and correlated well with the simulation results.

Finite Element Simulating of C/SiC Composite Bolt

2012 ◽  
Vol 268-270 ◽  
pp. 3-6
Author(s):  
Tao Huang ◽  
Yi Yan Zhang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Elevated Temperature ◽  
Room Temperature ◽  
Engineering Application ◽  
Contact Friction ◽  
Element Analysis ◽  
Valuable Data ◽  
The Finite Element Analysis ◽  
Sic Composites

A numerical investigation was conducted to determine the mechanical behavior of C/SiC composites bolt under room temperature and elevated temperature. The influence of the contact friction coefficient on the stress and displacement was considered in the finite element analysis. The FEA results provided some valuable data for the engineering application of C/SiC composites bolt.

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