Vibration reliability test and finite element analysis for flip chip solder joints

2009 ◽  
Vol 49 (7) ◽  
pp. 754-760 ◽  
Author(s):  
F.X. Che ◽  
John H.L. Pang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Solder Joints ◽  
Reliability Test ◽  
Element Analysis ◽  
Vibration Reliability

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

2011 ◽  
Author(s):  
Vikram Venkatadri ◽  
Mark Downey ◽  
Xiaojie Xue ◽  
Dipak Sengupta ◽  
Daryl Santos ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Flexible Substrate ◽  
High Density ◽  
Design Solution ◽  
Design Parameters ◽  
Optimized Design ◽  
Element Analysis ◽  
Bonding Parameters

System-On-Film (SOF) module is a complex integration of a fine pitch high density die and surface mounted discrete devices on a polyimide (PI) film laminate. The die is connected to the film using a thermo-compression flip-chip bonding (TCB) process which is capable of providing a very high density interconnect at less than 50um pitch. Several design and bonding parameters have to be controlled in order to achieve a reliable bond between the Au bumps on the die and the Sn plated Cu traces on the PI film. In the current work, the TCB process is studied using Finite Element Analysis (FEA) to optimize the design parameters and assure proper process margins. The resultant forces acting on the bump-to-trace interfaces are quantified across the different potential geometrical combinations. Baseline simulations showed higher stresses on specific bump locations and stress gradients acting on the bumps along the different sides of the die. These observations were correlated to both the failures and near failures on the actual test vehicles. Further simulations were then utilized to optimize and navigate design tradeoffs at both the die and flexible substrate design levels for a more robust design solution. Construction analysis performed on parts built using optimized design parameters showed significant improvements and correlated well with the simulation results.

Finite-Element Analysis and Reliability Test of Power Steering Gear on the Fatigue Performance

2012 ◽  
Vol 271-272 ◽  
pp. 927-931
Author(s):  
Ying Wu ◽  
Jun Li ◽  
Wen Hao Lu ◽  
Shi Yuan Xiong
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Developed Countries ◽  
The Other ◽  
Fatigue Properties ◽  
Reliability Test ◽  
Element Analysis ◽  
Input Shaft ◽  
Power Steering ◽  
Fea Model

The study on power steering gear is less than other auto parts at home or abroad. Compared with developed countries, the independent design and manufacture of power steering starts late, and lacks practical and effective evaluation standards. The combination of the theoretical analysis, numerical calculation and experimental verification is the key technology to optimize the design or test to evaluate the power steering gear’s function and performance. In this paper, the power steering gear’s finite element analysis(FEA) model was built to analyse the fatigue stress and fatigue life of the power steering gear’s components, such as housing, input shaft and output shaft. and the fatigue test of the power steering gear was also designed and implemented. Research showed that, the power steering gear fatigue properties of FEA and reliability test have the same results. The total damage of 4 A-B-C event cycles is less than 1, the steering gear system is judged safe after 4 event cycles per design requirements. Each component of the power steering gear has different maximum average stress. The stress of the sector shaft, the piston and the screws is very close to the yield stress, which is much larger than the other components, and needed to be treated with caution The maximum stresses of the gear housing are a little over the yield strengths at the stress of 6,118 lbs, which is more dangerous than the other components, and great attention should be paid to it.

Finite element analysis for microwave cure of underfill in flip chip packaging

2004 ◽  
Vol 462-463 ◽  
pp. 436-445 ◽  
Author(s):  
Lie Liu ◽  
Sung Yi ◽  
Lin Seng Ong ◽  
Kerm Sin Chian
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Element Analysis ◽  
Flip Chip Packaging

Applicability of Existing Reliability Models: Focus on Finite Element Modeling of Various BGA Package Designs and Materials

2011 ◽  
Vol 2011 (1) ◽  
pp. 000223-000231
Author(s):  
Ali Fallah-Adl ◽  
Amaneh Tasooji ◽  
Ravi Mahajan ◽  
Nachiket Raravikar ◽  
Richard Harries ◽  
...  
Keyword(s):  
Finite Element ◽  
Flip Chip ◽  
Solder Joints ◽  
State University ◽  
Arizona State University ◽  
Element Analysis ◽  
Package Design ◽  
Reliability Models ◽  
Bga Package ◽  
Global And Local

The work presented here is one of the key elements of an integrated methodology for predicting reliability in packaging systems (IMPRPK) developed by Arizona State University (ASU) and Intel. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks: (1) Finite Element analysis (FEM) to predict loading conditions, (2) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, and (3) development of a probabilistic methodology to achieve an integrated reliability solution. The focus of this paper is on FEM (task 1), evaluating the effect of package design/form-factor and solder materials on the extent of deformation (e.g., inelastic stress/strain and strain energy density) experienced by BGA solder joints. Global and Local FEM results for two different package designs (Flip-chip and wire-bonded FLI) and two different BGA solder materials (lead-free SAC405 and lead-rich eutectic Sn37Pb) are discussed. The FEM results and the applicability of the existing reliability models (e.g., energy-based model) to the complex microelectronics packaging systems are validated through independent comparison with the accelerated thermal cycled (ATC) test data.

Validation of Accelerated Reliability Test Techniques of Industrial Components Using Finite Element Analysis

2014 ◽  
Vol 555 ◽  
pp. 549-554
Author(s):  
Sebastian Marian Zaharia
Keyword(s):  
Experimental Data ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Finite Elements ◽  
Comparative Study ◽  
Accelerated Testing ◽  
Reliability Test ◽  
Element Analysis ◽  
Specific Strain ◽  
Standard Calculation

The purpose of this paper is to validate the accelerated testing methodology of a component from the field of aviation (supple platinum) using the standard calculation method and the analysis with finite elements. The specimens made out of supple platinum from the helicopter’s structure have been put through to accelerated experiments. Using the data resulted from the analysis with finite elements, the data resulted from resistance calculations and the experimental data obtained from the testing of specimens, a comparative study was realized between the specific strain and the normal stress that were obtained. From the results of this comparative study, it is obvious the fact that the method of analysis with finite elements is an efficient instrument to validate the experiments.

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