Influence of Bonding Pressure on the Mechanical Properties of Copper Bumps
Thermocompression bonding is one of the key ways to form interconnections in many hetegrogeneous devices. The quality of metallic joints formed using thermocompression is predominantly determined by the bonding temperature and pressure. In order to achieve a strong and reliable joint, metallic joints in particular copper, which has an oxidative nature, require a high bonding temperature (> 300 °C). However, thermomechanical-related stresses induced during bonding can compromise the performance of the interconnections in the long term. Thus, one way to manage this is to lower the bonding temperature used in forming the interconnections. In this study, copper-copper bonding is successfully demonstrated at a bonding temperature of 80 °C. In order to better understand the effect of bonding pressure on the joint’s performance, the mechanical properties of the individual bulk copper bumps are evaluated using the nanoindentation system. Studies are conducted on the bulk copper bumps subjected to different bonding pressures. Their corresponding yield strength and hardness results are then determined. It is observed that as the applied bonding pressure increases, the mechanical properties of the bulk copper bump reach a certain threshold value and beyond which, properties start to degrade. The microstructure and grain sizes of the copper bumps are also analyzed using the electron backscatter diffraction.