High-temperature AlGaInAs-based 25g DML-DFB lasers operating in O-band for data center use

Author(s):  
Antti Saarela ◽  
Petri Melanen ◽  
Ville Vilokkinen ◽  
Luukas Kuusela ◽  
Petteri Uusimaa ◽  
...  
Keyword(s):  
Author(s):  
Prabjit Singh ◽  
Levente Klein ◽  
Dereje Agonafer ◽  
Jimil M. Shah ◽  
Kanan D. Pujara

The energy used by information technology (IT) equipment and the supporting data center equipment keeps rising as data center proliferation continues unabated. In order to contain the rising computing costs, data center administrators are resorting to cost cutting measures such as not tightly controlling the temperature and humidity levels and in many cases installing air side economizers with the associated risk of introducing particulate and gaseous contaminations into their data centers. The ASHRAE TC9.9 subcommittee, on Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment, has accommodated the data center administrators by allowing short period excursions outside the recommended temperature-humidity range, into allowable classes A1-A3. Under worst case conditions, the ASHRAE A3 envelope allows electronic equipment to operate at temperature and humidity as high as 24°C and 85% relative humidity for short, but undefined periods of time. This paper addresses the IT equipment reliability issues arising from operation in high humidity and high temperature conditions, with particular attention paid to the question of whether it is possible to determine the all-encompassing x-factors that can capture the effects of temperature and relative humidity on equipment reliability. The role of particulate and gaseous contamination and the aggravating effects of high temperature and high relative humidity will be presented and discussed. A method to determine the temperature and humidity x-factors, based on testing in experimental data centers located in polluted geographies, will be proposed.


2011 ◽  
Vol 52-54 ◽  
pp. 354-357
Author(s):  
Zhi Wei Wang ◽  
Long Chen ◽  
Xiang Jing ◽  
Li Ping Han

This paper analyzes the phenomenal essence of the electronic components high temperature alarm in high computer density internet data center and the effect of controllable variables of microthermal environment around the computer racks, presents the risk index of electronic components high temperature alarm, i.e., unmatch ratio; carries out the onsite investigation on the situation of air distribution of two internet data centers in Xi’an city, and evaluates the probability of emerging the high temperature alarm, finally puts forward the suggestions of improving air distribution pattern.


Author(s):  
M.S. Grewal ◽  
S.A. Sastri ◽  
N.J. Grant

Currently there is a great interest in developing nickel base alloys with fine and uniform dispersion of stable oxide particles, for high temperature applications. It is well known that the high temperature strength and stability of an oxide dispersed alloy can be greatly improved by appropriate thermomechanical processing, but the mechanism of this strengthening effect is not well understood. This investigation was undertaken to study the dislocation substructures formed in beryllia dispersed nickel alloys as a function of cold work both with and without intermediate anneals. Two alloys, one Ni-lv/oBeo and other Ni-4.5Mo-30Co-2v/oBeo were investigated. The influence of the substructures produced by Thermo-Mechanical Processing (TMP) on the high temperature creep properties of these alloys was also evaluated.


Author(s):  
B. J. Hockey

Ceramics, such as Al2O3 and SiC have numerous current and potential uses in applications where high temperature strength, hardness, and wear resistance are required often in corrosive environments. These materials are, however, highly anisotropic and brittle, so that their mechanical behavior is often unpredictable. The further development of these materials will require a better understanding of the basic mechanisms controlling deformation, wear, and fracture.The purpose of this talk is to describe applications of TEM to the study of the deformation, wear, and fracture of Al2O3. Similar studies are currently being conducted on SiC and the techniques involved should be applicable to a wide range of hard, brittle materials.


Author(s):  
D. R. Clarke ◽  
G. Thomas

Grain boundaries have long held a special significance to ceramicists. In part, this has been because it has been impossible until now to actually observe the boundaries themselves. Just as important, however, is the fact that the grain boundaries and their environs have a determing influence on both the mechanisms by which powder compaction occurs during fabrication, and on the overall mechanical properties of the material. One area where the grain boundary plays a particularly important role is in the high temperature strength of hot-pressed ceramics. This is a subject of current interest as extensive efforts are being made to develop ceramics, such as silicon nitride alloys, for high temperature structural applications. In this presentation we describe how the techniques of lattice fringe imaging have made it possible to study the grain boundaries in a number of refractory ceramics, and illustrate some of the findings.


Author(s):  
E. R. Kimmel ◽  
H. L. Anthony ◽  
W. Scheithauer

The strengthening effect at high temperature produced by a dispersed oxide phase in a metal matrix is seemingly dependent on at least two major contributors: oxide particle size and spatial distribution, and stability of the worked microstructure. These two are strongly interrelated. The stability of the microstructure is produced by polygonization of the worked structure forming low angle cell boundaries which become anchored by the dispersed oxide particles. The effect of the particles on strength is therefore twofold, in that they stabilize the worked microstructure and also hinder dislocation motion during loading.


Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization


Author(s):  
J. L. Farrant ◽  
J. D. McLean

For electron microscope techniques such as ferritin-labeled antibody staining it would be advantageous to have available a simple means of thin sectioning biological material without subjecting it to lipid solvents, impregnation with plastic monomers and their subsequent polymerization. With this aim in view we have re-examined the use of protein as an embedding medium. Gelatin which has been used in the past is not very satisfactory both because of its fibrous nature and the high temperature necessary to keep its solutions fluid. We have found that globular proteins such as the serum and egg albumins can be cross-linked so as to yield blocks which are suitable for ultrathin sectioning.


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