scholarly journals A Cross Slot Coupling to Enhance Bandwidth of Dual-Layer SIW Structure

2018 ◽  
Vol 10 (2) ◽  
pp. 617
Author(s):  
M. N. Hafiz ◽  
M. H. Jamaluddin ◽  
R. Selvaraju
Keyword(s):  
Satellite Communication ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Low Loss ◽  
Bandwidth Enhancement ◽  
Rectangular Slot ◽  
Pcb Manufacturing ◽  
Design Characteristics ◽  
Output Interface ◽  
Slot Coupling

In this paper, design characteristics of cross slot coupling have been explored and realized in a proposed dual-layer SIW prototype for bandwidth enhancement at 10.0 GHz. The assembled prototype consists of two SMA-microstrip input/output interface with low-loss microstrip-taper via transition and two manually stacked SIW structures electrically connected via a small cross slot coupling design. The proposed dual-layer SIW structure is designed using CST software and fabricated using conventional Printed Circuit Board (PCB) manufacturing process on Rogers 4003 C with  = 3.38 and  = 0.813 mm. The close agreement between simulated and measured results is observed within a frequency range studied of 9.2 GHz to 11.2 GHz with 19.0 % bandwidth performance. The used of cross slot coupling design in the assembled dual-layer SIW structure indicated 9.0 % bandwidth enhancement compared to the conventional multilayer design with rectangular slot coupling. The assembled dual-layer SIW structure with cross slot coupling design shows potential in several RF applications such as radar and satellite communication.

scholarly journals Bandwidth Enhancement of UWB Microstrip Antenna with a Modified Ground Plane

2009 ◽  
Vol 2009 ◽  
pp. 1-7 ◽  
Author(s):  
N. Prombutr ◽  
P. Kirawanich ◽  
P. Akkaraekthalin
Keyword(s):  
Microstrip Antenna ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Ground Plane ◽  
Circuit Board ◽  
Resonant Frequencies ◽  
Bandwidth Enhancement ◽  
Rectangular Slot ◽  
Compact Size ◽  
Circular Patch Antenna

This article presents a bandwidth enhancing technique using a modified ground plane with diagonal edges, rectangular slot, and T-shape cut for the design of compact antennas. The proposed low-cost, compact-size circular patch antenna on 3 cm 5.1 cm printed circuit board (FR-4) is designed and validated through simulations and experiments. Results show that the T-shaped ground plane with the presence of the diagonal cuts at the top corners and the rectangular slots can increase the bandwidth. Return losses of 19 and 26 dB for the first and second resonant frequencies, respectively, can be achieved when the depth of the diagonal cut is 5 mm, the dimension of each rectangular slot is  mm, and the T-shaped size is  mm, providing a 28.67% wider bandwidth than FCC standard.

RF Capacitor Material for Use in Printed Circuit Board

2013 ◽  
Vol 2013 (1) ◽  
pp. 000507-000510
Author(s):  
Jin-Hyun Hwang ◽  
John Andresakis ◽  
Ethan Feinberg ◽  
Bob Carter ◽  
Yuji Kageyama ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Temperature Stability ◽  
Dielectric Strength ◽  
Polymer Composite Material ◽  
Circuit Board ◽  
Discrete Elements ◽  
Low Loss ◽  
Printed Circuit ◽  
Material Issue ◽  
High Dielectric

A novel ceramic-functional-particle-filled polymer composite material has been developed for the use either in discrete elements on the printed circuit board or in being embedded within the packaging substrate for high frequency circuit applications. This material provides the desired properties such as low loss at high frequencies, about 0.002 or less up to 10GHz, and high dielectric strength, among other improved properties. The electrical properties were influenced significantly by the ceramic-functional-particle, i.e. type and particle size/distribution in the polymer matrix. Their contributions to the electric strength and temperature stability of capacitance which is an important material issue for practical device application will be discussed. In addition, capacitance tolerance for manufacturing embedded RF capacitor will be presented in terms of etching uniformity to minimize the variation of the capacitor electrode areas.

scholarly journals Affordable Thin Lens Using Single Polarized Disparate Filter Arrays for Beyond 5G toward 6G

Sensors ◽  
2019 ◽  
Vol 19 (18) ◽  
pp. 3982
Author(s):  
Inseop Yoon ◽  
Seongwoog Oh ◽  
Jungsuek Oh
Keyword(s):  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Design Procedure ◽  
Circuit Board ◽  
Process Conditions ◽  
60 Ghz ◽  
Thin Lens ◽  
Gain Enhancement ◽  
Unit Cells ◽  
Pcb Manufacturing

This paper proposes a novel design approach for a thin lens with the aim of overcoming fineness limits in the commercial millimeter wave printed circuit board (PCB) manufacturing process. The PCB manufacturing process typically does not allow the fabrication of metallic patterns with a gap and width of less than 100 μm. This hampers expanding thin lens technology to 5G commercial applications, especially when such technology is considered for 60 GHz or higher frequency, which requires a finer gap and width of metallic traces. This paper proposes that problematic process conditions can be mitigated when a lens is designed by establishing single-polarized lumped element models where larger capacitance and inductance values can be obtained for the same patch and grid unit cells. While the proposed design technique is more advantageous at higher target frequencies, a 60 GHz application and a wireless backhaul system is selected because of a limited range of frequencies that can be measured by an available vector network analyzer. The required gap or width of metallic traces can be widened significantly by using the proposed single-polarized unit cells to acquire the same in-plane capacitance or inductance. This enables the lens operating at higher-frequency under the process limits in fabricable fine traces. Finally, the effectiveness of the simulated design procedure is demonstrated by fabricating a 60 GHz thin lens that can achieve a gain enhancement of 16 dB for a 4 × 4 patch antenna array with a gain of 16.5 dBi.

scholarly journals Design of a Broadband Coplanar Waveguide-Fed Antenna Incorporating Organic Solar Cells with 100% Insolation for Ku Band Satellite Communication

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 142 ◽  
Author(s):  
Yadgar I. Abdulkarim ◽  
Lianwen Deng ◽  
Halgurd N. Awl ◽  
Fahmi F. Muhammadsharif ◽  
Olcay Altintas ◽  
...  
Keyword(s):  
Organic Solar Cells ◽  
Satellite Communication ◽  
Printed Circuit Board ◽  
Coplanar Waveguide ◽  
Circuit Board ◽  
Device Structure ◽  
International Telecommunication Union ◽  
International Telecommunication ◽  
Good Agreement ◽  
Ku Band

A broadband coplanar waveguide (CPW)-fed monopole antenna based on conventional CPW-fed integration with an organic solar cell (OSC) of 100% insolation is suggested for Ku band satellite communication. The proposed configuration was designed to allow for 100% insolation of the OSC, thereby improving the performance of the antenna. The device structure was fabricated using a Leiterplatten-Kopierfrasen (LPKF) prototyping Printed circuit board (PCB) machine, while a vector network analyzer was utilized to measure the return loss. The simulated results demonstrated that the proposed antenna was able to cover an interesting operating frequency band from 11.7 to 12.22 GHz, which is in compliance with the International Telecommunication Union (ITU). Consequently, a 3 GHz broadband in the Ku band was achieved, along with an enhancement in the realized gain of about 6.30 dB. The simulation and experimental results showed good agreement, whereby the proposed structure could be specifically useful for fixed-satellite-services (FSS) operating over the frequency range from the 11.7 to 12.22 GHz (downlink) band.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

Coarse Resolution Defect Localization Algorithm for an Automated Visual PCB Inspection

2012 ◽  
Author(s):  
Zuwairie Ibrahim ◽  
Syed Abdul Rahman Al-Attas ◽  
Zulfakar Aspar
Keyword(s):  
Manufacturing Industry ◽  
Printed Circuit Board ◽  
Etching Process ◽  
Circuit Board ◽  
Automated System ◽  
Localization Algorithm ◽  
Printing Process ◽  
Coarse Resolution ◽  
Defect Localization ◽  
Pcb Manufacturing

Satu daripada asas utama dalam industri pembuatan elektronik ialah pembuatan papan litar bercetak (PCB). Pembuatan PCB pada masa kini perlu melalui proses kikisan. Ini adalah proses satu hala. Proses cetakan yang dilakukan sebelum proses kikisan adalah penyebab utama kepada kecacatan pada PCB. Setelah PCB dikikis, kecacatan itu, jika ada menyebabkan PCB menjadi tidak berguna lagi. Disebabkan oleh keletihan dan keperluan kecepatan, pemeriksaan secara manual tidak efektif dilakukan untuk memeriksa setiap PCB. Oleh itu, pengilang memerlukan sebuah sistem automatik untuk mengesan kecacatan secara masa nyata yang mungkin berlaku semasa proses percetakan. Kecacatan itu akan dikesan dengan menggunakan algoritma pembezaan imej berasaskan wavelet. Seterusnya, kertas kerja ini mencadangkan satu algoritma untuk pemeriksaan visual PCB secara automatik yang berupaya mengesan dan menyari kecacatan pada PCB. Algoritma ini dijalankan pada resolusi kasar pembezaan imej bertujuan untuk mengesan kawasan kecacatan pada resolusi halus imej PCB yang di periksa. Kata kunci: pengesanan kecacatan; resolusi kasar; wavelets; pemeriksaan PCB One of the backbones in electronic manufacturing industry is the printed circuit board (PCB) manufacturing. Current practice in PCB manufacturing requires an etching process. This process is an irreversible process. Printing process, which is done before the etching process, caused most of the destructive defects found on the PCB. Once the laminate is etched, the defects, if exist would cause the PCB laminate to become useless. Due to the fatigue and speed requirement, manual inspection is ineffective to inspect every printed laminate. Therefore, manufacturers require an automated system to detect the defects online which may occur during the printing process. The defect is detected by utilizing wavelet-based image difference algorithm. Hence, this paper proposes an algorithm for an automated visual PCB inspection that is able to automatically locate and extract any defect on a PCB laminate. The algorithm works on the coarse resolution differenced image in order to locate the defective area on the fine resolution tested PCB image. Key words: defect localization; coarse resolution; wavelets; PCB inspection

Machine Vision-Aided Quality Decision System for Solder Joint Defect Evaluation

2012 ◽  
Vol 268-270 ◽  
pp. 1393-1397
Author(s):  
Chien Chih Wang
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Inspection System ◽  
Defect Classification ◽  
Decision System ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Joint Quality ◽  
Quality Decision

To improve the printed circuit board (PCB) manufacturing process, it is important to have an automatic inspection system that classifies information regarding defects in solder joints. This paper proposes a quality decision system for solder joint defect classification on a PCB. An experiment was conducted to demonstrate the application of the system. The results showed that the inspection accuracy reached 94%, which is superior to the results achieved by other methods. The results of this study provide an effective solution for the inspection of the solder joint quality.

Fabrication and dielectric properties of BADCy/Ni0.5Ti0.5NbO4 composites for ultra-low-loss printed circuit board application

2016 ◽  
Vol 42 (1) ◽  
pp. 234-241 ◽  
Author(s):  
Biao Zhang ◽  
Feng Ye ◽  
Ye Gao ◽  
Shichao Liu ◽  
Qiang Liu ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Low Loss ◽  
Printed Circuit
Sign in / Sign up

Export Citation Format

Share Document