Effect of passivation on stress relaxation in electroplated copper films

2006 ◽  
Vol 21 (6) ◽  
pp. 1512-1518 ◽  
Author(s):  
Dongwen Gan ◽  
Paul S. Ho ◽  
Yaoyu Pang ◽  
Rui Huang ◽  
Jihperng Leu ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Interfacial Adhesion ◽  
Boundary Diffusion ◽  
Isothermal Condition ◽  
Copper Films ◽  
Relaxation Rates ◽  
Cu Films ◽  
Electroplated Copper ◽  
The Relationship ◽  
Kinetics Of

The present study investigated the effect of passivation on the kinetics of interfacial mass transport by measuring stress relaxation in electroplated Cu films with four different cap layers: SiN, SiC, SiCN, and a Co metal cap. Stress curves measured under thermal cycling showed different behaviors for the unpassivated and passivated Cu films, but were essentially indifferent for the films passivated with different cap layers. On the other hand, stress relaxation measured under an isothermal condition revealed clearly the effect of passivation, indicating that interface diffusion controls the kinetics of stress relaxation. The relaxation rates in the passivated Cu films were found to decrease in the order of SiC, SiCN, SiN, and metal caps. This correlates well with previous studies on the relationship between interfacial adhesion and electromigration. A kinetic model based on coupling of interface and grain-boundary diffusion was used to deduce the interface diffusivities and the corresponding activation energies.

Barrier Effect on Electroplated Cu Films

1999 ◽  
Vol 564 ◽  
Author(s):  
R. Faust ◽  
Q. Jiang
Keyword(s):  
Room Temperature ◽  
Copper Films ◽  
Barrier Effect ◽  
Barrier Material ◽  
Dramatic Effect ◽  
Cu Films ◽  
Barrier Materials ◽  
Electroplated Copper

AbstractThe effect of various barrier materials on the microstructure of electroplated Copper films was investigated. Analysis of the Cu was performed at the as-deposited, room temperature stabilized, and annealed states. It shows that the barrier material can have a dramatic effect on the properties of electroplated Cu.

EFFECT OF ULTRASONIC ON COPPER ELECTROPLATING FROM THE NON-CYANIDE ALKALINE BATHS

2014 ◽  
Vol 21 (04) ◽  
pp. 1450057
Author(s):  
MINGGANG LI ◽  
SHUANGSHUANG HU ◽  
YEJIONG YANG ◽  
SHUHAN XU ◽  
XIXI ZHAO ◽  
...  
Keyword(s):  
Complexing Agent ◽  
Copper Films ◽  
Ultrasonic Power ◽  
Copper Electrodeposition ◽  
Cu Films ◽  
Copper Electroplating ◽  
Alkaline Baths ◽  
The Relationship ◽  
Nucleation And Growth Mechanism ◽  
Transient Measurements

Effects of the different ultrasonic powers on copper electrodeposition from non-cyanide alkaline baths by using pyrophosphate as complexing agent were investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements were used to characterize the nucleation and growth mechanism. It is very obvious that the reduction potential moves to more positive one as the ultrasonic power increases. The quartz crystal microbalance (QCM) and chronoamperometric method were used to study the relationship between the mass change and the deposition time. It was found that the current efficiency of electrolyte under 0, 60, 80 and 100 W is 91.95%, 92.14%, 89.25% and 96.11%, respectively measured by QCM measurements. The surface morphology of the electrodeposited Cu films is analyzed by scanning electron microscopy (SEM). The morphology of copper films electrodeposited under the power of 60 W and 80 W presents a compact surface and the grains are fine and uniform.

Impact of Low-Temperature Anneals of Electroplated Copper Films on Copper CMP Removal Rates

1999 ◽  
Vol 566 ◽  
Author(s):  
Konstantin Smekalin ◽  
Qing-Tang Jiang
Keyword(s):  
Room Temperature ◽  
Rate Increase ◽  
Removal Rate ◽  
Inert Gas ◽  
Copper Films ◽  
Cu Films ◽  
Film Hardness ◽  
Cu Film ◽  
Electroplated Copper ◽  
Over Time

CMP removal rate (RR) of electrodeposited Cu film was found to increase by 35% over time after plating. The RR increase was attributed to Cu film hardness reduction of 43% and grain growth from the initial 0.1urn at as-deposit to lum at the final stage at room temperature. The removal rate increase will translate to variations in manufacturing environment and are therefore unacceptable. It was found that annealing at ∼100C for 5 minutes in inert gas will stabilize Cu films and provide consistent CMP removal rate.

scholarly journals Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

2020 ◽  
Author(s):  
Alice Lassnig ◽  
Velislava L. Terziyska ◽  
Jakub Zalesak ◽  
Tanja Jörg ◽  
Daniel M. Toebbens ◽  
...  
Keyword(s):  
Interfacial Adhesion ◽  
Cu Films ◽  
Glass Substrates ◽  
Microelectronic Devices ◽  
Microstructural Effects

scholarly journals Properties of Silicone Rubber-Based Composites Reinforced with Few-Layer Graphene and Iron Oxide or Titanium Dioxide

Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1550
Author(s):  
Vineet Kumar ◽  
Anuj Kumar ◽  
Minseok Song ◽  
Dong-Joo Lee ◽  
Sung-Soo Han ◽  
...  
Keyword(s):  
Magnetic Properties ◽  
Titanium Dioxide ◽  
Iron Oxide ◽  
Stress Relaxation ◽  
Silicone Rubber ◽  
Room Temperature ◽  
Relaxation Rates ◽  
Layer Graphene ◽  
Few Layer Graphene ◽  
Mechanical Actuation

The increasing demand for polymer composites with novel or improved properties requires novel fillers. To meet the challenges posed, nanofillers such as graphene, carbon nanotubes, and titanium dioxide (TiO2) have been used. In the present work, few-layer graphene (FLG) and iron oxide (Fe3O4) or TiO2 were used as fillers in a room-temperature-vulcanized (RTV) silicone rubber (SR) matrix. Composites were prepared by mixing RTV-SR with nanofillers and then kept for vulcanization at room temperature for 24 h. The RTV-SR composites obtained were characterized with respect to their mechanical, actuation, and magnetic properties. Fourier-transform infrared spectroscopy (FTIR) analysis was performed to investigate the composite raw materials and finished composites, and X-ray photoelectron spectroscopy (XPS) analysis was used to study composite surface elemental compositions. Results showed that mechanical properties were improved by adding fillers, and actuation displacements were dependent on the type of nanofiller used and the applied voltage. Magnetic stress-relaxation also increased with filler amount and stress-relaxation rates decreased when a magnetic field was applied parallel to the deformation axes. Thus, this study showed that the inclusion of iron oxide (Fe3O4) or TiO2 fillers in RTV-SR improves mechanical, actuation, and magnetic properties.

Oxidation of Olefins Representing Some Structural Units of GR-S

1952 ◽  
Vol 25 (1) ◽  
pp. 21-32 ◽  
Author(s):  
W. C. Warner ◽  
J. Reid Shelton
Keyword(s):  
Phenyl Group ◽  
Kinetic Mechanism ◽  
Oxidation Reactions ◽  
Chain Reaction ◽  
Instantaneous Rate ◽  
Initial Oxygen ◽  
Oxidation Of Olefins ◽  
A Minor ◽  
The Relationship ◽  
Kinetics Of

Abstract Three olefins were oxidized in the liquid phase with molecular oxygen to determine the kinetics of the oxidation reactions and the relationship to oxidation of rubber. The instantaneous rate of oxidation was found to be related to the analytically determined olefin and peroxide concentrations by the equation : Rate=k (unreacted olefin)(peroxide), where rate equals moles of oxygen per mole of original olefin per hour and the parentheses represent molarities. Presence of a phenyl group was found to affect k, but only in a minor way, indicating that the same fundamental kinetic mechanism applies in both aromatic and aliphatic olefins. The data are consistent with the general kinetic mechanism of Bolland involving oxygen attack at the alpha-methylenic group. However, it appears probable that initial oxygen attack can also occur at the double bond, resulting in the formation of a peroxide biradical, which may then react with other olefin molecules, initiating the usual chain reaction mechanism.

CORRELATION BETWEEN ELECTRIC CHARGING OF THE SAMPLE SURFACE AND KINETICS OF OPTICALLY STIMULATED EXOELECTRON EMISSION (OSEE) FROM CRYOSOLIDIFIED NaCl SOLUTION

1990 ◽  
Vol 04 (03) ◽  
pp. 201-209
Author(s):  
A. GIEROSZYŃSKI
Keyword(s):  
Electric Fields ◽  
Surface Potential ◽  
Surface Region ◽  
Sample Surface ◽  
Exoelectron Emission ◽  
Nacl Solution ◽  
Emitter Surface ◽  
Emitter Layer ◽  
The Relationship ◽  
Kinetics Of

It was found that OSEE kinetics from electron bombarded cryosolidified NaCl solution, depend on electric charging of the sample surface. It was shown that from the relationship between the maximum surface potential and the parameters of OSEE kinetic, intensities of electric fields in the emitter layer could be estimated. It is supposed that nonhomogeneous electric fields existing in the emitter surface region, influence the emission levels responsible for the course of OSEE kinetics.

Extrusion of stiffening ribs on body parts with local heating

2021 ◽  
pp. 72-74
Author(s):  
Keyword(s):  
Velocity Field ◽  
Stress Relaxation ◽  
Local Heating ◽  
Hot Extrusion ◽  
Body Parts ◽  
Calculation Results ◽  
Energy Equilibrium ◽  
Stiffening Ribs ◽  
Analytical Expressions ◽  
Kinetics Of

A scheme is proposed and analytical expressions are obtained for calculating the kinematics, pressure and damageability of the material during hot extrusion of ribs on body parts. The equations of states during creep, energy equilibrium, kinetics of material discontinuity are used. The calculation results are presented. Keywords: extrusion, local heating, stiffening rib, viscosity, plasticity, stress relaxation, pressure, velocity field [email protected], [email protected]

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

2014 ◽  
Author(s):  
Pornvitoo Rittinon ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Diffraction Method ◽  
Electron Back Scatter Diffraction ◽  
High Resistivity ◽  
Copper Thin Film ◽  
Electroplated Copper ◽  
The Relationship

Copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (Trough Silicon Via), fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grain boundaries in the films. Porous or sparse grain boundaries show very high resistivity and brittle fracture characteristic in the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on the Wiedemann-Franz’s law. Since the copper interconnections are used not only for the electrical conduction but also for the thermal conduction, it is very important to quantitatively evaluate the crystallinity of the polycrystalline thin-film materials and clarify the relationship between the crystallinity and thermal properties of the films. The crystallinity of the interconnections were quantitatively evaluated using an electron back-scatter diffraction method. It was found that the porous grain boundaries which contain a significant amount of vacancies increase the local electrical resistance in the interconnections, and thus, cause the local high Joule heating. Such porous grain boundaries can be eliminated by control the crystallinity of the seed layer material on which the electroplated copper thin film is electroplated.

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