Electron-Beam Assisted CVD of Silicon Homoepitaxial Films

1988 ◽  
Vol 129 ◽  
Author(s):  
J. P. West ◽  
C. B. Fleddermann
Keyword(s):  
Electron Beam ◽  
Single Crystal Silicon ◽  
Beam Current ◽  
Silicon Substrates ◽  
Beam Diameter ◽  
Epitaxial Silicon ◽  
Large Area ◽  
Plasma Etch ◽  
Crystal Silicon

ABSTRACTThe use of a wide-area electron beam to aid the deposition of epitaxial silicon films has been studied. The electron beam used in this study is generated using a cold cathode, abnormal-glow discharge which allows a wide variation of electron energy and beam current. Depositions are performed on single crystal silicon substrates which are prepared using standard wet chemical silicon cleaning techniques and an in situ plasma etch using nitrogen tri-fluoride diluted in hydrogen. The beam diameter is approximately 10 cm and can readily be scaled up to accommodate larger diameters, allowing great potential for large area single wafer deposition. Using electron beams generated in this system, we have demonstrated enhanced growth rates and improved crystalline quality for films grown withelectronbeam enhancement.

Laser Writing of High Purity Gold Lines

1989 ◽  
Vol 158 ◽  
Author(s):  
M. Jubber ◽  
J.I.B. Wilson ◽  
J.L. Davidson ◽  
P. John ◽  
P.G. Roberts
Keyword(s):  
Rectangular Cross Section ◽  
Single Crystal Silicon ◽  
Gold Surface ◽  
Decomposition Temperature ◽  
Silicon Substrates ◽  
Beam Diameter ◽  
Scanning Calorimetry ◽  
Crystal Silicon ◽  
Ion Laser ◽  
Stage Process

ABSTRACTGold tracks have been deposited on thermally oxidised and single crystal silicon, gold and nichrome coated silicon wafers by pyrolytic decomposition of gaseous alkyl (triethyl phosphine) gold(I) complexes using focussed 514 nm radiation from an argon ion laser. The precursors, RAu(I)Et3P, R = CH3, C2H5 are low melting point crystalline solids with relatively high vapour pressures (∼5 mtorr). They are representative of a class of compounds being evaluated for laser deposition of gold. Differential scanning calorimetry, DSC, shows that the thermal decomposition of MeAu(I)Et3P in the solid state is a two-stage process. The decomposition temperature is 63 ± 1°C. Tracks were deposited at laser scan speeds up to 35 μm s−1 with a beam diameter (1/e2) at the focus of ∼12 μm. SIMS, EDX and laser ionisation microprobe analysis, LIMA, were used to determine the chemical composition of the tracks. The purity of >98% is consistent with the measured resistivities (4.2 μΩ cm) at room temperature compared to bulk gold (∼2 μΩ cm). These resistivities were achieved without post deposition annealing. Stylus profilimetry and SEM data showed the lines produced from MeAu(I)Et3P have a virtually rectangular cross-section. Together with the absence of the ubiquitous λ-ripples, this feature suggests that deposition is more rapid on the gold surface than on the SiO2 substrate. Laser power thresholds are lower for silicon substrates coated with thin (5 - 10°A) films of gold or nichrome.

Heteroepitaxial Metal Oxides on Silicon by Laser Ablation

1990 ◽  
Vol 191 ◽  
Author(s):  
D. B. Fenner ◽  
D. K. Fork ◽  
G. A. N. Connell ◽  
J. B. Boyce ◽  
F. A. Ponce ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Single Crystal Silicon ◽  
Native Oxide ◽  
Silicon Substrates ◽  
X Ray Diffraction ◽  
Crystal Silicon ◽  
Ybco Films ◽  
Zero Resistance ◽  
High Degree

ABSTRACTThin epitaxial films of cubic - fluorite structured PrO2 and YSZ (yttria- stabilized zirconia) were grown on single crystal silicon substrates using the laser ablation - deposition technique. X-ray diffraction theta two - theta, omega rocking and phi scans indicate a high degree of epitaxial orientation of the films to the Si lattice. The highest quality of epitaxy was obtained with the PrO2 [111] oriented normal to Si(111) surfaces and the cubic YSZ [100] normal to Si(100) surfaces. For both PrO2 and YSZ, high epitaxial quality required the removal of the Si native oxide prior to deposition and careful control of the deposition environment. It was further found that the YSZ films on Si(100) were an excellent surface for subsequent laser ablation of YBCO films by the usual in situ process. The resistivity of this YBCO was ≈ 250 micro-ohm-cm at 300 K, extrapolated to the resistivity -temperature origin, showed a sharp transition to zero resistance at ≈ 85 K and was nearly identical to high quality YBCO films deposited on (bulk) YSZ substrates.

Silicon Carbide: Progress in Crystal Growth

1987 ◽  
Vol 97 ◽  
Author(s):  
J. Anthony Powell
Keyword(s):  
Silicon Carbide ◽  
Crystal Growth ◽  
High Temperature ◽  
Epitaxial Growth ◽  
Recent Progress ◽  
Single Crystal Silicon ◽  
Silicon Substrates ◽  
Large Area ◽  
High Quality ◽  
Crystal Silicon

ABSTRACTSilicon carbide (SiC), with a favorable combination of semiconducting and refractory properties, has long been a candidate for high temperature semiconductor applications. Research on processes for producing the needed large-area high quality single crystals has proceeded sporadically for many years. Two characteristics of SiC have aggravated the problem of its crystal growth. First, it cannot be melted at any reasonable pressure, and second, it forms many different crystalline structures, called polytypes. Recent progress in the development of two crystal growth processes will be described. These processes are the modified Lely process for the growth of the alpha polytypes (e.g. 6H SiC), and a process for the epitaxial growth of the beta polytype (i.e. 3C or cubic SiC) on single crystal silicon substrates. A discussion of the semiconducting qualities of crystals grown by various techniques will also be included.

scholarly journals Design and Performance of a Miniaturized, Low-Energy, Large Beam Spot Electron Flood Gun

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 648
Author(s):  
Chenhui Deng ◽  
Li Han ◽  
Yan Wang
Keyword(s):  
Electron Beam ◽  
Beam Current ◽  
Low Energy ◽  
Electron Optics ◽  
Large Area ◽  
Beam Spot ◽  
Scanning Method ◽  
Simulation Results ◽  
And Performance

Charge accumulation often occurs in electron optics equipment and interferes with their operation. The trouble can be handled by using the electron flood gun. However, there are still some scenarios where neutralization is not as desired. To achieve a better charge neutralization effect and to facilitate work in confined spaces, a small size, low-energy electron flood gun providing a large area and uniform electron beam has been required. This article employs Munro’s Electron Beam Software (MEBS) to simulate the effect of the structure parameters on the performance of the beam. Based on the simulation results, the electron flood gun is processed and assembled. To verify the performance of the electron flood gun, this paper proposes a new “pinhole scanning method”. By using the method, we have achieved in-situ measurements of beam current and beam spot. The experimental results generally match the simulation results, which demonstrates that the electron flood gun has good performance and is likely to have many applications.

TEM characterization of Au/Polysilicon interactions

1990 ◽  
Vol 48 (4) ◽  
pp. 650-651
Author(s):  
N. David Theodore ◽  
Leslie H. Allen ◽  
C. Barry Carter ◽  
James W. Mayer
Keyword(s):  
Solid Phase ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Electrical Contacts ◽  
Silicon Substrates ◽  
Crystal Silicon ◽  
Transmission Electron ◽  
Polysilicon Films ◽  
The Stability

Metal/polysilicon investigations contribute to an understanding of issues relevant to the stability of electrical contacts in semiconductor devices. These investigations also contribute to an understanding of Si lateral solid-phase epitactic growth. Metals such as Au, Al and Ag form eutectics with Si. reactions in these metal/polysilicon systems lead to the formation of large-grain silicon. Of these systems, the Al/polysilicon system has been most extensively studied. In this study, the behavior upon thermal annealing of Au/polysilicon bilayers is investigated using cross-section transmission electron microscopy (XTEM). The unique feature of this system is that silicon grain-growth occurs at particularly low temperatures ∽300°C).Gold/polysilicon bilayers were fabricated on thermally oxidized single-crystal silicon substrates. Lowpressure chemical vapor deposition (LPCVD) at 620°C was used to obtain 100 to 400 nm polysilicon films. The surface of the polysilicon was cleaned with a buffered hydrofluoric acid solution. Gold was then thermally evaporated onto the samples.

scholarly journals Amorphous thin-film oxide power devices operating beyond bulk single-crystal silicon limit

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yuki Tsuruma ◽  
Emi Kawashima ◽  
Yoshikazu Nagasaki ◽  
Takashi Sekiya ◽  
Gaku Imamura ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Flexible Substrate ◽  
Single Crystal Silicon ◽  
Bulk Single Crystal ◽  
Next Generation ◽  
Power Devices ◽  
Large Area ◽  
Crystal Silicon ◽  
Amorphous Thin Film

AbstractPower devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on “bulk” and “single-crystal” semiconductors require high temperature (> 1000 °C) fabrication processing and a thick (typically a few tens to 100 μm) drift layer, thereby preventing their applications to compact devices, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on “thin-films” of “amorphous” oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (< 1 × 10–4 Ω cm2) and high breakdown voltage VBD (~ 100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.

A Current Conduction Mechanism in Laser Recrystallized Silicon Metal-Oxide-Semiconductor Transistors

1983 ◽  
Vol 23 ◽  
Author(s):  
Han-Sheng Lee
Keyword(s):  
Conduction Mechanism ◽  
Single Crystal Silicon ◽  
Silicon Films ◽  
Oxide Semiconductor ◽  
Silicon Substrates ◽  
Mos Transistors ◽  
Crystal Silicon ◽  
Ion Laser ◽  
Argon Ion ◽  
A Current

ABSTRACTN-channel MOS transistors were fabricated on silicon films that had been recrystallized by an argon ion laser at different power levels. These transistors showed electrical characteristics similar, but somewhat inferior to those devices fabricated on single crystal silicon substrates. These differences are attributed to the presence of trapping states at the grain boundaries of the crystallites in the recrystallized silicon. A coulombic scattering model is presented to explain these differences. In the case of films annealed at low laser power, an additional factor of nonuniform trap state distribution is invoked to explain device characteristics. This model provides an adequate explanation for the observed transport properties of transistors fabricated from recrystallized silicon films.

Single Crystal Silicon Carbide On Silicon Using A Supersonic Gas Jet Of Methylsilane

1997 ◽  
Vol 483 ◽  
Author(s):  
S. A. Ustin ◽  
C. Long ◽  
L. Lauhon ◽  
W. Ho
Keyword(s):  
Growth Rate ◽  
Growth Rates ◽  
Single Crystal Silicon ◽  
Maximum Growth ◽  
X Ray Diffraction ◽  
Crystal Silicon ◽  
Cross Sectional ◽  
Supersonic Molecular Beam ◽  
Transmission Electron

AbstractCubic SiC films have been grown on Si(001) and Si(111) substrates at temperatures between 600 °C and 900 °C with a single supersonic molecular beam source. Methylsilane (H3SiCH3) was used as the sole precursor with hydrogen and nitrogen as seeding gases. Optical reflectance was used to monitor in situ growth rate and macroscopic roughness. The growth rate of SiC was found to depend strongly on substrate orientation, methylsilane kinetic energy, and growth temperature. Growth rates were 1.5 to 2 times greater on Si(111) than on Si(001). The maximum growth rates achieved were 0.63 μm/hr on Si(111) and 0.375μm/hr on Si(001). Transmission electron diffraction (TED) and x-ray diffraction (XRD) were used for structural characterization. In-plane azimuthal (ø-) scans show that films on Si(001) have the correct 4-fold symmetry and that films on Si(111) have a 6-fold symmetry. The 6-fold symmetry indicates that stacking has occurred in two different sequences and double positioning boundaries have been formed. The minimum rocking curve width for SiC on Si(001) and Si(111) is 1.2°. Fourier Transform Infrared (FTIR) absorption was performed to discern the chemical bonding. Cross Sectional Transmission Electron Microscopy (XTEM) was used to image the SiC/Si interface.

scholarly journals Amorphous thin-film oxide power devices operating beyond bulk single-crystal silicon limit

2021 ◽  
Author(s):  
Yuki Tsuruma ◽  
Emi Kawashima ◽  
Yoshikazu Nagasaki ◽  
Takashi Sekiya ◽  
Gaku Imamura ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Flexible Substrate ◽  
Single Crystal Silicon ◽  
Bulk Single Crystal ◽  
Next Generation ◽  
Power Devices ◽  
Large Area ◽  
Crystal Silicon ◽  
Amorphous Thin Film

Abstract Power devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on “bulk” and “single-crystal” semiconductors require high temperature (>1000°C) fabrication processing and a thick (typically a few tens to 100 μm) drift layer1, thereby preventing their applications to compact devices2, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on “thin-films” of “amorphous” oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon3). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (<1×10-4 Ωcm2) and high breakdown voltage VBD (~100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.

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