Investigation of the Interface Integrity of the Thermally Stable Wn/GaAs Schottky Contacts

1989 ◽  
Vol 148 ◽  
Author(s):  
J. Ding ◽  
B. Lee ◽  
K. M. Yu ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
Amorphous Structure ◽  
Schottky Contacts ◽  
Thermally Stable ◽  
Contact Interface ◽  
Interface Morphology ◽  
Cross Sectional ◽  
X Ray ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Morphology And Structure

ABSTRACTWNx,/GaAs Schottky contacts formed by reactive sputtering were found to be thermally stable up to an annealing temprature of ∼9400°C. The interface morphology and structure of this contact under high temperature annealing conditions ( > 700°C ) have been investigated by transmission electron microscopy (TEM) and x-ray diffractometry techniques. For the as-deposited samples, the thin film had an amorphous structure. After annealing at high temperatures, the amorphous phase transformed to α-W and W2N phases. However, the contact interface remained thermally stable up to 850°C. Cross-sectional TEM micrographs revealed that annealing at temperatures above 850°C resulted in the formation of ‘pockets’ beneath the interface. This phenomenon has been correlated with the electrical properties of the contacts, e. g., an enhancement of the barrier height of the contact. Comparisons between the interface morphology of this system and other refractory metal nitride contacts (e. g., TiN/GaAs) are also presented.

scholarly journals A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee
Keyword(s):  
Annealing Temperature ◽  
Phase Evolution ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
X Ray Diffraction ◽  
Temperature Coefficient Of Resistance ◽  
X Ray ◽  
High Entropy ◽  
Transmission Electron ◽  
Thin Film Resistors

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).

Direct Deposition Reactions Between Nickel and Silicon Substrates

1993 ◽  
Vol 311 ◽  
Author(s):  
Lin Zhang ◽  
Douglas G. Ivey
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Silicon Substrates ◽  
Silicide Formation ◽  
Cross Sectional ◽  
Deposition Rates ◽  
Plan View ◽  
X Ray ◽  
Si Substrates ◽  
Transmission Electron

ABSTRACTSilicide formation through deposition of Ni onto hot Si substrates has been investigated. Ni was deposited onto <100> oriented Si wafers, which were heated up to 300°C, by e-beam evaporation under a vacuum of <2x10-6 Torr. The deposition rates were varied from 0.1 nm/s to 6 nm/s. The samples were then examined by both cross sectional and plan view transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy and electron diffraction. The experimental results are discussed in terms of a new kinetic model.

New method for the production of bulk amorphous materials of Nd–Fe–B alloys

2005 ◽  
Vol 20 (3) ◽  
pp. 563-566 ◽  
Author(s):  
Tetsuji Saito ◽  
Hiroyuku Takeishi ◽  
Noboru Nakayama
Keyword(s):  
Electron Microscopy ◽  
Amorphous Materials ◽  
Room Temperature ◽  
Amorphous Structure ◽  
X Ray Diffraction ◽  
Bulk Materials ◽  
X Ray ◽  
Transmission Electron ◽  
Melt Spun ◽  
Melt Spun Ribbons

We report a new compression shearing method for the production of bulk amorphous materials. In this study, amorphous Nd–Fe–B melt-spun ribbons were successfully consolidated into bulk form at room temperature by the compression shearing method. X-ray diffraction and transmission electron microscopy studies revealed that the amorphous structure was well maintained in the bulk materials. The resultant bulk materials exhibited the same magnetic properties as the original amorphous Nd–Fe–B materials.

scholarly journals The Reliability Improvement of Cu Interconnection by the Control of Crystallizedα-Ta/TaNxDiffusion Barrier

2015 ◽  
Vol 2015 ◽  
pp. 1-6 ◽  
Author(s):  
Wei-Lin Wang ◽  
Chia-Ti Wang ◽  
Wei-Chun Chen ◽  
Kuo-Tzu Peng ◽  
Ming-Hsin Yeh ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Practical Application ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Reliability Improvement ◽  
N Concentration ◽  
Transmission Electron ◽  
Diffraction Patterns ◽  
Interconnection Structure

Ta/TaN bilayers have been deposited by a commercial self-ionized plasma (SIP) system. The microstructures of Ta/TaN bilayers have been systematically characterized by X-ray diffraction patterns and cross-sectional transmission electron microscopy. TaN films deposited by SIP system are amorphous. The crystalline behavior of Ta film can be controlled by the N concentration of underlying TaN film. On amorphous TaN film with low N concentration, overdeposited Ta film is the mixture ofα- andβ-phases with amorphous-like structure. Increasing the N concentration of amorphous TaN underlayer successfully leads upper Ta film to form pureα-phase. For the practical application, the electrical property and reliability of Cu interconnection structure have been investigated by utilizing various types of Ta/TaN diffusion barrier. The diffusion barrier fabricated by the combination of crystallizedα-Ta and TaN with high N concentration efficiently reduces the KRc and improves the EM resistance of Cu interconnection structure.

Crystallization of Germanium-Carbon Alloys - Structure and Electronic Transport

1997 ◽  
Vol 467 ◽  
Author(s):  
T.-M. John ◽  
J. Bläsing ◽  
P. Veit ◽  
T. Drüsedau
Keyword(s):  
Electron Microscopy ◽  
Crystallite Size ◽  
Electronic Transport ◽  
Cluster Formation ◽  
Electronic Conductivity ◽  
Rf Magnetron Sputtering ◽  
Cross Sectional ◽  
Structural Investigations ◽  
X Ray ◽  
Transmission Electron

ABSTRACTAmorphous Ge1-xCx alloys were deposited by rf-magnetron sputtering from a germanium target in methane-argon atmosphere. Structural investigations were performed by means of wide and small angle X-ray scattering, X-ray reflectometry and cross-sectional transmission electron microscopy. The electronic transport properties were characterized using Hall-measurements and temperature depended conductivity. The results of X-ray techniques together with the electron microscopy clearly proof the existence of a segregation of the components and cluster formation already during deposition. The temperature dependence of the electronic conductivity in the as-prepared films follows the Mott' T−1/4 law, indicating transport by a hopping process. After annealing at 870 K, samples with x≤0.4 show crystallization of the Ge-clusters with a crystallite size being a function of x. After Ge-crystallization, the conductivity increases by 4 to 5 orders of magnitude. Above room temperature, electronic transport is determined by a thermally activated process. For lower temperatures, the σ(T) curves show a behaviour which is determined by the crystallite size and the free carrier concentration, both depending on the carbon content.

Interfacial Characteristics for LaAlO3 Gate Dielectric on S Passivated GaAs Substrate

2012 ◽  
Vol 629 ◽  
pp. 127-130
Author(s):  
Ting Ting Jia ◽  
Xing Hong Cheng ◽  
Duo Cao ◽  
Da Wei Xu ◽  
Chao Xia ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Gate Dielectric ◽  
Atomic Layer ◽  
Interface Morphology ◽  
X Ray ◽  
Transmission Electron ◽  
Layer Deposition ◽  
Chemical Bonding State ◽  
Capacitance Voltage ◽  
Sulfur Passivation

In this work, we present the results of an investigation into the effectiveness of varying ammonium sulphide (NH4)2S concentrations in the passivation of n-type GaAs. Samples were degreased and immersed in aqueous (NH4)2S solutions of concentrations 22% and 10%for 10 min at 295 K, immediately prior to plasma enhanced atomic layer deposition of LaAlO3. The chemical bonding state of (NH4)2S treated GaAs surface were investigated by X-ray photoelectron spectroscopy (XPS), which indicate that Sulfur passivation can reduce intrerfacial GaAs-oxide formation. Transmission electron microscopy (TEM) was implemented to characterize the interface morphology. Finally, capacitance-voltage (C-V) and leakage current density-voltage (J-V) measurement were used to characterize the electrical properties of LaAlO3 films.

Evolution of Epitaxial SixGei1-x Alloys on Si(100) During Thermal Annealing a-Ge/Au Bilayers Deposited on Si Substrate

1992 ◽  
Vol 280 ◽  
Author(s):  
Z. Ma ◽  
L. H. Allen
Keyword(s):  
Single Crystal ◽  
Thermal Annealing ◽  
Rutherford Backscattering Spectrometry ◽  
Solid Phase ◽  
Growth Dynamics ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

ABSTRACTSolid phase epitaxial (SPE) growth of SixGei1-x alloys on Si (100) was achieved by thermal annealing a-Ge/Au bilayers deposited on single crystal Si substrate in the temperature range of 280°C to 310°C. Growth dynamics was investigated using X-ray diffraction, Rutherford backscattering spectrometry, and cross-sectional transmission electron microscopy. Upon annealing, Ge atoms migrate along the grain boundaries of polycrystalline Au and the epitaxial growth initiates at localized triple points between two Au grains and Si substrate, simultaneously incorporating a small amount of Si dissolved in Au. The Au is gradually displaced into the top Ge layer. Individual single crystal SixGei1-x islands then grow laterally as well as vertically. Finally, the islands coalesce to form a uniform layer of epitaxial SixGe1-x alloy on the Si substrate. The amount of Si incorporated in the final epitaxial film was found to be dependent upon the annealing temperature.

New Pathways to Heteroepitaxial GaN by Inorganic CVD Synthesis and Characterization of Related Ga-C-N Novel Systems

1996 ◽  
Vol 449 ◽  
Author(s):  
J. Kouvetakis ◽  
M. O’Keeffe ◽  
Louis Brouseau ◽  
J. McMurran ◽  
Darrick Williams ◽  
...  
Keyword(s):  
Carbon Nitride ◽  
Columnar Growth ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Single Source Precursor ◽  
Cvd Synthesis ◽  
Oriented Films ◽  
Cubic Structure

ABSTRACTWe describe the development of a new deposition method for thin oriented films of GaN on basal plane sapphire using an exclusively inorganic single-source precursor free of carbon and hydrogen, Cl2GaN3. The films have been characterized by Rutherford backscattering spectroscopy (RBS) and cross sectional transmission electron microscopy (TEM) for composition morphology and structure. RBS analysis confirmed stoichiometric GaN and TEM observations of the highly conformal films revealed heteroepitaxial columnar growth of crystalline wurrtzite material on sapphire. Auger and RBS oxygen and carbon resonance profiles indicated that the films were pure and highly homogeneous. We also report the reactions of Cl2GaN3 with organometallic nitriles to yield a crystalline, novel gallium carbon nitride of composition GaC3N3. Quantitative X-ray powder diffraction has been used to refine the cubic structure of this material which consists of Ga atoms octahedrally surrounded by on the average three C and three N atoms. The structurally analogous LiGaC4N4 phase has also been prepared and characterized.

A STUDY OF ALUMINA THIN FILMS GROWN BY LOW PRESSURE MOCVD: XPS AND AES

2002 ◽  
Vol 16 (08) ◽  
pp. 1261-1267 ◽  
Author(s):  
M. P. SINGH ◽  
S. A. SHIVASHANKAR ◽  
T. SHRIPATHI
Keyword(s):  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
Metalorganic Chemical Vapor Deposition ◽  
Chemical Vapor ◽  
Alumina Film ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Low Pressure Mocvd ◽  
Substrate Temperatures

We have studied the chemical composition of alumina ( Al 2 O 3) films grown on Si(100) at different substrate temperatures by metalorganic chemical vapor deposition (MOCVD) using aluminium acetylactonate { Al(acac) 3} as the precursor. We have found that the resulting films of Al 2 O 3 contain substantial amounts of carbon. X-ray photoelectron spectroscopy (XPS) was employed to study the chemical state of carbon present in such films. The XPS spectrum reveals that the carbon present in Al 2 O 3 film is graphitic in nature. Auger electron spectroscopy (AES) was employed to study the distribution of carbon in the Al 2 O 3 films. The AES depth profile reveals that carbon is present throughout the film. The AES study on Al 2 O 3 films corroborates the XPS findings. An investigation of the Al 2 O 3/ Si (100) interface was carried out using cross-sectional transmission electron microscopy (XTEM). The TEM study reveals textured growth of alumina film on Si(100), with very fine grains of alumina embedded in an amorphous carbon-containing matrix.

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