Single Wafer, Anisotropic Etching of Polysilicon with C12/SF6 and Trielectrode Reactor Operation

1986 ◽  
Vol 68 ◽  
Author(s):  
James E. Nulty
Keyword(s):  
Bias Voltage ◽  
Etch Rate ◽  
Proximity Effects ◽  
The Self ◽  
Rf Power ◽  
Reactor Operation ◽  
Lower Electrode ◽  
Dc Bias ◽  
Bias Versus ◽  
Etching System

AbstractA totally anisotropic, highly selective dry poly etch process has been developed that is capable of etching sub-2.0 micron linewidths.Doped poly etch rates of 10,000 A/min.are obtained using C12-only chemistry.Standard novolac or bilevel photoresist is used, depending on the lithography requirements.Anisotropy is achieved without the use of carbon-containing gases; as a result, minimal proximity effects are observed between dense and stand alone etched lines.Wafer maps of etched linewidths on 4-inch wafers are presented, showing mask to final bias and uniformity results.A commercially available triode dry etching system was used for the work.The self-induced dc bias voltage can be selected regardless of the applied rf power.The effect of variable self-induced dc bias versus applied rf power is presented for selectivity, upper and lower electrode interactions, and etch rate uniformity.Characterization by the use of spectroscopy is also presented, showing changes due to varying the self-induced dc bias at a constant rf power.

Ion flux's pressure dependence in an asymmetric capacitively coupled rf discharge in NF3

Open Physics ◽  
2004 ◽  
Vol 2 (1) ◽  
pp. 1-11 ◽  
Author(s):  
Emil Mateev ◽  
Ivan Zhelyazkov
Keyword(s):  
Bias Voltage ◽  
Essential Feature ◽  
Gas Pressure ◽  
Ion Flux ◽  
The Self ◽  
Rf Discharge ◽  
Rf Power ◽  
Capacitively Coupled ◽  
Self Bias ◽  
Basic Equations

AbstractStarting from an analytical macroscopic/phenomenological model yielding the self-bias voltage as a function of the absorbed radio-frequency (rf) power of an asymmetric capacitively coupled discharge in NF3 this paper studies the dependence of the ion flux onto the powered electrode on the gas pressure. An essential feature of the model is the assumption that the ions' drift velocity in the sheath near the powered electrode is proportional to E α, where E=−ΔU (U being the self-bias potential), and α is a coefficient depending on the gas pressure and cross section of elastic ion-neutral collisions. The model also considers the role of γ-electrons, stochastic heating as well as the contribution of the active electron current to the global discharge power balance. Numerically solving the model's basic equations one can extract the magnitude of the ion flux (at three different gas pressures) in a technological etching device (Alcatel GIR 220) by using easily measurable quantities, notably the self-bias voltage and absorbed rf power.

Antireflective MgF2 Coating on Polycarbonate

2002 ◽  
Vol 722 ◽  
Author(s):  
Takanobu Hori ◽  
Isao Tokomoto ◽  
Kazuo Uetani ◽  
Masashi Fukinbara ◽  
Akira Kato ◽  
...  
Keyword(s):  
Optical Absorption ◽  
Bias Voltage ◽  
Abrasion Resistance ◽  
Substrate Holder ◽  
Rf Power ◽  
Ion Plating ◽  
Plating Method ◽  
Dc Bias ◽  
Dc Biasing ◽  
Substrate Temperatures

AbstractWe deposited MgF2 thin films using the ion-plating method that features RF and DC biasing to the substrate holder. We investigated the effects of RF powers, substrate temperatures (Ts) and DC bias voltages on optical absorption and abrasion resistance of the films. The optical absorption deteriorated by increasing RF power and Ts. In particular, the deterioration was quite serious when the Ts were above 423 K. The abrasion resistance increased by increasing the Ts. We found that the abrasion resistance could be improved also by increasing a DC bias voltage. The same abrasion resistance as the film deposited by a conventional heat resistance deposition at 573 K was obtained by applying the DC bias voltage of -500 V and the Ts of 300 K.

In-Situ Monitoring by Mass Spectrometry for GaAs Etched with An Electron Cyclotron Resonance Source

1993 ◽  
Vol 324 ◽  
Author(s):  
D. J. Kahaian ◽  
S. W. Pang
Keyword(s):  
Mass Spectrometry ◽  
Cyclotron Resonance ◽  
Etch Rate ◽  
Electron Cyclotron Resonance ◽  
Diagnostic Technique ◽  
Electron Cyclotron ◽  
In Situ Monitoring ◽  
Rf Power ◽  
Dc Bias

AbstractQuadrupole mass spectrometry (QMS) has been used as an in-situ diagnostic technique for GaAs etched with an electron cyclotron resonance source. Changes in the detected signal intensities for reactive species and etch products have been related to corresponding changes in the etch rate as several process parameters were varied. The detected 75As+ and to a lesser degree, 35C1+ and 70C12+, were observed to follow etch rate as microwave power, rf power, source to sample distance, temperature, and pressure were varied. The self-induced dc bias (IVdcl) determines the etch rate dependence on etch time. The time delay before saturation of the monitored 75As+ signal corresponding to a constant etch rate is inversely proportional to IVdcl. The addition of N2/O2 in a 4:1 ratio to constitute 15% of the total discharge resulted in a 95% decrease in the intensity of the monitored 75As+ signal. The measured etch rate decreased by 75%.

scholarly journals Investigation of the Carrier Movement through the Tunneling Junction in the InGaP/GaAs Dual Junction Solar Cell Using the Electrically and Optically Biased Photoreflectance Spectroscopy

Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 638
Author(s):  
Sanam SaeidNahaei ◽  
Hyun-Jun Jo ◽  
Sang Jo Lee ◽  
Jong Su Kim ◽  
Sang Jun Lee ◽  
...  
Keyword(s):  
Solar Cell ◽  
Electric Field ◽  
Electric Fields ◽  
Bias Voltage ◽  
Tunnel Junction ◽  
Photogenerated Carrier ◽  
Internal Electric Field ◽  
Junction Solar Cell ◽  
Photoreflectance Spectroscopy ◽  
Dc Bias

For examining the carrier movements through tunnel junction, electrically and optically-biased photoreflectance spectroscopy (EBPR and OBPR) were used to investigate the internal electric field in the InGaP/GaAs dual junction solar cell at room temperature. At InGaP and GaAs, the strength of p-n junction electric fields (Fpn) was perturbed by the external DC bias voltage and CW light intensity for EBPR and OBPR experiments, respectively. Moreover, the Fpn was evaluated using the Fast Fourier Transform (FFT) of the Franz—Keldysh oscillation from PR spectra. In the EBPR, the electric field decreased by increasing the DC bias voltage, which also decreased the potential barrier. In OBPR, when incident CW light is absorbed by the top cell, the decrement of the Fpn in the GaAs cell indicates that the photogenerated carriers are accumulated near the p-n junction. Photogenerated carriers in InGaP can pass through the tunnel junction, and the PR results show the contribution of the modification of the electric field by the photogenerated carriers in each cell. We suggest that PR spectroscopy with optical-bias and electrical-bias could be analyzed using the information of the photogenerated carrier passed through the tunnel junction.

scholarly journals Characterization and Performance of Carbon Films Deposited by Plasma and Ion Beam Based Techniques

1994 ◽  
Vol 354 ◽  
Author(s):  
K.C. Walter ◽  
H. Kung ◽  
T. Levine ◽  
J.T. Tesmer ◽  
P. Kodali ◽  
...  
Keyword(s):  
Wear Rate ◽  
Surface Area ◽  
Ion Beam ◽  
Carbon Films ◽  
The Self ◽  
Line Of Sight ◽  
Rf Power ◽  
Hard Carbon ◽  
Self Bias ◽  
Cathodic Arc

AbstractPlasma and ion beam based techniques have been used to deposit carbon-based films. The ion beam based method, a cathodic arc process, used a magnetically mass analyzed beam and is inherently a line-of-sight process. Two hydrocarbon plasma-based, non-line-of-sight techniques were also used and have the advantage of being capable of coating complicated geometries. The self-bias technique can produce hard carbon films, but is dependent on rf power and the surface area of the target. The pulsed-bias technique can also produce hard carbon films but has the additional advantage of being independent of rf power and target surface area. Tribological results indicated the coefficient of friction is nearly the same for carbon films from each deposition process, but the wear rate of the cathodic arc film was five times less than for the self-bias or pulsed-bias films. Although the cathodic arc film was the hardest, contained the highest fraction of sp3 bonds and exhibited the lowest wear rate, the cathodic arc film also produced the highest wear on the 440C stainless steel counterface during tribological testing. Thus, for tribological applications requiring low wear rates for both counterfaces, coating one surface with a very hard, wear resistant film may detrimentally affect the tribological behavior of the counterface.

scholarly journals Impact of Inductively Coupled Plasma Etching Conditions on the Formation of Semi-Polar ( 11 2 ¯ 2 ) and Non-Polar ( 11 2 ¯ 0 ) GaN Nanorods

Nanomaterials ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 2562
Author(s):  
Pierre-Marie Coulon ◽  
Peng Feng ◽  
Tao Wang ◽  
Philip A. Shields
Keyword(s):  
Plasma Etching ◽  
Inductively Coupled Plasma ◽  
Defect Density ◽  
Rf Power ◽  
Resonant Cavities ◽  
Inductively Coupled Plasma Etching ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Dc Bias ◽  
The Impact

The formation of gallium nitride (GaN) semi-polar and non-polar nanostructures is of importance for improving light extraction/absorption of optoelectronic devices, creating optical resonant cavities or reducing the defect density. However, very limited studies of nanotexturing via dry etching have been performed, in comparison to wet etching. In this paper, we investigate the formation and morphology of semi-polar (112¯2) and non-polar (112¯0) GaN nanorods using inductively coupled plasma (ICP) etching. The impact of gas chemistry, pressure, temperature, radio-frequency (RF) and ICP power and time are explored. A dominant chemical component is found to have a significant impact on the morphology, being impacted by the polarity of the planes. In contrast, increasing the physical component enables the impact of crystal orientation to be minimized to achieve a circular nanorod profile with inclined sidewalls. These conditions were obtained for a small percentage of chlorine (Cl2) within the Cl2 + argon (Ar) plasma combined with a low pressure. Damage to the crystal was reduced by lowering the direct current (DC) bias through a reduction of the RF power and an increase of the ICP power.

The Effect of DC Bias Voltage on the Structural and Optical Properties of Hydrogenated Nanocrystalline Si Thin Films

2007 ◽  
Vol 124-126 ◽  
pp. 1261-1264 ◽  
Author(s):  
Jae Hyun Shim ◽  
Nam Hee Cho
Keyword(s):  
Vapor Deposition ◽  
Amorphous Matrix ◽  
Chemical Vapor ◽  
Rf Power ◽  
Structural And Optical Properties ◽  
Dc Bias ◽  
Pl Emission ◽  
Si Films ◽  
Si Nanocrystallites ◽  
Nanocrystalline Si

Amorphous and nanocrystalline Si films were prepared by plasma enhanced chemical vapor deposition (PECVD). The films were deposited with a RF power of 100 W, while substrates were under DC biases varying from 0 to -600 V. The size as well as the concentration of Si nanocrystallites increased with raising the DC bias; the PL emission wavelength was shifted from 400 to 750 nm. A model for the nanostructural variation in the nc-Si:H films was suggested to describe the change in the size and concentration of the nanocrystallites as well as the amorphous matrix depending on the DC bias conditions.

Study on Reactive Ion Etching of Vanadium Oxide Thin Film by Taguchi Method

2014 ◽  
Vol 909 ◽  
pp. 91-94
Author(s):  
Jun Gou ◽  
Hui Ling Tai ◽  
Jun Wang ◽  
De En Gu ◽  
Xiong Bang Wei ◽  
...  
Keyword(s):  
Thin Film ◽  
Taguchi Method ◽  
Vanadium Oxide ◽  
Etch Rate ◽  
Reactive Ion Etching ◽  
Oxide Thin Film ◽  
Optimum Process ◽  
Rf Power ◽  
Ion Etching ◽  
Vanadium Oxide Thin Film

A high selectivity patterning technology of vanadium oxide (VOx) thin film was suggested in this paper. VOxthin film was etched through a photoresist (PR) mask using Cl/N based gases in a reactive ion etching (RIE) system. Taguchi method was used for process design to identify factors that influence the patterning and find optimum process parameters. Experimental results suggested that RF power was the largest contribution factor for VOxetch rate, PR selectivity and uniformity on 6 inch diameter wafer. Uniformity and PR selectivity were improved by introducing a small amount of N2. High resolution and low roughness patterning transfer was achieved with a non uniformity of 2.4 %, an VOxetch rate of 74 nm/min, a PR selectivity of 0.96, a Si3N4selectivity of 5 and a SiO2selectivity of 10.

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