scholarly journals Development of Epoxy Resin-Based Elastomeric Microfluidic Devices Using CO2 Laser Ablation for DNA-Amplification Point-Of-Care (POC) Applications: Assessment of Microchannels' Dimensions and Quality

Author(s):  
Heba Mansour ◽  
Ahmed M.R. Fath El-Bab ◽  
Emad A. Soliman ◽  
Ahmed L. Abdel-Mawgood

Abstract Microfluidic devices are a rising technology to automatize chemical and biological operations. In this context, laser ablation has significant potential for polymer-based microfluidic platforms' fast and economical manufacturing. Nevertheless, the manufacturing of epoxy-based microfluidic chips is considered highly cost full due to demand for cleanroom facilities that utilize expensive equipment and lengthy processes. Therefore, this study targeted investigating the feasibility of epoxy resins to be fabricated as a lab-on-chip using carbon dioxide laser ablation. The chemical structural properties and thermal stability of the plain epoxy resins were characterized by Fourier transform infrared spectral analysis (FT-IR) and thermogravimetric analysis (TGA). Moreover, a specific migration test was performed to quantify potential migrants by gas chromatography coupled to mass spectrometry (GC-MS) to prove that the cured epoxy resin would not release unreacted monomers to the biological solution test, which caused inhibition of the sensitive biological reactions. By investigating the impact of this process on microchannels' dimensions and quality, a laser technique using CO2 laser was used in vector mode to engrave into a transparent epoxy resin chip. The resulting microchannels were characterized using 3D Laser microscopy. The outcomes of this study showed considerable potential for laser ablation in machining the epoxy-based chips, whereas the microchannels were produced with minor bulges' height (0.027 µm) with no clogging. Moreover, a reasonable depth of 99.31 µm with roughness (Ra) of 14.52 µm was obtained at a laser speed of 5 mm/s and laser power of 1.8 W. This process can produce epoxy resin-based microfluidic chips without the need for cleanroom facilities that require expensive equipment and lengthy process.

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2205
Author(s):  
Qian Li ◽  
Yujie Li ◽  
Yifan Chen ◽  
Qiang Wu ◽  
Siqun Wang

A novel liquid phosphorous-containing flame retardant anhydride (LPFA) with low viscosity was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and methyl tetrahydrophthalic anhydride (MeTHPA) and further cured with bisphenol-A epoxy resin E-51 for the preparation of the flame retardant epoxy resins. Both Fourier transform infrared spectroscopy (FT-IR), mass spectrometry (MS) and nuclear magnetic resonance (NMR) measurements revealed the successful incorporation of DOPO on the molecular chains of MeTHPA through chemical reaction. The oxygen index analysis showed that the LPFA-cured epoxy resin exhibited excellent flame retardant performance, and the corresponding limiting oxygen index (LOI) value could reach 31.2%. The UL-94V-0 rating was achieved for the flame retardant epoxy resin with the phosphorus content of 2.7%. With the addition of LPFA, the impact strength of the cured epoxy resins remained almost unchanged, but the flexural strength gradually increased. Meanwhile, all the epoxy resins showed good thermal stability. The glass transition temperature (Tg) and thermal decomposition temperature (Td) of epoxy resin cured by LPFA decreased slightly compared with that of MeTHPA-cured epoxy resin. Based on such excellent flame retardancy, low viscosity at room temperature and ease of use, LPFA showed potential as an appropriate curing agent in the field of electrical insulation materials.


2020 ◽  
Vol 15 ◽  
pp. 155892502090132
Author(s):  
Sang-Hoon Lee ◽  
Seung-Won Oh ◽  
Young-Hee Lee ◽  
Il-Jin Kim ◽  
Dong-Jin Lee ◽  
...  

To prepare flame-retardant epoxy resin, phosphorus compound containing di-hydroxyl group (10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ) was reacted with uncured epoxy resin (diglycidyl ether of bisphenol A, YD-128) and then cured using a curing agent (dicyandiamide, DICY). This study focused on the effect of phosphorus compound/phosphorus content on physical properties and flame retardancy of cured epoxy resin. The thermal decomposition temperature of the cured epoxy resins (samples: P0, P1.5, P2.0, and P2.5, the number represents the wt% of phosphorus) increased with increasing the content of phosphorus compound/phosphorus (0/0, 19.8/1.5, 27.8/2.0, and 36.8/2.5 wt%) based on epoxy resin. The impact strength of the cured epoxy resin increased significantly with increasing phosphorus compound content. As the phosphorus compound/phosphorus content increased from 0/0 to 36.8/2.5 wt%, the glass transition temperature (the peak temperature of loss modulus curve) increased from 135.2°C to 142.0°C. In addition, as the content of phosphorous compound increased, the storage modulus remained almost constant up to higher temperature. The limiting oxygen index value of cured epoxy resin increased from 21.1% to 30.0% with increasing phosphorus compound/phosphorus content from 0/0 to 36.8/2.5 wt%. The UL 94 V test result showed that no rating for phosphorus compounds less than 19.8 wt% and V-1 for 27.8 wt%. However, when the phosphorus compound was 36.8 wt%, the V-0 level indicating complete flame retardancy was obtained. In conclusion, the incorporation of phosphorus compounds into the epoxy chain resulted in improved properties such as impact strength and heat resistance, as well as a significant increase in flame retardancy.


2012 ◽  
Vol 535-537 ◽  
pp. 2499-2502
Author(s):  
X. Wang ◽  
S. R. Zheng ◽  
R. M. Wang

Epoxy resin structural adhesives modified by flexible curing agent. Dependening on the mechanical properties of epoxy resins on the flexible curing agent content was studied. The impact fracture toughness was discussed in terms of fracture surface fractography.


2010 ◽  
Vol 150-151 ◽  
pp. 727-731 ◽  
Author(s):  
Zhi Yi Huang ◽  
Shao Rong Lu ◽  
Zhi You Yang ◽  
Chun He Yu ◽  
Dong Guo

Liquid crystal polyurethane (LCPBI) containing biphenylnate and imide units was synthesized and characterized and used to modify the conventional epoxy resin (E-51). Experimental results revealed that the impact strength of the epoxy resin modified with LCPBI was 2.5 times higher than that of unmodified epoxy resin, and the tensile strength as well as the bending strength was also improved. The thermal decomposition temperature of modified systems was also 15-20oC higher than that of the unmodified system, and the fracture structures of the blends was investigated by SEM.


2014 ◽  
Vol 635-637 ◽  
pp. 658-661
Author(s):  
Carlos Honrado ◽  
Tao Dong

The characterization of novel portable microfluidic devices, with capillary phenomena as filling process, was presented. Created for monitoring multiplexed chemiluminescence (CL) reactions, the devices are amenable for integration with organic photodiodes (OPDs) for future incorporation in microelectromechanical systems (MEMS). Using finite element method (FEM), four designs of microfluidic chips were simulated. The parallel design, despite its quick total filling time (TFT), presented a non-uniform filling process and a non-compact structure. The series design was the most compact structure studied. However, it cannot be used in CL reactions with multiple analytes in common, which is a major drawback. Regarding the parallel-series, it solved some of the problems presented in previous designs but its high TFT and non-compactness make it a less attractive solution for a portable microfluidic device. Finally, the optimized parallel design proved to be the best design, presenting a quick TFT, high compactness and the capability to have CL reactions sharing analytes.


2020 ◽  
pp. 56-58
Author(s):  
N. V. Kostromina ◽  
Yu. V. Olikhova ◽  
Khlaing Zo U ◽  
V. S. Osipchik ◽  
T. P. Kravchenko

One of the methods for increasing the impact toughness of materials based on epoxy resins is modification with thermoplastics. The paper presents experimental data on the effect of polyvinyl formal ethylal (Vinyfl ex) and various curing modes on the toughness of compositions based on ED-20. The mechanism for modifying ED-20 with Vinyflex was analyzed. The data obtained are necessary for the development of domestic technology for the production of impact-resistant plastics.


2011 ◽  
Vol 52-54 ◽  
pp. 2056-2059
Author(s):  
Da Hu Yao ◽  
Yu Qing Zhang ◽  
Joong Hee Lee

A bisphenol-A glycidol ether epoxy resin was toughened in cryogenic temperature using reactive macroglycol as modifiers. The properties of modified epoxy resin were characterized by SEM and DMA. Phase-separated structure formed during curing process in the PPG and PTMG modified epoxy resins system, and did not occurred in the PEO modified epoxy resins system. The impact strength of epoxy resin increased at both room temperature (RT) and cryogenic temperature (CT, 77 K) using PEO as modifier. The DMA results confirm that the introduction of PEO chains in the structure of the epoxy increases the mobility of the molecular segment of epoxy network at both RT and CT.


2019 ◽  
Vol 77 (3) ◽  
pp. 221-225
Author(s):  
Mariana Ferreira Bastos ◽  
Ricardo Batista ◽  
Diogo Laertes ◽  
Joana Calvão ◽  
Margarida Gonçalo

Introduction. Occupational Allergic Contact Dermatitis is a very common occupational disease and epoxy resins are among its main causes. The aim of this study was to characterize patients with positive patch test reactions to epoxy resin detected in the Coimbra Hospital and University Center between 2012 and 2018 and compare with the results of patients patch tested between 1999 and 2008 at the same Institution. Method and Materials.  Within aretrospective analysis of the files of patients with positive patch test reactions (1+ or more intense) to epoxy resin of bisfenol A tested at 1% pet. within the Baseline Series between 2012 and 2018, we characterized demographic and clinical data of reactive patients, evaluated the relevance of the reaction, sources of exposure to epoxy resin with particular attention to occupational exposures, other positive reactions and the impact of the results of the tests in the work conditions of these patients. Lastly, we compared these results with a previous study performed in the same Hospital between 1999 and 2008. Results. Among 2363 patch tested patients during the study period we found 23 patients (0.97%), 17 males and 6 females, who developed contact allergy to epoxy resins. In 22 cases we identified a relevant occupational exposure: 9 from construction industry; 9 workers from wind-mill turbines factory for Eolic energy; 2 from fiberglass factories; 1 from a chemical factory and 1 from a Wastewater Treatment Plant. In 1 patient (a teacher) no relevance was found. Of these 22 workers, 9 (39.1%) had both hand and airborne lesions, while 8 (34.8%) had lesions exclusively on the hands and 5 (21.7%) had predominately airborne dermatitis. Four of the 23 (17.4%) reacted exclusively to the epoxy resin, and 11 of 18 (61.1%) also reacted to 0.25% hexanediol diglycidyl ether. Avoidance resulted in a significant improvement of symptoms. Compared to the previous period (1999-2008), there are no significative changes apart from a slight increase in the frequency of the allergic reactions to epoxy resins and its main source of exposure. Conclusions. The prevalence of allergic contact dermatitis to epoxy resin has slightly increased in this Portuguese Center mostly due to workers from wind-mill turbines factory for Eolic energy, a recent industry implanted in this region. This allergen still causes almost exclusively occupational dermatitis, either hand, airborne, or both.


Author(s):  
J. G. Adams ◽  
M. M. Campbell ◽  
H. Thomas ◽  
J. J. Ghldonl

Since the introduction of epoxy resins as embedding material for electron microscopy, the list of new formulations and variations of widely accepted mixtures has grown rapidly. Described here is a resin system utilizing Maraglas 655, Dow D.E.R. 732, DDSA, and BDMA, which is a variation of the mixtures of Lockwood and Erlandson. In the development of the mixture, the Maraglas and the Dow resins were tested in 3 different volumetric proportions, 6:4, 7:3, and 8:2. Cutting qualities and characteristics of stability in the electron beam and image contrast were evaluated for these epoxy mixtures with anhydride (DDSA) to epoxy ratios of 0.4, 0.55, and 0.7. Each mixture was polymerized overnight at 60°C with 2% and 3% BDMA.Although the differences among the test resins were slight in terms of cutting ease, general tissue preservation, and stability in the beam, the 7:3 Maraglas to D.E.R. 732 ratio at an anhydride to epoxy ratio of 0.55 polymerized with 3% BDMA proved to be most consistent. The resulting plastic is relatively hard and somewhat brittle which necessitates trimming and facing the block slowly and cautiously to avoid chipping. Sections up to about 2 microns in thickness can be cut and stained with any of several light microscope stains and excellent quality light photomicrographs can be taken of such sections (Fig. 1).


Author(s):  
Georgel MIHU ◽  
Claudia Veronica UNGUREANU ◽  
Vasile BRIA ◽  
Marina BUNEA ◽  
Rodica CHIHAI PEȚU ◽  
...  

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.


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