scholarly journals FinFET SRAM cell with improved stability and power for low power applications.

2019 ◽  
Vol 14 (2) ◽  
pp. 1-8
Author(s):  
Shilpi Birla

In this paper, a new 11T SRAM cell using Double gate FET (FinFET technology) has been proposed, cell basic component is the 6T SRAM cell with 4 NMOS access transistors to improve the stability over CMOSFET circuits and also makes it a dual port memory cell. The proposed cell also used a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability which helps in reducing the leakage current, active power. The cell shows improvement in RSNM (Read Static Noise Margin) with LP8T by 2.39x at threshold and subthreshold voltage 2.68x with D6T SRAM cell, 5.5x with TG8T. The WSNM (Write Static Noise Margin) and HM (Hold Margin) of the SRAM cell at 0.9V is 306mV and 384mV.At subthreshold operation also, it shows improvement. The Leakage power reduced by 0.125x with LP8T, 0.022x with D6T SRAM cell, TG8T and SE8T. Impact of process variation on cell stability also been analyzed.

2011 ◽  
Vol 12 (1) ◽  
pp. 13-30 ◽  
Author(s):  
Aminul Islam ◽  
Mohd. Hasan

This paper analyses standard 6T and 7T SRAM (static random access memory) cell in light of process, voltage and temperature (PVT) variations to verify their functionality and robustness. The 7T SRAM cell consumes higher hold power due to its extra cell area required for its functionality constraint. It shows 60% improvement in static noise margin (SNM), 71.4% improvement in read static noise margin (RSNM) and 50% improvement in write static noise margin (WSNM). The 6T cell outperforms 7T cell in terms of read access time (TRA) by 13.1%. The write access time (TWA) of 7T cell for writing "1" is 16.6 x longer than that of 6T cell. The 6T cell proves it robustness against PVT variations by exhibiting narrower spread in TRA (by 1.2 x) and Twa (by 3.4x). The 7T cell offers 65.6% saving in read power (RPWR) and 89% saving in write power (WPWR). The RPWR variability indicates that 6T ell is more robust against process variation by 3.9x. The 7T cell shows 1.3x wider write power (WPWR) variability indicating 6T cell's robustness against PVT variations. All the results are based on HSPICE simulation using 32 nm CMOS Berkeley Predictive Technology Model (BPTM).


Circuit World ◽  
2019 ◽  
Vol 45 (4) ◽  
pp. 196-207
Author(s):  
Shilpi Birla

Purpose Major area of a die is consumed in memory components. Almost 60-70% of chip area is being consumed by “Memory Circuits”. The dominant memory in this market is SRAM, even though the SRAM size is larger than embedded DRAM, as SRAM does not have yield issues and the cost is not high as compared to DRAM. At the same time, the other attractive feature for the SRAM is speed, and it can be used for low power applications. CMOS SRAM is the crucial component in microprocessor chips and applications, and as the said major portion of the area is dedicated to SRAM arrays, CMOS SRAM is considered to be the stack holders in the memory market. Because of the scaling feature of CMOS, SRAM had its hold in the market over the past few decades. In recent years, the limitations of the CMOS scaling have raised so many issues like short channel effects, threshold voltage variations. The increased thrust for alternative devices leads to FinFET. FinFET is emerging as one of the suitable alternatives for CMOS and in the region of memory circuits. Design/methodology/approach In this paper, a new 11 T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6 T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power. Findings The cell shows improvement in RSNM (read static noise margin) with LP8T by 2.39× at sub-threshold voltage 2.68× with D6T SRAM cell, 5.5× with TG8T. The WSNM (write static noise margin) and HM (hold margin) of the SRAM cell at 0.9 V is 306 mV and 384  mV. It shows improvement at sub-threshold operation also. The leakage power is reduced by 0.125× with LP8T, 0.022× with D6T SRAM cell, TG8T and SE8T. The impact of process variation on cell stability is also discussed. Research limitations/implications The FinFet has been used in place of CMOS even though the FinFet has been not been a matured technology; therefore, pdk files have been used. Practical implications SRAM cell has been designed which has good stability and reduced leakage by which we can make an array and which can be used as SRAM array. Social implications The cell can be used for SRAM memory for low power consumptions. Originality/value The work has been done by implementing various leakage techniques to design a stable and improved SRAM cell. The advantage of this work is that the cell has been working for low voltage without degrading the stability factor.


2018 ◽  
Vol 7 (2.20) ◽  
pp. 109
Author(s):  
S Renukarani ◽  
Bhavana Godavarthi ◽  
SK Bia Roshini ◽  
Mohammad Khadir

A novel idea of 8-Transistor (8T) static random access memory cell with enhanced information stability, sub threshold operation may be outlined. Those prescribed novel built single-ended for dynamic control 8 transistors static RAM (SRAM) cell enhances the static noise margin (SNM) to grater low energy supply. The suggested 8T takes less read and write power supply compared to 6T. Those suggested 8T need higher static noise margin than that from 6T. The portable microprocessor chips need ultralow energy consuming circuits on use battery to more drawn out span. The power utilization might be minimized utilizing non-conventional gadget structures, new circuit topologies, and upgrading the architecture. Although, voltage scaling require of the operation completed over sub threshold for low power consumption, and there will be an inconvenience from exponential decrease in execution. However, to sub threshold regime, that data stability of SRAM cell might a chance to be a amazing issue and worsens for those scaling from claming MOSFET ought to sub-nanometer engineering technology.  


Author(s):  
Jakyung Hong ◽  
S.J. Cho ◽  
Y.W. Han ◽  
H.S. Choi ◽  
T.E. Kim ◽  
...  

Abstract This paper presents the process of measuring static noise margin (SNM), write noise margin (WNM) with 6 pin nanoprober, and characterization and analysis of SRAM cell stability through case studies of 45nm devices SRAM soft failures. It highlights that the local mismatch in the bit cell caused by slight variations in the transistor characteristics, such as Vth shift and Idsat, off variation, also can easily induce a soft failure. The analysis of the SNM TR characteristic is successfully demonstrated through the case study of 45nm SRAM devices. The chapter explains SNM measurement in the metal layer and transistor measurements in the CA layer. Measuring the SNM TR's characteristics is an important methodology in understanding the stability of each bit cell and failure mechanism depending on voltage, defects, and other factors. The next generation of nanoprobing analysis can be expanded.


2021 ◽  
Vol I (I) ◽  
Author(s):  
Bharathabau K

As technology advances, the need for SRAM cells that may be utilised in high-speed applications grows. SRAM cells' static noise margin (SNM) is one of the most important variables to consider when designing a memory cell, and it is the main predictor of SRAM cell speed. The static noise margin will have an impact on the read and write margins. When it comes to the SRAM Cell's stability, the SNM is very important. For high-speed SRAMs, read/write margin analysis is critical since it affects how much data can be read and written. The simulation was run using Mentor Graphics' IC Station, which utilised 350nm technology rather than 180nm technology.


Author(s):  
Yihan Zhu ◽  
Takashi Ohsawa

Abstract A novel loadless four-transistor static random access memory cell is proposed that consists of two N-type driver MOSFETs and two P-type access ones whose gate leakage currents from word-line are used for holding data in the cell. It is shown that the proposed cell has a higher tolerance for manufacturing device fluctuations compared with the conventional loadless 4T SRAM. Furthermore, it is free from bit-line disturb in contrast to the conventional cell. It is confirmed by simulation in 32nm technology node that the read static noise margin of the proposed cell reaches 138.7% of the six-transistor SRAM cell and that the hold static noise margin can be acceptable when the gate insulator thickness of the P-type access MOSFETs is made thinner than the N-type driver MOSFETs. The retention current for the proposed cell decreases to 66.7% of the 6TSRAM and the data rate in read increases to 125%.


Author(s):  
Ram Murti Rawat ◽  
Vinod Kumar

<span>This article clarifies about the variables that influence the static noise margin (SNM) of a static random-access memory. Track down the improved stability of proposed 8T SRAM cell which is superior to conventional 6T SRAM cell utilizing Swing Restored circuit with voltages Q and QB bar are peruse and Compose activity. This SRAM cell strategy on the circuit or engineering level is needed to improve read static noise margin (RSNM), write static noise margin (WSNM) and hold static noise margin (HSNM). This article relative investigation of conventional 6T, standard 8T and proposed 8T SRAM cells with improved stability and static noise margin is finished for 180 nm CMOS innovation. This paper is coordinated as follows: Introduction in area 1, The 6T SRAM cell are portrayed in segment 2. In area 3, proposed 8T SRAM cell is portrayed. In area 4, standard 8T SRAM cell. Segment 5 incorporates the simulation and results which give examination of different boundaries of 6T and 8T SRAM cells and segment 6 conclusions.</span>


Author(s):  
Jitendra Kumar Mishra ◽  
Lakshmi Likhitha Mankali ◽  
Kavindra Kandpal ◽  
Prasanna Kumar Misra ◽  
Manish Goswami

The present day electronic gadgets have semiconductor memory devices to store data. The static random access memory (SRAM) is a volatile memory, often preferred over dynamic random access memory (DRAM) due to higher speed and lower power dissipation. However, at scaling down of technology node, the leakage current in SRAM often increases and degrades its performance. To address this, the voltage scaling is preferred which subsequently affects the stability and delay of SRAM. This paper therefore presents a negative bit-line (NBL) write assist circuit which is used for enhancing the write ability while a separate (isolated) read buffer circuit is used for improving the read stability. In addition to this, the proposed design uses a tail (stack) transistor to decrease the overall static power dissipation and also to maintain the hold stability. The comparison of the proposed design has been done with state-of-the-art work in terms of write static noise margin (WSNM), write delay, read static noise margin (RSNM) and other parameters. It has been observed that there is an improvement of 48%, 11%, 19% and 32.4% in WSNM while reduction of 33%, 39%, 48% and 22% in write delay as compared to the conventional 6T SRAM cell, NBL, [Formula: see text] collapse and 9T UV SRAM, respectively.


2021 ◽  
Vol 7 ◽  
pp. 22-34
Author(s):  
Vinod Kumar ◽  
Ram Murti Rawat

A paper that examines the factors thataffect the Static Noise Margin (SNM) of a StaticRandom Access memories. At an equivalent time,they specialise in optimizing Read and Writeoperation of 8T SRAM cell which is best than 6TSRAM cell Using Swing Restoration Dual NodeVoltage. The read and Write operation and improveStability analysis. This SRAM technique on thecircuit or architecture level is required to improveread and write operation. during this paperComparative Analysis of 6T and 8T SRAM Cellswith Improved Read and Write Margin is completedfor 180 nm Technology with Cadence Virtuososchematics Tool.This Paper is organized as follows: thecharacteristics of 6T SRAM cell are described arerepresented in section VIII. In section IX, proposed8T SRAM cell is described. In section X, Standard8T SRAM cell is described. Section XI includes thesimulation results which give comparison of variousparameters of 6T and 8T SRAM cells. In Section XIISimulation Results and DC analysis and sectionXIII conclusion the work.


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