scholarly journals Review of Physically Unclonable Functions (PUFs): Structures, Models, and Algorithms

2022 ◽  
Vol 2 ◽  
Author(s):  
Fayez Gebali ◽  
Mohammad Mamun

Physically unclonable functions (PUFs) are now an essential component for strengthening the security of Internet of Things (IoT) edge devices. These devices are an important component in many infrastructure systems such as telehealth, commerce, industry, etc. Traditionally these devices are the weakest link in the security of the system since they have limited storage, processing, and energy resources. Furthermore they are located in unsecured environments and could easily be the target of tampering and various types of attacks. We review in this work the structure of most salient types of PUF systems such as static RAM static random access memory (SRAM), ring oscillator (RO), arbiter PUFs, coating PUFs and dynamic RAM dynamic random access memory (DRAM). We discuss statistical models for the five most common types of PUFs and identify the main parameters defining their performance. We review some of the most recent algorithms that can be used to provide stable authentication and secret key generation without having to use helper data or secure sketch algorithms. Finally we provide results showing the performance of these devices and how they depend on the authentication algorithm used and the main system parameters.

MRS Bulletin ◽  
2004 ◽  
Vol 29 (11) ◽  
pp. 818-821 ◽  
Author(s):  
G. Grynkewich ◽  
J. Åkerman ◽  
P. Brown ◽  
B. Butcher ◽  
R.W. Dave ◽  
...  

AbstractMagnetoresistive random-access memory (MRAM) is a new memory technology that is nearing commercialization. MRAM integrates a magnetic tunnel junction (MTJ) device with standard silicon-based microelectronics, resulting in a combination of qualities not found in other memory technologies. For example, MRAM is nonvolatile, has unlimited read and write endurance, and is capable of high-speed read and write operations. In this article, we will describe the fundamentals of an MTJ-based MRAM as well as recent important technology developments in the areas of magnetic materials and memory cell architecture. In addition, we will compare the present and future capabilities of MRAM to those of existing memory technologies such as static RAM and flash memory.


Sensors ◽  
2019 ◽  
Vol 19 (11) ◽  
pp. 2428 ◽  
Author(s):  
Shuai Chen ◽  
Bing Li ◽  
Yuan Cao

The environment-dependent feature of physical unclonable functions (PUFs) is capable of sensing environment changes. This paper presents an analysis and categorization of a variety of PUF sensors. Prior works have demonstrated that PUFs can be used as sensors while providing a security authentication assurance. However, most of the PUF sensors need a dedicated circuit. It can be difficult to implemented in commercial off-the-shelf devices. This paper focuses on the intrinsic Dynamic Random Access Memory (DRAM) PUF-based sensors, which requires no modifications for hardware. The preliminary experimental results on Raspberry Pi have demonstrated the feasibility of our design. Furthermore, we configured the DRAM PUF-based sensor in a DRAM PUF-based key generation scheme which improves the practicability of the design.


MRS Bulletin ◽  
2004 ◽  
Vol 29 (11) ◽  
pp. 823-828 ◽  
Author(s):  
Yoshihiro Arimoto ◽  
Hiroshi Ishiwara

AbstractThe current status of ferroelectric random-access memory (FeRAM) technology is reviewed in this article. Presented first is the status of conventional FeRAM, in which the memory cells are composed of ferroelectric capacitors to store the data and cell-selection transistors to access the selected capacitors. Discussed next are recent developments in the field. Pb(Zrx, Ti1–x)O3 (PZT) and SrBi2Ta2O9 (SBT) films are being used to produce 0.13 mμ and 0.18 μm FeRAM cells, respectively, with a stacked capacitor configuration; these cells are easily embedded into logic circuits. A new class of FeRAM called 6T4C—containing static RAM (SRAM) cells composed of six transistors (6T) and four ferroelectric capacitors (4C)—has been commercially produced. This type of FeRAM features a nondestructive readout operation, unlimited read/write cycling, and a fast access time of less than 10 ns. Lastly, the status of field-effect-transistor (FET)-type FeRAM is reviewed, emphasizing that the data retention time of a ferroelectric-gate FET has been improved to more than a month in recent studies.


Author(s):  
Phil Schani ◽  
S. Subramanian ◽  
Vince Soorholtz ◽  
Pat Liston ◽  
Jamey Moss ◽  
...  

Abstract Temperature sensitive single bit failures at wafer level testing on 0.4µm Fast Static Random Access Memory (FSRAM) devices are analyzed. Top down deprocessing and planar Transmission Electron Microscopy (TEM) analyses show a unique dislocation in the substrate to be the cause of these failures. The dislocation always occurs at the exact same location within the bitcell layout with respect to the single bit failing data state. The dislocation is believed to be associated with buried contact processing used in this type of bitcell layout.


Author(s):  
Ramachandra Chitakudige ◽  
Sarat Kumar Dash ◽  
A.M. Khan

Abstract Detection of both Insufficient Buried Contact (IBC) and cell-to-cell short defects is quite a challenging task for failure analysis in submicron Dynamic Random Access Memory (DRAM) devices. A combination of a well-controlled wet etch and high selectivity poly silicon etch is a key requirement in the deprocessing of DRAM for detection of these types of failures. High selectivity poly silicon etch methods have been reported using complicated system such as ECR (Electron Cyclotron Resonance) Plasma system. The fact that these systems use hazardous gases like Cl2, HBr, and SF6 motivates the search for safer alternative deprocessing chemistries. The present work describes high selectivity poly silicon etch using simple Reactive Ion Etch (RIE) plasma system using less hazardous gases such as CF4, O2 etc. A combination of controlled wet etch and high selectivity poly silicon etch have been used to detect both IBC and cell-to-cell shorts in submicron DRAMs.


Author(s):  
Felix Beaudoin ◽  
Stephen Lucarini ◽  
Fred Towler ◽  
Stephen Wu ◽  
Zhigang Song ◽  
...  

Abstract For SRAMs with high logic complexity, hard defects, design debug, and soft defects have to be tackled all at once early on in the technology development while innovative integration schemes in front-end of the line are being validated. This paper presents a case study of a high-complexity static random access memory (SRAM) used during a 32nm technology development phase. The case study addresses several novel and unrelated fail mechanisms on a product-like SRAM. Corrective actions were put in place for several process levels in the back-end of the line, the middle of the line, and the front-end of the line. These process changes were successfully verified by demonstrating a significant reduction of the Vmax and Vmin nest array block fallout, thus allowing the broader development team to continue improving random defectivity.


2020 ◽  
Vol 12 (2) ◽  
pp. 02008-1-02008-4
Author(s):  
Pramod J. Patil ◽  
◽  
Namita A. Ahir ◽  
Suhas Yadav ◽  
Chetan C. Revadekar ◽  
...  

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1401
Author(s):  
Te Jui Yen ◽  
Albert Chin ◽  
Vladimir Gritsenko

Large device variation is a fundamental challenge for resistive random access memory (RRAM) array circuit. Improved device-to-device distributions of set and reset voltages in a SiNx RRAM device is realized via arsenic ion (As+) implantation. Besides, the As+-implanted SiNx RRAM device exhibits much tighter cycle-to-cycle distribution than the nonimplanted device. The As+-implanted SiNx device further exhibits excellent performance, which shows high stability and a large 1.73 × 103 resistance window at 85 °C retention for 104 s, and a large 103 resistance window after 105 cycles of the pulsed endurance test. The current–voltage characteristics of high- and low-resistance states were both analyzed as space-charge-limited conduction mechanism. From the simulated defect distribution in the SiNx layer, a microscopic model was established, and the formation and rupture of defect-conductive paths were proposed for the resistance switching behavior. Therefore, the reason for such high device performance can be attributed to the sufficient defects created by As+ implantation that leads to low forming and operation power.


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