scholarly journals A Novel Low-Power Synchronous Preamble Data Line Chip Design for Oscillator Control Interface

Electronics ◽  
2020 ◽  
Vol 9 (9) ◽  
pp. 1509 ◽  
Author(s):  
Shih-Lun Chen ◽  
Tsun-Kuang Chi ◽  
Min-Chun Tuan ◽  
Chiung-An Chen ◽  
Liang-Hung Wang ◽  
...  
Keyword(s):  
Low Power ◽  
Serial Communication ◽  
Cmos Process ◽  
Chip Design ◽  
Chip Area ◽  
Data Line ◽  
Control Interface ◽  
Gate Count ◽  
Field Programmable ◽  
Low Power Dissipation

In this paper, a novel low-power synchronous preamble data line protocol chip design for serial communication is proposed. The serial communication only uses two wires, chip select (CS) and secure digital (SD), to transmit and receive data between two devices. The proposed protocol aims to use a fewer number of wires for the interface, therefore reducing the complexity as well as the area of the chip design. Moreover, it increases the efficiency through a synchronous serial communication-controlled oscillator. The low-power synchronous preamble data line protocol design was successfully verified using a field-programmable gate array (FPGA) as a master device and a real chip as a slave device. The signals are checked through the use of a logic analyzer. The realized low-power synchronous preamble data line protocol chip design has a gate count of only 5.07 K gates, a low power dissipation of 12 mW, and a chip area of 453,260 μm2 using the Taiwan semiconductor manufacturing company (TSMC) 0.18 μm CMOS process. Compared with the three-wire serial peripheral interface (SPI) protocol, the proposed design has the advantages of having a lower cost and a lower power consumption.

scholarly journals None Operational Amplifier (OPA) Based: Design of Analogous Bandgap Reference Voltage

2018 ◽  
Vol 201 ◽  
pp. 02002
Author(s):  
Hao-Ping Chan ◽  
Yu-Cherng Hung
Keyword(s):  
Temperature Coefficient ◽  
Operational Amplifier ◽  
Supply Voltage ◽  
Reference Voltage ◽  
Cmos Process ◽  
Bandgap Reference ◽  
Chip Design ◽  
Chip Area ◽  
Voltage Variation ◽  
Current Variation

By using 0.35-um CMOS process, this work achieves a design of analogous band-gap reference voltage circuit with low temperature coefficient. The proposed circuit operates at 3V and generates a reference current of 44 uA. The HSPICE simulation results show the temperature coefficient of this circuit is 23 ppm/°C at range of -10 °C to 100 °C, and the line regulation (the ratio of output current variation to supply voltage variation) is estimated as 1.95 uA/V from supply voltage variation of 3 V to 5 V. The experimental chip is fabricated and measured. The circuit provides adjustable capability for output voltage among temperature variation of -10 - 100 °C. The chip area is 534 × 695 um2. In this new design, the operational amplifier is not necessary. The chip design effort can be great reduced.

scholarly journals DIGITAL CONTROLLED OSCILLATOR (DCO) FOR ALL DIGITAL PHASE-LOCKED LOOP (ADPLL) – A REVIEW

2019 ◽  
Vol 82 (1) ◽  
Author(s):  
Florence Choong ◽  
Mamun Ibne Reaz ◽  
Mohamad Ibrahim Kamaruzzaman ◽  
Md. Torikul Islam Badal ◽  
Araf Farayez ◽  
...  
Keyword(s):  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Locked Loop ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Process Technology ◽  
Chip Area ◽  
Digital Phase ◽  
Low Power Dissipation

Digital controlled oscillator (DCO) is becoming an attractive replacement over the voltage control oscillator (VCO) with the advances of digital intensive research on all-digital phase locked-loop (ADPLL) in complementary metal-oxide semiconductor (CMOS) process technology. This paper presents a review of various CMOS DCO schemes implemented in ADPLL and relationship between the DCO parameters with ADPLL performance. The DCO architecture evaluated through its power consumption, speed, chip area, frequency range, supply voltage, portability and resolution. It can be concluded that even though there are various schemes of DCO that have been implemented for ADPLL, the selection of the DCO is frequently based on the ADPLL applications and the complexity of the scheme. The demand for the low power dissipation and high resolution DCO in CMOS technology shall remain a challenging and active area of research for years to come. Thus, this review shall work as a guideline for the researchers who wish to work on all digital PLL.

A design of analog VDD generator for passive UHF RFID Tag in 90 nm CMOS

2014 ◽  
Vol 7 (5) ◽  
pp. 507-513 ◽  
Author(s):  
Smail Hassouni ◽  
Hassan Qjidaa
Keyword(s):  
Radio Frequency Identification ◽  
Schottky Diodes ◽  
Input Power ◽  
Cmos Process ◽  
Uhf Rfid ◽  
Chip Area ◽  
Rfid Tag ◽  
Passive Uhf Rfid ◽  
Low Power Dissipation ◽  
Simulation Results

This paper introduces a VDD generator for the ultrahigh frequency (UHF) passive Radio-frequency identification (RFID) tag, consisting of an RF-limiter, an NMOS rectifier, a DC-limiter, and a regulator. The proposed NMOS rectifier utilizes diode-connected native NMOS transistors with ultralow-threshold voltage instead of Schottky diodes. The theoretical equations for predicting the performance of the VDD generator are provided and verified by both simulation results in 90 nm CMOS process. The proposed VDD generator generates a 1.19-V stable output voltage with low-power dissipation and a 26.96% larger power conversion efficiency under conditions of 50 Ω antenna, 900 MHz, −23 dBm input power and 1 M DC output load. The chip area of the proposed VDD generator is only 105 × 85 μm. The simulation results indicated that the presented novel VDD generator is capable to provide efficient, stable, and input-independent power supply for Passive UHF RFID tag

Low-power CMOS LNA based on dual resistive-feedback structure with peaking inductor for wideband application

2013 ◽  
Vol 5 (1) ◽  
pp. 65-70 ◽  
Author(s):  
Meng-Ting Hsu ◽  
Shih-Yu Hsu ◽  
Yu-Hwa Lin
Keyword(s):  
Low Power ◽  
Noise Figure ◽  
Low Noise ◽  
Cmos Process ◽  
Output Stage ◽  
Chip Area ◽  
Inductive Peaking ◽  
Resistive Feedback ◽  
Low Power Cmos ◽  
Noise Amplifier

This paper presents a low-power and low-noise amplifier (LNA) with resistive-feedback configuration. The design consists of two resistive-feedback amplifiers. In order to reduce the chip area, a resistive-feedback inverter is adopted for input matching. The output stage adopts basic topology of an RC feedback for output matching, and adds two inductors for inductive peaking at the high band. The implemented LNA has a peak gain of 10.5 dB, the input reflection coefficient S11 is lower than −8 dB and the output reflection S22 is lower than −10.8 dB, and noise figure of 4.2–5.2 dB is between 1 and 10 GHz while consuming 12.65 mW from a 1.5 V supply. The chip area is only 0.69 mm2 and the figure of merit is 6.64 including the area estimation. The circuit was fabricated in a TSMC 0.18 um CMOS process.

A Novel Dual-Mode Low Pass Sigma-Delta Modulator Chip Design for WCDMA and Bluetooth Applications

2013 ◽  
Vol 660 ◽  
pp. 113-118
Author(s):  
Jhin Fang Huang ◽  
Wen Cheng Lai ◽  
Kun Jie Huang ◽  
Ron Yi Liu
Keyword(s):  
Supply Voltage ◽  
Cmos Process ◽  
Dual Mode ◽  
Chip Design ◽  
Loop Filter ◽  
Sigma Delta Modulator ◽  
Sigma Delta ◽  
Chip Area ◽  
Low Pass ◽  
Σδ Modulator

A dual-mode low pass sigma-delta (ΣΔ) modulator at clock rates of 160 and 100 MHz respectively with cascaded integrators is presented for WCDMA and Bluetooth applications. One of main features is that cascaded integrators with feedback as well as distributed input coupling (CIFB) topology erase a summation amplifier and save power consumption. Another feature is that only one set loop filter is designed by switching capacitors to achieve a dual-mode function and greatly saves chip area. A prototype is fabricated in TSMC 0.18-m CMOS process. At the supply voltage of 1.8 V, measured results have achieved the SNDR of 42/33 dB over 1/2 MHz, respectively for Bluetooth/WCDMA. The chip dissipates a low power of 10.5 mW. Including pads the chip area is only 0.61 (0.71× 0.86) mm².

scholarly journals 24 GHz low-power switch-channel CMOS transceiver for wireless localization

2014 ◽  
Vol 7 (6) ◽  
pp. 615-622
Author(s):  
Tao Zhang ◽  
Amin Hamidian ◽  
Ran Shu ◽  
Viswanathan Subramanian
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Continuous Wave ◽  
Noise Figure ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Power Circuit ◽  
Chip Area ◽  
Switch Channel ◽  
24 Ghz

A 24 GHz low-power transceiver is designed, fabricated, and characterized using 130 nm complementary metal-oxide semiconductor (CMOS) process. The designed transceiver is targeted for frequency-modulated-continuous-wave (FMCW) wireless local positioning. The transceiver includes four switchable receiving channels, one transmitting channel and local-oscillator generation circuitries. Several power-saving techniques are implemented, such as switch channel and adaptive mixer biasing. The design aspects of the low-power circuit blocks and integration considerations are presented in details. The integrated transceiver has a chip area of only 2.2 mm × 1.7 mm. In transmitting mode the transceiver achieves an output power of 4 dBm and phase noise of −90 dBc/Hz at 1 MHz, while consuming 75 mW power consumption under 1.5 V power supply. In switch-channel receiving mode the transceiver demonstrates 31 dB gain and 6 dB noise figure with 65 mW power consumption. The transceiver measurements compare well with the simulated results and achieve state-of-the-art performance with very low-power consumption.

PULSED LOW POWER CMOS

1994 ◽  
Vol 05 (02) ◽  
pp. 159-177 ◽  
Author(s):  
THAD GABARA
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Signal Propagation ◽  
Capacitive Coupling ◽  
Cmos Process ◽  
Cmos Circuit ◽  
Static State ◽  
Low Power Dissipation ◽  
Power Capability ◽  
Circuit Technique

A simple CMOS circuit technique called PPS (Pulsed Power Supply) CMOS is used to reduce the power dissipation of Conventional 0.9 μm CMOS by 10X when operated at 32 MHz. Combinational and sequential logic can utilize this technique including the I/O (input/output) buffers. Thus, PPS CMOS offers a full chip solution for low power dissipation CMOS. In addition, several advantages occur in this new circuit technique: (1) low power signal propagation through several gates in series can occur during each evaluation cycle; (2) crowbar current does not occur; (3) additional placed devices, i.e. bipolar, diodes, JFETs are not required to generate this low power capability; (4) the Conventional CMOS process is used to fabricate the circuit; (5) the same physical layout can be used either as a PPS CMOS circuit or as a Conventional CMOS circuit; (6) the device count is the same as that of Conventional CMOS; (7) PPS CMOS uses quasistatic logic levels; (8) capacitive coupling is used to store and restore the contents of a memory cell; (9) the parasitic diodes of the MOS devices are used to improve the noise margin of the circuit; (10) PPS CMOS can easily hold a static state and have the same low power dissipation properties of data inactive Conventional CMOS.

scholarly journals None Operational Amplifier (OPA) Based: Design of Analogous Bandgap Reference Voltage

2016 ◽  
Author(s):  
Hao-Ping Chan ◽  
Yu-Cherng Hung
Keyword(s):  
Temperature Coefficient ◽  
Operational Amplifier ◽  
Supply Voltage ◽  
Reference Voltage ◽  
Cmos Process ◽  
Bandgap Reference ◽  
Chip Design ◽  
Chip Area ◽  
Voltage Variation ◽  
Current Variation

By using 0.35-um CMOS process, this work achieves a design of analogous band-gap reference voltage circuit with low temperature coefficient. The proposed circuit operates at 3V and generates a reference current of 44 uA. The HSPICE simulation results show the temperature coefficient of this circuit is 23 ppm/℃ at range of -10 ℃ to 100 ℃, and the line regulation (the ratio of output current variation to supply voltage variation) is estimated as 1.95 uA/V from supply voltage variation of 3 V to 5 V. The experimental chip is fabricated and measured. The circuit provides adjustable capability for output voltage among temperature variation of -10 - 100 ℃. The chip area is 534 × 695 um^2. In this new design, the operational amplifier is not necessary. The chip design effort can be great reduced.

scholarly journals Development of Low-Noise Small-Area 24 GHz CMOS Radar Sensor

2016 ◽  
Vol 2016 ◽  
pp. 1-12
Author(s):  
Min Yoon ◽  
Jee-Youl Ryu
Keyword(s):  
Low Power ◽  
Power Dissipation ◽  
Small Area ◽  
Noise Figure ◽  
Low Noise ◽  
Cmos Process ◽  
Radar Sensor ◽  
Low Power Dissipation ◽  
Chip Size ◽  
24 Ghz

We present a low-noise small-area 24 GHz CMOS radar sensor for automotive collision avoidance. This sensor is based on direct-conversion pulsed-radar architecture. The proposed circuit is implemented using TSMC 0.13 μm RF (radio frequency) CMOS (fT/fmax=120/140 GHz) technology, and it is powered by a 1.5 V supply. This circuit uses transmission lines to reduce total chip size instead of real bulky inductors for input and output impedance matching. The layout techniques for RF are used to reduce parasitic capacitance at the band of 24 GHz. The proposed sensor has low cost and low power dissipation since it is realized using CMOS process. The proposed sensor showed the lowest noise figure of 2.9 dB and the highest conversion gain of 40.2 dB as compared to recently reported research results. It also showed small chip size of 0.56 mm2, low power dissipation of 39.5 mW, and wide operating temperature range of −40 to +125°C.

scholarly journals Fully Integrated Light-Sensing Stimulator Design for Subretinal Implants

Sensors ◽  
2019 ◽  
Vol 19 (3) ◽  
pp. 536 ◽  
Author(s):  
Hosung Kang ◽  
Wajahat Abbasi ◽  
Seong-Woo Kim ◽  
Jungsuk Kim
Keyword(s):  
Low Power ◽  
Ex Vivo ◽  
Incident Light ◽  
Average Power ◽  
Image Sensor ◽  
High Density ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Chip Area ◽  
Fully Integrated

This paper presents a fully integrated photodiode-based low-power and low-mismatch stimulator for a subretinal prosthesis. It is known that a subretinal prosthesis achieves 1600-pixel stimulators on a limited single-chip area that is implanted beneath the bipolar cell layer. However, the high-density pixels cause high power dissipation during stimulation and high fabrication costs because of special process technologies such as the complementary metal-oxide semiconductor CMOS image sensor process. In addition, the many residual charges arising from the high-density pixel stimulation have deleterious effects, such as tissue damage and electrode corrosion, on the retina tissue. In this work, we adopted a switched-capacitor current mirror technique for the single-pixel stimulator (SPStim) that enables low power consumption and low mismatch in the subretinal device. The customized P+/N-well photodiode used to sense the incident light in the SPStim also reduces the fabrication cost. The 64-pixel stimulators are fabricated in a standard 0.35-μm CMOS process along with a global digital controller, which occupies a chip area of 4.3 × 3.2 mm2 and are ex-vivo demonstrated using a dissected pig eyeball. According to measured results, the SPStim accomplishes a maximum biphasic pulse amplitude of 143 μA, which dissipates an average power of 167 μW in a stimulation period of 5 ms, and an average mismatch of 1.12 % between the cathodic and anodic pulses.

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