scholarly journals Towards Energy Neutral Wireless Communications: Photovoltaic Cells to Connect Remote Areas

Energies ◽  
2019 ◽  
Vol 12 (19) ◽  
pp. 3772 ◽  
Author(s):  
Das ◽  
Poves ◽  
Fakidis ◽  
Sparks ◽  
Videv ◽  
...  
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Solar Panels ◽  
Free Space Optical ◽  
Solar Photovoltaics ◽  
Orkney Islands ◽  
Link Distance ◽  
Data Rates ◽  
Residential Properties ◽  
Self Powered

In this work, we have designed, developed and deployed the world’s first optical wireless communication (OWC) system using off-the-shelf lasers and solar photovoltaics. Four bidirectional OWC prototypes have been installed on the Orkney Islands of Scotland at a 30 m link distance for the provision of high-speed internet access to two residential properties. The silicon-made solar panels can harvest power up to 5 W from sunlight and they offer data rates as high as 8 Mb/s. Using additional analogue processing, data rates higher than the existing landline broadband connection are achieved. This breakthrough opens the development path to low cost, self-powered and plug-and-play free-space optical (FSO) systems.

Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers

2015 ◽  
Vol 2015 (1) ◽  
pp. 000379-000385 ◽  
Author(s):  
Brett Sawyer ◽  
Yuya Suzuki ◽  
Zihan Wu ◽  
Hao Lu ◽  
Venky Sundaram ◽  
...  
Keyword(s):  
High Speed ◽  
Metal Layer ◽  
Low Cost ◽  
Signal Propagation ◽  
Additive Process ◽  
Thin Glass ◽  
Fine Pitch ◽  
Data Rates ◽  
Insertion Losses

This paper describes the design, fabrication, and characterization of a two-metal layer RDL structure at 40 um pitch on thin glass interposers. Such an RDL structure is targeted at 2.5D glass interposer packages to achieve up to 1 TB/s die-to-die bandwidth and off-interposer data rates greater than 400 Gb/s, driven by consumer demand of online services for mobile devices. Advanced packaging architectures including 2.5D and 3D interposers require fine line lithography beyond the capabilities of current organic package substrates. Although silicon interposers fabricated using back-end-of-line processes can achieve these RDL wiring densities, they suffer from high electrical loss and high cost. Organic interposers with high wiring densities have also been demonstrated recently using a single sided thin film process. This paper goes beyond silicon and organic interposers in demonstrating fine pitch RDL on glass interposers fabricated by low cost, double sided, and panel-scalable processes. The high modulus and smooth surface of glass helps to achieve lithographic pitch close to that of silicon. Furthermore, the low loss tangent of glass helps in reducing dielectric losses, thus improving high-speed signal propagation. A semi-additive process flow and projection excimer laser ablation was used to fabricate two-metal layer RDL structures and bare glass RDL layers. A minimum of 3 um lithography and 20 um mico-via pitch was achieved. High-frequency characterization of these RDL structures demonstrated single-ended insertion losses of −0.097 dB/mm at f = 1 GHz and differential insertion losses of −0.05 dB/mm at f = 14 GHz.

High-Speed 120 Gbps AMI-WDM-PDM Free Space Optical Transmission System

2019 ◽  
Vol 40 (4) ◽  
pp. 429-433 ◽  
Author(s):  
Kamal Kishore Upadhyay ◽  
Saumya Srivastava ◽  
N. K Shukla ◽  
Sushank Chaudhary
Keyword(s):  
Wavelength Division Multiplexing ◽  
Free Space ◽  
Communication Systems ◽  
High Speed ◽  
Signal To Noise Ratio ◽  
Low Cost ◽  
Free Space Optical ◽  
Wavelength Division ◽  
Received Power ◽  
Polarization Division Multiplexing

Abstract Free space optical (FSO) communication systems are gaining high popularity from the last decade due to its various advantages such as no license spectrum, low-cost implementation etc. In this work, 160 Gbps data is transmitted over 8 km FSO link by adopting alternate mark inversion (AMI), wavelength division multiplexing (WDM) and polarization division multiplexing (PDM) schemes. The results are reported in terms of Q factor, bit error rate, signal to noise ratio, total received power and eye diagrams.

Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-μm Bump Pitch

2016 ◽  
Vol 13 (3) ◽  
pp. 128-135
Author(s):  
Brett Sawyer ◽  
Yuya Suzuki ◽  
Zihan Wu ◽  
Hao Lu ◽  
Venky Sundaram ◽  
...  
Keyword(s):  
High Speed ◽  
Metal Layer ◽  
Low Cost ◽  
Signal Propagation ◽  
Thin Glass ◽  
Fine Pitch ◽  
Data Rates ◽  
Insertion Losses ◽  
Low Permittivity

This article analyzes redistribution layer (RDL) technologies needed for 2.5-dimensional (2.5-D) die integration on thin glass interposers and developed using low-cost processes. The design, fabrication, and characterization of a four-metal layer RDL buildup required for wide input/output (I/O) routing at 40-μm bump pitch and a two-metal layer RDL buildup fabricated directly on glass for high-speed, off-package signaling are described. Such RDL technologies are targeted at 2.5-D glass interposer packages to achieve up to 1 Tb/s die-to-die bandwidth and off-interposer data rates > 400 Gb/s, driven by consumer demand of online services for mobile devices. Advanced packaging architectures including 2.5-D and 3-D interposers require fine-line lithography beyond the capabilities of current organic package substrates. High electrical loss and high cost are characteristic of silicon interposers fabricated using back-end-of-line (BEOL) processes that can achieve RDL wiring densities required for 2.5-D die integration. Organic interposers with high wiring densities have also been demonstrated using a single-sided, thin-film process. This article goes beyond silicon and organic interposers in demonstrating fine-pitch RDL on glass interposers fabricated by low-cost, double-side, and panel-scalable processes. The high modulus and smooth surface of glass help to achieve lithographic pitch close to that of silicon. Furthermore, the low permittivity and low loss tangent of glass reduce dielectric losses, thus improving high-speed signal propagation. A semiadditive process flow and projection excimer laser ablation were used to fabricate four-metal layer (2 + 0 + 2) fine-pitch RDL and two-metal layer RDL directly on glass. A minimum of 3 μm lithography and 20 μm microvia pitch was achieved. High-frequency characterization of these RDL structures demonstrated single-ended insertion losses of −0.097 dB/mm at f = 1 GHz and differential insertion losses of −0.05 dB/mm at f = 14 GHz.

scholarly journals EM-Based High Speed Wireless Sensor Networks for Underwater Surveillance and Target Tracking

2017 ◽  
Vol 2017 ◽  
pp. 1-14 ◽  
Author(s):  
Kumudu Munasinghe ◽  
Mohammed Aseeri ◽  
Sultan Almorqi ◽  
Md. Farhad Hossain ◽  
Musbiha Binte Wali ◽  
...  
Keyword(s):  
Wireless Sensor Networks ◽  
Sensor Networks ◽  
Target Tracking ◽  
Communication Systems ◽  
High Speed ◽  
Low Cost ◽  
Wireless Sensor ◽  
Surveillance Systems ◽  
Major Step ◽  
Data Rates

Underwater Wireless Sensor Networks (UWSNs) are considered as tangible, low cost solution for underwater surveillance and exploration. Existing acoustic wave-based UWSN systems fail to meet the growing demand for fast data rates required in military operations, oil/gas exploration, and oceanographic data collection. Electromagnetic (EM) wave-based communication systems, on the other hand, have great potential for providing high speed data rates in such scenarios. This paper will(1)discuss the challenges faced in the utilization of EM waves for the design of tactical underwater surveillance systems and(2)evaluate several EM wave-based three-dimensional (3D) UWSN architectures differing in topologies and/or operation principles on the performance of localization and target tracking. To the best of our knowledge, this is the first of its kind in the field of underwater communications where underwater surveillance techniques for EM wave-based high speed UWSNs have been investigated. Thus, this will be a major step towards achieving future high speed UWSNs.

scholarly journals Single-Fiber Bidirectional Optical Data Links with Monolithic Transceiver Chips

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Alexander Kern ◽  
Sujoy Paul ◽  
Dietmar Wahl ◽  
Ahmed Al-Samaneh ◽  
Rainer Michalzik
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Full Duplex ◽  
Optical Data ◽  
Cavity Surface ◽  
Material System ◽  
Large Area ◽  
Core Diameter ◽  
Data Rates ◽  
Electrooptical Properties

We report the monolithic integration, fabrication, and electrooptical properties of AlGaAs-GaAs-based transceiver (TRx) chips for 850 nm wavelength optical links with data rates of multiple Gbit/s. Using a single butt-coupled multimode fiber (MMF), low-cost bidirectional communication in half- and even full-duplex mode is demonstrated. Two design concepts are presented, based on a vertical-cavity surface-emitting laser (VCSEL) and a monolithically integrated p-doped-intrinsic-n-doped (PIN) or metal-semiconductor-metal (MSM) photodetector. Whereas the VCSEL-PIN photodiode (PD) chips are used for high-speed bidirectional data transmission over 62.5 and 50 μm core diameter MMFs, MSM TRx chips are employed for 100 or 200 μm large-area fibers. Such a monolithic transceiver design based on a well-established material system and avoiding the use of external fiber coupling optics is well suited for inexpensive and compact optical interconnects over distances of a few hundred meters. Standard MMF networks can thus be upgraded using high-speed VCSEL-PIN transceiver chips which are capable to handle data rates of up to 10 Gbit/s.

scholarly journals Availability Prediction Methods for Terrestrial Free-Space-Optical Link Under Tropical Climate

2018 ◽  
Vol 10 (1) ◽  
pp. 224
Author(s):  
Ahmed Basahel ◽  
Md Rafiqul Islam ◽  
Mohamed Habaebi ◽  
Suriza Ahmad
Keyword(s):  
Free Space ◽  
High Speed ◽  
Weather Conditions ◽  
Tropical Climate ◽  
Prediction Methods ◽  
Free Space Optical ◽  
Tropical Regions ◽  
Link Distance ◽  
Link Budget ◽  
Point To Point

<p>Free-space optical (FSO) links provide high speed point-to-point wireless communication, but its availability can easily be affected by weather conditions. In heavy rainfall regions, FSO links are relatively sensitive to rain. Availability prediction of FSO is indispensable part, especially in tropical areas. In this paper, methods to predict FSO link availability are presented. The overall performance of FSO link is described in terms of the availability that can be achieved over anticipated link distance. The availability prediction methods demonstrated for an FSO link ranges up to 5 km. The availability prediction methods are based on long-term statistics of atmospheric attenuations and FSO link budget under tropical climate condition. In tropical regions, for a terrestrial FSO link, carrier class availability can be achieved over a few hundred meters only; whereas enterprise class availability can be achieved over a few kilometers link distances. </p>

Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽  
2014 ◽  
Vol 13 (2) ◽  
pp. 17-25
Author(s):  
JUNMING SHU ◽  
ARTHAS YANG ◽  
PEKKA SALMINEN ◽  
HENRI VAITTINEN
Keyword(s):  
Titanium Dioxide ◽  
High Speed ◽  
Food Packaging ◽  
Production Efficiency ◽  
Positive Impact ◽  
Low Cost ◽  
Board Structure ◽  
Flexographic Printing ◽  
Curtain Coating ◽  
Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

Low-Cost High-Speed Techniques for Real-Time Simulation of Power Electronic Systems

2007 ◽  
Author(s):  
R. E. Crosbie ◽  
J. J. Zenor ◽  
R. Bednar ◽  
D. Word ◽  
N. G. Hingorani
Keyword(s):  
Real Time ◽  
High Speed ◽  
Low Cost ◽  
Electronic Systems ◽  
Power Electronic ◽  
Real Time Simulation ◽  
Time Simulation

High-speed electro-optic switch using buried electrode structure in polymer Mach–Zehnder waveguide

2016 ◽  
Vol 30 (06) ◽  
pp. 1650063 ◽  
Author(s):  
Jingwen Sun ◽  
Jian Sun ◽  
Yunji Yi ◽  
Lucheng Qv ◽  
Shiqi Sun ◽  
...  
Keyword(s):  
Insertion Loss ◽  
Rise Time ◽  
High Speed ◽  
Low Cost ◽  
Characteristic Parameters ◽  
Electrode Structure ◽  
Processing Cost ◽  
Electro Optic ◽  
Disperse Red 1 ◽  
Excellent Photostability

A low-cost and high-speed electro-optic (EO) switch using the guest–host EO material Disperse Red 1/Polymethyl Methacrylate (DR1/PMMA) was designed and fabricated. The DR1/PMMA material presented a low processing cost, an excellent photostability and a large EO coefficient of 13.1 pm/V. To improve the performance of the switch, the in-plane buried electrode structure was introduced in the polymer Mach–Zehnder waveguide to improve the poling and modulating efficiency. The characteristic parameters of the waveguide and the electrodes were carefully designed and the fabrication process was strictly controlled. Under 1550 nm, the insertion loss of the device was 12.7 dB. The measured switching rise time and fall time of the switch were 50.00 ns and 54.29 ns, respectively.

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