scholarly journals Single-Fiber Bidirectional Optical Data Links with Monolithic Transceiver Chips

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Alexander Kern ◽  
Sujoy Paul ◽  
Dietmar Wahl ◽  
Ahmed Al-Samaneh ◽  
Rainer Michalzik
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Full Duplex ◽  
Optical Data ◽  
Cavity Surface ◽  
Material System ◽  
Large Area ◽  
Core Diameter ◽  
Data Rates ◽  
Electrooptical Properties

We report the monolithic integration, fabrication, and electrooptical properties of AlGaAs-GaAs-based transceiver (TRx) chips for 850 nm wavelength optical links with data rates of multiple Gbit/s. Using a single butt-coupled multimode fiber (MMF), low-cost bidirectional communication in half- and even full-duplex mode is demonstrated. Two design concepts are presented, based on a vertical-cavity surface-emitting laser (VCSEL) and a monolithically integrated p-doped-intrinsic-n-doped (PIN) or metal-semiconductor-metal (MSM) photodetector. Whereas the VCSEL-PIN photodiode (PD) chips are used for high-speed bidirectional data transmission over 62.5 and 50 μm core diameter MMFs, MSM TRx chips are employed for 100 or 200 μm large-area fibers. Such a monolithic transceiver design based on a well-established material system and avoiding the use of external fiber coupling optics is well suited for inexpensive and compact optical interconnects over distances of a few hundred meters. Standard MMF networks can thus be upgraded using high-speed VCSEL-PIN transceiver chips which are capable to handle data rates of up to 10 Gbit/s.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

High-Speed Semiconductor Vertical-Cavity Surface-Emitting Lasers for Optical Data-Transmission Systems (Review)

2018 ◽  
Vol 44 (1) ◽  
pp. 1-16 ◽  
Author(s):  
S. A. Blokhin ◽  
N. A. Maleev ◽  
M. A. Bobrov ◽  
A. G. Kuzmenkov ◽  
A. V. Sakharov ◽  
...  
Keyword(s):  
Data Transmission ◽  
High Speed ◽  
Optical Data ◽  
Cavity Surface ◽  
Transmission Systems ◽  
Surface Emitting Lasers ◽  
Vertical Cavity Surface ◽  
Emitting Lasers ◽  
Vertical Cavity

Design and Demonstration of 40 micron Bump Pitch Multi-layer RDL on Panel-based Glass Interposers

2015 ◽  
Vol 2015 (1) ◽  
pp. 000379-000385 ◽  
Author(s):  
Brett Sawyer ◽  
Yuya Suzuki ◽  
Zihan Wu ◽  
Hao Lu ◽  
Venky Sundaram ◽  
...  
Keyword(s):  
High Speed ◽  
Metal Layer ◽  
Low Cost ◽  
Signal Propagation ◽  
Additive Process ◽  
Thin Glass ◽  
Fine Pitch ◽  
Data Rates ◽  
Insertion Losses

This paper describes the design, fabrication, and characterization of a two-metal layer RDL structure at 40 um pitch on thin glass interposers. Such an RDL structure is targeted at 2.5D glass interposer packages to achieve up to 1 TB/s die-to-die bandwidth and off-interposer data rates greater than 400 Gb/s, driven by consumer demand of online services for mobile devices. Advanced packaging architectures including 2.5D and 3D interposers require fine line lithography beyond the capabilities of current organic package substrates. Although silicon interposers fabricated using back-end-of-line processes can achieve these RDL wiring densities, they suffer from high electrical loss and high cost. Organic interposers with high wiring densities have also been demonstrated recently using a single sided thin film process. This paper goes beyond silicon and organic interposers in demonstrating fine pitch RDL on glass interposers fabricated by low cost, double sided, and panel-scalable processes. The high modulus and smooth surface of glass helps to achieve lithographic pitch close to that of silicon. Furthermore, the low loss tangent of glass helps in reducing dielectric losses, thus improving high-speed signal propagation. A semi-additive process flow and projection excimer laser ablation was used to fabricate two-metal layer RDL structures and bare glass RDL layers. A minimum of 3 um lithography and 20 um mico-via pitch was achieved. High-frequency characterization of these RDL structures demonstrated single-ended insertion losses of −0.097 dB/mm at f = 1 GHz and differential insertion losses of −0.05 dB/mm at f = 14 GHz.

An Integrated High-Speed Full Duplex Coherent OFDM-PON and Visible-Light Communication System

2019 ◽  
Vol 0 (0) ◽  
Author(s):  
Simarpreet Kaur ◽  
Mahendra Kumar ◽  
Ashu Verma
Keyword(s):  
Visible Light ◽  
Optical Networks ◽  
High Speed ◽  
Light Emitting Diode ◽  
Low Cost ◽  
Dispersion Compensation ◽  
Optical Network ◽  
Visible Light Communication ◽  
Passive Optical Network ◽  
Full Duplex

AbstractWe demonstrated a full duplex hybrid passive optical network and indoor optical wireless system employing coherent optical frequency division multiplexing. To accomplish reliable transmission in passive optical networks integrated visible-light communication (VLC), yellow light-emitting diode and infrared LED is used in downstream and upstream, respectively, for intra building network. In order to support high data rate, pulse-width reduction scheme based on dispersion compensation fiber is incorporated and system successfully covered the distance of 50 km. A data stream at the rate of 30 Gb/s is transmitted for each user out of eight users. VLC-supported users are catered with the bit rate of 1.87 Gb/s over 150 cm and in order to realize a low-cost system, visible and infrared LEDs are used in downlink and uplink, respectively.

Recent Progress of Electro-optic Polymers for Device Applications

1997 ◽  
Vol 488 ◽  
Author(s):  
Alex K-Y. Jen ◽  
Qing Yang ◽  
Seth R. Marder ◽  
Larry R. Dalton ◽  
Ching-Fong Shu
Keyword(s):  
Data Storage ◽  
High Speed ◽  
Stable State ◽  
Optical Data Storage ◽  
Device Fabrication ◽  
Optical Data ◽  
Material System ◽  
Electro Optic ◽  
Potential Applications ◽  
Device Applications

AbstractElectro-optic (E-O) polymers have drawn great interest in recent years because of their potential applications in photonics devices such as high speed modulators and switches, optical data storage and information processing1–2. In order to have suitable materials for device fabrication, it is essential to design and develop polymeric material systems (active and passive polymers) with matched refractive indices, large E-O coefficients, good temporal and photochemical stability3–8 The E-O response of an active polymer commonly arises from the electric field induced alignment of its second-order nonlinear optical (NLO) chromophore, either doped as a guest/host system or covalently bonded as a side-chain. Because of the strong interaction among the electric dipoles, the poled structure is in a meta-stable state; the poled NLO chromophores which possess large dipole moment will tend to relax back to the randomly oriented state. As a result, the stability of the poled structure strongly depends on the rigidity of the overall material system. As it might be expected, the continuous increases of the rigidity and Tg of poled polymers imposes constraints on the selection of suitable chromophores that can survive the hightemperature poling and processing conditions. To circumvent this problem, we have developed a series of chromophores that possess conformation-locked geometry and perfluoro-dicyanovinylsubstituted electron-accepting group which demonstrate both good thermal stabilty and nonlinearity. This paper provides a brief review of these highly efficient and thermally stable chromophores and polymers for device applications.

scholarly journals Study of Gain Switching in Vertical Cavity Surface Emitting Laser under Different Electrical Pulse Inputs

2020 ◽  
Vol 70 (5) ◽  
pp. 538-541
Author(s):  
K. Murali Krishna ◽  
M. Ganesh Madhan ◽  
P. Ashok
Keyword(s):  
Pulse Width ◽  
High Speed ◽  
Peak Power ◽  
Pulse Generation ◽  
Optical Data ◽  
Cavity Surface ◽  
Gain Switching ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity

Vertical cavity surface emitting laser (VCSEL) is a strong candidate for short pulse generation among the other semiconductor lasers in the era of laser technology. A 1550 nm, low power VCSEL is excited under different current shapes and the chief laser parameters are found out. The concept of gain switching under various current profiles are utilized effectively to bring out maximum laser power with minimum pulse width, which are the essential factors for long haul high speed optical data transmission. For a haversine electrical current input with 3.7 Ith amplitude, a laser peak power of 2.2 mW at 57 ps pulse width is obtained. In the case of trapezoidal pulse, 67 ps pulse width is obtained for 2.6 Ith current amplitude. It is also observed that square pulse of amplitude 2 Ith produces short optical pulse of 0.887 mW peak power and 89 ps width which shows the best performance when compared to other forms of pulses discussed in this work at the same input condition.

scholarly journals Исследование статических и динамических характеристик сплавного VCSEL C-диапазона в режиме оптико-электрического преобразователя

2018 ◽  
Vol 44 (1) ◽  
pp. 76
Author(s):  
М.Е. Белкин
Keyword(s):  
Fiber Optics ◽  
Wavelength Division Multiplexing ◽  
High Speed ◽  
Low Cost ◽  
Optical Cavity ◽  
Resonant Cavity ◽  
Cavity Surface ◽  
Telecommunication System ◽  
Wavelength Division ◽  
Photo Detection

AbstractThe results of an experimental study for a long wavelength vertical cavity surface-emitting laser of a wafer-fused construction as an effective resonant cavity enhanced photodetector of analog optical signals are described. The device is of interest for a number of promising microwave photonics applications and for creation of a low-cost photoreceiver in a high-speed fiber optics telecommunication system with dense wavelength division multiplexing. The schematic of the testbed, the original technique allowing to calculate the passband of the built-in optical cavity, and the results of measuring dark current, current responsivity, amplitude- and phase-frequency characteristics during the process of photo-detection are demonstrated.

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

2001 ◽  
Vol 124 (1) ◽  
pp. 1-6 ◽  
Author(s):  
Swapan K. Bhattacharya ◽  
Rao R. Tummala
Keyword(s):  
Low Cost ◽  
Ceramic Composites ◽  
Material System ◽  
Large Area ◽  
Passive Components ◽  
Capacitance Density ◽  
Glass Substrates ◽  
Ceramic Thin Films ◽  
Low Temperature Processing ◽  
Novel Material

Polymer/ceramic composite emerges as a novel material system for application as integral capacitors for the next generation of microelectronic industry where the discrete passive components such as capacitors, resistors, and inductors are likely to be replaced by the embedded components. In this study, epoxy based nanocomposites are selected due to their low-cost and low temperature processing advantages in comparison to the traditional polymers used in the microelectronic industry today. Other potential advantages of epoxy materials could be their aqueous based fabrication process and availability in the form of dry films for direct lamination onto substrates. This paper reports dielectric properties of epoxy nanocomposites made from three commercially available resin composites (i) a solvent based photodefinable epoxy, (ii) an aqueous based photodefinable epoxy, and (iii) a non-photodefinable epoxy. Possible avenues for achieving higher capacitance density in polymer/ceramic composites for future needs have been discussed. Deposition of polymer/ceramic thin films on a 300 mm×300 mm PWB and glass substrates has been demonstrated using a state-of-the-art meniscus coater. The end goal of this study is to develop a defect-free manufacturable process for depositing and patterning particulate epoxy composite capacitors on large area PWB substrates. It is believed that the large area process will reduce the overall manufacturing costs and increase process yield, thus facilitate the economic viability of the integral passive technology.

scholarly journals Theoretical Uniformity Analysis and Improvement of Spray Deposition by Mixing Nozzles with Heating Conditions

Coatings ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 81
Author(s):  
Xuran Dong ◽  
Xiaolong Pan ◽  
Xianxian Gao ◽  
Haisheng Fang
Keyword(s):  
High Speed ◽  
Heating Temperature ◽  
Spray Deposition ◽  
Low Cost ◽  
Spray Coating ◽  
Deposition Process ◽  
Test Method ◽  
Large Area ◽  
Orthogonal Test Method ◽  
Experimental Trials

Spray coating is widely used in the manufacture of deposited layers of electronic devices due to its unique advantages of high-speed deposition over a large area. To improve the spray deposition process for further low-cost and uniform production, the uniformity of the spray deposition should be systematically investigated. The current study, however, mainly focuses on the experimental trials with few numerical directions especially for the mixing nozzle sprayers with heating conditions. In the paper, we conduct a theoretical study on the uniformity of the internal and external mixing nozzles. The influencing factors include the initial angle, the total ink flow rate, the transporting gas velocity and the distance from the nozzle to the substrate. Then, the orthogonal test method is adopted to obtain the optimal combination of the parameters. Finally, the effects of different heating modes on the uniformity have been further studied. The results show that these factors influence the uniformity with the two types of nozzles to a different degree. The evaporation of the atomized droplets can effectively improve the uniformity in a certain temperature range. The heating temperature with the highest uniformity is various depending on the heating modes, which should be carefully addressed during the actual production.

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