scholarly journals Dynamic Mechanical Damage and Non-Shock initiation of a New Polymer Bonded Explosive during Penetration

Polymers ◽  
2020 ◽  
Vol 12 (6) ◽  
pp. 1342
Author(s):  
Xiao Li ◽  
Yizhi Liu ◽  
Yi Sun
Keyword(s):  
Heat Generation ◽  
Mechanical Damage ◽  
Middle Part ◽  
Frictional Heat ◽  
Interfacial Friction ◽  
Shock Initiation ◽  
Proposed Model ◽  
Simulation Results ◽  
Steel Projectiles ◽  
Dynamic Damage

Complexities of heating mechanisms make it difficult to investigate the safety of a polymer bonded explosive (PBX) charge of earth-penetrating-weapons (EPWs) during penetration. In this paper, the dynamic damage and non-shock initiation of PBX1314 (60 wt % hexahydro-1, 3, 5-trinitro-1, 3, 5-s-triazine (RDX), 16 wt % aluminum, 24 wt % hydroxy-terminated polybutadiene (HTPB)) during penetration is investigated through experiments and simulations. In the experiments, steel projectiles filled with PBX1314 are launched to penetrate concrete targets. In the results, non-shock initiations occur on the tail surface of PBX1314 along with mechanical damage of the tail and middle part of PBX1314. A dynamic damage and initiation model is proposed to characterize the effects of microcracks on the mechanical and thermal responses of PBX1314. Investigation based on the model suggests that microcrack interfacial friction plays significant roles in damage, heat generation and localization in PBX1314. A non-shock initiation criterion is developed based on macroscale variables in PBX1314. Numerical simulations of the penetration experiments are performed by using the proposed model and criterion. The mechanical damage and non-shock initiation of PBX1314 in the experiments are successfully predicted. The simulation results indicate that the tail of PBX1314 impacts the projectile repeatedly during penetration. Finally, the initiation criterion is satisfied because of frictional heat localization near microcrack surfaces and initiation is activated in the tail of PBX1314.

scholarly journals Effect of Pin Shape on Thermal History of Aluminum-Steel Friction Stir Welded Joint: Computational Fluid Dynamic Modeling and Validation

Materials ◽  
2021 ◽  
Vol 14 (24) ◽  
pp. 7883
Author(s):  
Dmitry Olegovich Bokov ◽  
Mohammed Abed Jawad ◽  
Wanich Suksatan ◽  
Mahmoud E. Abdullah ◽  
Aleksandra Świerczyńska ◽  
...  
Keyword(s):  
Heat Generation ◽  
Fluid Dynamic ◽  
Low Carbon Steel ◽  
Flow Simulation ◽  
Total Heat ◽  
Frictional Heat ◽  
Low Carbon ◽  
Maximum Heat ◽  
Friction Stir ◽  
Simulation Results

This article studied the effects of pin angle on heat generation and temperature distribution during friction stir welding (FSW) of AA1100 aluminum alloy and St-14 low carbon steel. A validated computational fluid dynamics (CFD) model was implemented to simulate the FSW process. Scanning electron microscopy (SEM) was employed in order to investigate internal materials’ flow. Simulation results revealed that the mechanical work on the joint line increased with the pin angle and larger stir zone forms. The simulation results show that in the angled pin tool, more than 26% of the total heat is produced by the pin. Meanwhile, in other cases, the total heat produced by the pin was near 15% of the total generated heat. The thermo-mechanical cycle in the steel zone increased, and consequently, mechanical interlock between base metals increased. The simulation output demonstrated that the frictional heat generation with a tool without a pin angle is higher than an angled pin. The calculation result also shows that the maximum heat was generated on the steel side.

Wear of a Tool in Double-Disk Lapping of Silicon Wafers

2010 ◽  
Author(s):  
Adam Barylski ◽  
Mariusz Deja
Keyword(s):  
Experimental Data ◽  
Integrated Circuits ◽  
Tool Wear ◽  
Silicon Wafers ◽  
Silicon Ingot ◽  
Proposed Model ◽  
Tool Wear Prediction ◽  
Simulation Results ◽  
High Degree ◽  
Kinematical Parameters

Silicon wafers are the most widely used substrates for fabricating integrated circuits. A sequence of processes is needed to turn a silicon ingot into silicon wafers. One of the processes is flattening by lapping or by grinding to achieve a high degree of flatness and parallelism of the wafer [1, 2, 3]. Lapping can effectively remove or reduce the waviness induced by preceding operations [2, 4]. The main aim of this paper is to compare the simulation results with lapping experimental data obtained from the Polish producer of silicon wafers, the company Cemat Silicon from Warsaw (www.cematsil.com). Proposed model is going to be implemented by this company for the tool wear prediction. Proposed model can be applied for lapping or grinding with single or double-disc lapping kinematics [5, 6, 7]. Geometrical and kinematical relations with the simulations are presented in the work. Generated results for given workpiece diameter and for different kinematical parameters are studied using models programmed in the Matlab environment.

An improved model on forecasting temperature rise of high-speed angular contact ball bearings considering structural constraints

2018 ◽  
Vol 70 (1) ◽  
pp. 15-22 ◽  
Author(s):  
De-xing Zheng ◽  
Weifang Chen ◽  
Miaomiao Li
Keyword(s):  
Heat Generation ◽  
Temperature Rise ◽  
High Speed ◽  
Structural Constraints ◽  
Ball Bearings ◽  
Content Type ◽  
Grid Model ◽  
Simulation Results ◽  
Operation Parameters ◽  
Improved Model

Purpose Thermal performances are key factors impacting the operation of angular contact ball bearings. Heat generation and transfer about angular contact ball bearings, however, have not been addressed thoroughly. So far, most researchers only considered the convection effect between bearing housings and air, whereas the cooling/lubrication operation parameters and configuration effect were not taken into account when analyzing the thermal behaviors of bearings. This paper aims to analyze the structural constraints of high-speed spindle, structural features of bearing, heat conduction and convection to study the heat generation and transfer of high-speed angular contact ball bearings. Design/methodology/approach Based on the generalized Ohm’s law, the thermal grid model of angular contact ball bearing of high-speed spindle was first established. Next Gauss–Seidel method was used to solve the equations group by Matlab, and the nodes temperature was calculated. Finally, the bearing temperature rise was tested, and the comparative analysis was made with the simulation results. Findings The results indicate that the simulation results of bearing temperature rise for the proposed model are in better agreement with the test values. So, the thermal grid model established is verified. Originality/value This paper shows an improved model on forecasting temperature rise of high-speed angular contact ball bearings. In modeling, the cooling/lubrication operation parameters and structural constraints are integrated. As a result, the bearing temperature variation can be forecasted more accurately, which may be beneficial to improve bearing operating accuracy and bearing service life.

Thermomechanical Model of Spot Welding for Calculating Residual Stresses

2003 ◽  
Author(s):  
Lijun Xu ◽  
Jamil A. Khan
Keyword(s):  
Residual Stresses ◽  
Heat Generation ◽  
Spot Welding ◽  
Welding Process ◽  
Mechanical Analysis ◽  
Temperature Dependent ◽  
Thermomechanical Model ◽  
Faying Surface ◽  
Proposed Model ◽  
Electrode Interface

A comprehensive axisymmetric model of the coupled thermal-electrical-mechanical analysis predicting weld nugget development and residual stresses for the resistance spot welding process of Al-alloys is developed. The model estimates the heat generation at the faying surface, the workpiece-electrode interface, and the Joule heating of the workpiece and electrode. The phase change due to melting in the weld pool is considered. The contact area and its pressure distribution at both the faying surface and the electrode-workpiece interface are determined from a coupled thermal-mechanical model using a finite element method. The knowledge of the interface pressure provides accurate prediction of the interfacial heat generation. For the numerical model, temperature dependent thermal, electrical and mechanical properties are used. The proposed model can successfidly calculate the nugget diameter and thickness, and predict the residual stresses and the elastic-plastic deformation history. The calculated nugget shape and the deformation of sheets based on the model are compared with the experimental data. The computed residual stresses approach the distribution of experimental measurement of the residual stress.

A Greenwood-Williamson Model of Small-Scale Friction

2005 ◽  
Vol 74 (1) ◽  
pp. 31-40 ◽  
Author(s):  
Reese E. Jones
Keyword(s):  
Numerical Method ◽  
Recursion Formula ◽  
Three Dimensional ◽  
Interfacial Friction ◽  
Small Scale ◽  
Analytical Estimate ◽  
Normal Loading ◽  
Proposed Model ◽  
Loading Case ◽  
Transition Length

A Greenwood and Williamson based model for interfacial friction is presented that incorporates the presliding transition phenomenon that can significantly affect small devices. This work builds on previous similar models by developing: an analytical estimate of the transition length in terms of material and surface parameters, a general recursion formula for the case of slip in one direction with multiple reversals and constant normal loading, and a numerical method for the general three-dimensional loading case. In addition, the proposed model is developed within a plasticity-like framework and is shown to have qualitative similarities with published experimental observations. A number of model problems illustrate the response of the proposed model to various loading conditions.

Highly Subcooled Flow Boiling: A Model for Estimating Heat Transfer Behind Sliding Bubbles in a Narrow Channel

2012 ◽  
Author(s):  
Arif B. Ozer ◽  
Donald K. Hollingsworth ◽  
Larry. C. Witte
Keyword(s):  
Heat Transfer ◽  
Flow Field ◽  
Heat Generation ◽  
Wall Temperature ◽  
Flow Boiling ◽  
Narrow Channel ◽  
Heated Wall ◽  
Uniform Heat ◽  
Proposed Model ◽  
Sliding Bubbles

A quenching/diffusion analytical model has been developed for predicting the wall temperature and wall heat flux behind bubbles sliding in a confined narrow channel. The model is based on the concept of a well-mixed liquid region that enhances the heat transfer near the heated wall behind the bubble. Heat transfer in the liquid is treated as a one-dimensional transient conduction process until the flow field recovers back to its undisturbed level prior to bubble passage. The model is compared to experimental heat transfer results obtained in a high-aspect-ratio (1.2×23mm) rectangular, horizontal channel with one wide wall forming a uniform-heat-generation boundary and the other designed for optical access to the flow field. The working fluid was Novec™ 649. A thermochromic liquid crystal coating was applied to the outside of the uniform-heat-generation boundary, so that wall temperature variations could be obtained and heat transfer coefficients and Nusselt numbers could be obtained. The experiments were focused on high inlet subcooling, typically 15–50°C. The model is able to capture the elevated heat transfer rates measured in the channel without the need to consider nucleate boiling from the surface or microlayer evaporation from the sliding bubbles. Surface temperatures and wall heat fluxes were estimated for 17 different experimental conditions using the proposed model. Results agreed with the measured values within ±15% accuracy. The insight gathered from comparing the results of the proposed model to experimental results provides the basis for a better understanding of the physics of subcooled bubbly flow in narrow channels.

Methods of Mathematical Modeling of the Leaching Process of Cobalt-Containing Solutions

2021 ◽  
Vol 316 ◽  
pp. 661-666
Author(s):  
Nataliya V. Mokrova
Keyword(s):  
Mathematical Modeling ◽  
Mathematical Model ◽  
Chemical Kinetics ◽  
Group Method ◽  
Data Handling ◽  
Multistage Processes ◽  
Leaching Process ◽  
Proposed Model ◽  
Simulation Results ◽  
The Mathematical Model

Current cobalt processing practices are described. This article discusses the advantages of the group argument accounting method for mathematical modeling of the leaching process of cobalt solutions. Identification of the mathematical model of the cascade of reactors of cobalt-producing is presented. Group method of data handling is allowing: to eliminate the need to calculate quantities of chemical kinetics; to get the opportunity to take into account the results of mixed experiments; to exclude the influence of random interference on the simulation results. The proposed model confirms the capabilities of the group method of data handling for describing multistage processes.

ACCURATE ANALYSIS OF GLOBAL INTERCONNECTS IN NANO-FPGAs

NANO ◽  
2009 ◽  
Vol 04 (03) ◽  
pp. 171-176 ◽  
Author(s):  
DAVOOD FATHI ◽  
BEHJAT FOROUZANDEH
Keyword(s):  
Propagation Delay ◽  
Modeling Method ◽  
Accurate Analysis ◽  
Proposed Model ◽  
Simulation Results ◽  
The Difference ◽  
A New Technique ◽  
Global Interconnects ◽  
Technology Nodes ◽  
Model Technique

This paper introduces a new technique for analyzing the behavior of global interconnects in FPGAs, for nanoscale technologies. Using this new enhanced modeling method, new enhanced accurate expressions for calculating the propagation delay of global interconnects in nano-FPGAs have been derived. In order to verify the proposed model, we have performed the delay simulations in 45 nm, 65 nm, 90 nm, and 130 nm technology nodes, with our modeling method and the conventional Pi-model technique. Then, the results obtained from these two methods have been compared with HSPICE simulation results. The obtained results show a better match in the propagation delay computations for global interconnects between our proposed model and HSPICE simulations, with respect to the conventional techniques such as Pi-model. According to the obtained results, the difference between our model and HSPICE simulations in the mentioned technology nodes is (0.29–22.92)%, whereas this difference is (11.13–38.29)% for another model.

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