Evaluation and Characterization of Reliable Packaging Method for Neuromotor Prosthetic Device

2013 ◽  
Vol 651 ◽  
pp. 367-371
Author(s):  
Kwan Ling Tan ◽  
Rui Qi Lim ◽  
Tack Boon Yee ◽  
Ming Yua Cheng
Keyword(s):  
Integrated Circuit ◽  
Three Dimensional ◽  
Electroless Nickel ◽  
Bonding Parameters ◽  
Application Specific Integrated Circuit ◽  
Electrical Connections ◽  
Application Specific ◽  
Test Result ◽  
Probe Array

Neural probe array is used for neural recording and simulation applications. It will be implanted into the motor cortex of a paralytic human to control robotic arm and perform tasks such as grasping an object. The major components are silicon (Si) probes, Si platform, application-specific integrated circuit (ASIC), polyimide flexible cable and wireless IC. In-plane Si probes are inserted into the Si platform to form a three-dimensional (3D) probe array. Wirebonding technique is used to integrate the ASIC and the probe array. Pad finishes play an important role in wire bonding as it would affect the reliability of the electrical connections. As such, the focus of the paper will be on the evaluation and characterization of an electroless nickel immersion gold (ENIG) pad finishing and its bonding parameters for wirebonding application. ENIG pad having a 0.1-µm gold (Au) thickness combined with an additional Au stud and wirebonding temperature of 200 °C are found to have comparable wirebonding capabilities as a 0.3-µm thick Au finishing pad. The wire pull test result and SEM observation between the ENIG and Au finishing pad at different bonding parameters were presented and discussed.

scholarly journals Implementation of a CMOS/MEMS Accelerometer with ASIC Processes

Micromachines ◽  
2019 ◽  
Vol 10 (1) ◽  
pp. 50 ◽  
Author(s):  
Yu-Sian Liu ◽  
Kuei-Ann Wen
Keyword(s):  
Integrated Circuit ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Mems Accelerometer ◽  
Cmos Mems ◽  
Application Specific Integrated Circuit ◽  
Micro Electromechanical System ◽  
Application Specific ◽  
Mems Process

This paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using the 0.18 μm application-specific integrated circuit (ASIC)-compatible CMOS/MEMS process. An approximate analytical model for the spring design is presented. The experiments showed that the resonant frequency of the proposed tri-axis accelerometer was around 5.35 kHz for out-plane vibration. The tri-axis accelerometer had an area of 1096 μm × 1256 μm.

A CMOS ANALOG INTEGRATED CIRCUIT FOR PIXEL X-RAY DETECTOR

2011 ◽  
Vol 20 (01) ◽  
pp. 71-87 ◽  
Author(s):  
DAVID FITRIO ◽  
SUHARDI TJOA ◽  
ANAND MOHAN ◽  
RONNY VELJANOVSKI ◽  
ANDREW BERRY ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Future Research ◽  
Pulse Shaper ◽  
X Ray ◽  
Application Specific Integrated Circuit ◽  
A Charge ◽  
Czt Detectors ◽  
Cmos Analog Integrated Circuit ◽  
Application Specific

A front-end read-out application specific integrated circuit (ASIC) for a multichannel pixel X-Ray detector system has been fabricated and tested. The chip provides signal amplification for pixelated compound semiconductors such as Cadmium Telluride ( CdTe ) and Cadmium Zinc Telluride ( CZT ) with either 1 mm or 200 μm pitch. Both the detector (compound semiconductor) and ASIC are combined to target future research applicable to spectroscopic imaging in high intensity X-Ray biomedical detector systems. The ASIC was fabricated in a 0.35 μm process by Austria Microsystems and consists of 32 channels, where each channel contains a charge-sensitive amplifier, a pulse shaper and two further stages of amplification providing an overall gain of 1 mV per kilo electron volt (keV) for photons within the energy range of 30–120 keV. The preamplifier and shaper circuits are designed for both positive and negative charge collection (electrons and holes) produced by the CdTe or CZT detectors. The ASIC's shaper has been designed with a time constant of 100 ns to allow operation at photon rate events above 1 Million photons per pixel per second. The design and characterization of the readout chip will be discussed in this paper presenting results from both the simulated and the fabricated chip.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

scholarly journals Simultaneous Voltage and Current Measurement Instrumentation Amplifier for ECG and PPG Monitoring

Electronics ◽  
2021 ◽  
Vol 10 (6) ◽  
pp. 679
Author(s):  
Jongpal Kim
Keyword(s):  
Integrated Circuit ◽  
Cardiovascular Health ◽  
Current Noise ◽  
Instrumentation Amplifier ◽  
Current Sensing ◽  
Application Specific Integrated Circuit ◽  
Time Division ◽  
Electrocardiogram Ecg ◽  
First Time ◽  
Application Specific

An instrumentation amplifier (IA) capable of sensing both voltage and current at the same time has been introduced and applied to electrocardiogram (ECG) and photoplethysmogram (PPG) measurements for cardiovascular health monitoring applications. The proposed IA can switch between the voltage and current sensing configurations in a time–division manner faster than the ECG and PPG bandwidths. The application-specific integrated circuit (ASIC) of the proposed circuit design was implemented using 180 nm CMOS fabrication technology. Input-referred voltage noise and current noise were measured as 3.9 µVrms and 172 pArms, respectively, and power consumption was measured as 34.9 µA. In the current sensing configuration, a current noise reduction technique is applied, which was confirmed to be a 25 times improvement over the previous version. Using a single IA, ECG and PPG can be monitored in the form of separated ECG and PPG signals. In addition, for the first time, a merged ECG/PPG signal is acquired, which has features of both ECG and PPG peaks.

CONCEPTS OF ELECTRONICALLY-CONTROLLED ELECTROMECHANICAL/MECHANOELECTRICAL STEER-, AUTODRIVE- AND AUTOABSORBABLE WHEELS FOR ENVIRONMENTALLY-FRIENDLY TRI-MODE SUPERCARS

1994 ◽  
Vol 04 (04) ◽  
pp. 501-516 ◽  
Author(s):  
BOGDAN T. FIJALKOWSKI ◽  
JAN W. KROSNICKI
Keyword(s):  
Direct Current ◽  
Integrated Circuit ◽  
Environmentally Friendly ◽  
Alternating Current ◽  
Switching Frequency ◽  
Neuro Fuzzy ◽  
Interior Permanent Magnet ◽  
Application Specific Integrated Circuit ◽  
Computer Processor ◽  
Application Specific

Concepts of the electronically-controlled electromechanical/mechanoelectrical Steer-, Autodrive- and Autoabsorbable Wheels (SA2W) with their brushless Alternating Current-to-Alternating Current (AC-AC), Alternating Current-to-Direct Current-Alternating Current (AC-DC-AC) and/or Direct Current-to-Alternating Current (DC-AC)/Alternating Current-to-Direct Current (AC-DC) macroelectronic converter commutator (macro-commutator) wheel-hub motors/generators with the Application Specific Integrated Matrixer (ASIM) macroelectronic converter commutators (ASIM macrocommutators) and Application Specific Integrated Circuit (ASIC) microelectronic Neuro-Fuzzy (NF) computer (processor) controllers (ASIC NF microcontrollers) for environmentally-friendly tri-mode supercars (advanced ultralight hybrids) have been conceived by the first author and designed by both authors with the Cracow University of Technology’s Automotive Mechatronics Research and Development (R&D) Team. These electromechanical/mechanoelectrical wheel-hub motors/generators, respectively, for instance, can be composed of the outer rotor with the Interior Permanent Magnet (IPM) poles and the inner stator that has the three-phase armature winding. The macroelectronic converter commutator establishes the AC-AC cycloconverter, AC-DC rectifier-DC-AC inverter and/or DC-AC inverter/AC-DC rectifier ASIM macrocommutator. The microelectronic NF computer (processor) controller establishes the ASIC microcomputer-based NF microcontroller. By adopting continuous semiconductor bipolar electrical valves in the high-power ASIM, it has been able to increase the commutation (switching) frequency and reduce harmonic losses of the electromechanical/mechanoelectrical wheel-hub motors/generators, respectively.

scholarly journals Design of ASIC Square Calculator Using AncientVedic Mathematics

2018 ◽  
Vol 7 (2.23) ◽  
pp. 464
Author(s):  
Angshuman Khan ◽  
Sudip Halder ◽  
Shubhajit Pal
Keyword(s):  
Integrated Circuit ◽  
Software Tool ◽  
Logic Gates ◽  
Digital Logic ◽  
Simple Design ◽  
Innovative Design ◽  
Circuit Asic ◽  
Vedic Mathematics ◽  
Application Specific Integrated Circuit ◽  
Application Specific

This article includes a simple design of Vedic square calculator for Application Specific Integrated Circuit (ASIC). This is a straightforward and innovative design of Vedic calculator using only few basic digital logic gates. Among the all sutras and sub sutras of ancient Vedic mathematics, the sutra ‘Urdhva Tiryagbyham’ is used here for square calculation of two bits numbers which results in an effortless and faster method of square calculation than all the existing methods. The design and minimization of the circuit has been carried out to achieve a standard architecture that is the simplest too. Here Xilinx ISE software tool is used rigorously to simulate the architecture.  

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