Thermooxidative Aging Studies on Silicone Rubber and Lifetime Prediction

2013 ◽  
Vol 777 ◽  
pp. 11-14
Author(s):  
You Shan Wang ◽  
Sha Sha Jiang ◽  
Yu Peng Liu

Silicone rubber have been aged in air while under 25% compression at temperature up to 250°C. These studies examined the compression set of silicone rubber at accelerated (elevated) temperatures and were then used to make predictions about compression set at room temperature. The data obtained could be amenable to timetemperature superposition and Arrhenius treatment. The results suggest the presence of two degradation processes with activation energies of 71.6 kJ mol-1 (for temperatures above 165 °C) and 26.08 kJ mol-1 (for temperatures below 165 °C). Based on the extrapolation of the non-Arrhenius behavior, it was estimated that significant compression set loss would occur after around 67 years at 25 °C.

1973 ◽  
Vol 46 (1) ◽  
pp. 305-330 ◽  
Author(s):  
H-J. Jahn ◽  
H-H. Bertram

Abstract The compression set (C.S.) of a vulcanizate depends on the formulation, processing, and conditions of cure. The following factors are the most important: (a) the type of elastomer, (b) the curing system, (c) the type and amount of filler, (d) the type and amount of plasticizer, (e) the type and amount of antioxidant, (f) the type of cure (press, steam, or hot air), and (g) the cure time and temperature. The present paper is intended, as far as possible, to describe these relationships quantitatively. Most tests will refer to nitrile rubber. We have modified the C.S. method described in ASTM D-395. The deviations are as follows : (1) When C.S. is plotted as a function of the duration of compression, the resulting curves rise steeply for roughly the first seven days, afterwards becoming flatter. The higher the test temperature, the steeper the curve. The ordinary compression times of 22 and 70 h still correspond to the steep part of the C.S. curve; here relatively small inaccuracies in the compression time and test temperature bring large errors in the C.S. readings. Therefore, to improve the correlation between C.S. readings and field behavior the test was extended to seven days in most cases. Longer test times would have been experimentally impractical. (2) As a rule, only C.S. figures relating to 20°, 70°, and 100° C are found in the literature, so test temperatures were extended to include practical conditions. Generally, therefore, C.S. readings were taken at twelve different temperatures ranging from −60° C to +160° C. (3) According to the standards the test pieces should be cooled to room temperature after removal of the load and before the recovery measurement is carried out. Only ASTM D-1229-62 requires the remeasurement to be taken at the load temperature. This ensures accurate measurements of the C.S. at low temperatures. In our tests this was done in every case because at high temperature the C.S. readings are lower since (1) many elastomers recover better at elevated temperatures than at room temperature and (2) the thermal expansion of the test piece can be measured in addition to the recovery. Nevertheless, the differences between remeasurements taken at room temperature and the test temperature are small if the test temperature is fairly high. Where lower test temperatures are used, the remeasurement should always be taken at test temperature if useful results are to be obtained. In all the tests the time allowed for recovery between removal of the load and the remeasurement was thirty min.


Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.


Author(s):  
G. M. Michal ◽  
T. K. Glasgow ◽  
T. J. Moore

Large additions of B to Fe-Ni alloys can lead to the formation of an amorphous structure, if the alloy is rapidly cooled from the liquid state to room temperature. Isothermal aging of such structures at elevated temperatures causes crystallization to occur. Commonly such crystallization pro ceeds by the nucleation and growth of spherulites which are spherical crystalline bodies of radiating crystal fibers. Spherulite features were found in the present study in a rapidly solidified alloy that was fully crysstalline as-cast. This alloy was part of a program to develop an austenitic steel for elevated temperature applications by strengthening it with TiB2. The alloy contained a relatively large percentage of B, not to induce an amorphous structure, but only as a consequence of trying to obtain a large volume fracture of TiB2 in the completely processed alloy. The observation of spherulitic features in this alloy is described herein. Utilization of the large range of useful magnifications obtainable in a modern TEM, when a suitably thinned foil is available, was a key element in this analysis.


Alloy Digest ◽  
1981 ◽  
Vol 30 (6) ◽  

Abstract FANSTEEL 85 METAL is a columbium-base alloy characterized by good fabricability at room temperature, good weldability and a good combination of creep strength and oxidation resistance at elevated temperatures. Its applications include missile and rocket components and many other high-temperature parts. This datasheet provides information on composition, physical properties, microstructure, hardness, elasticity, tensile properties, and bend strength as well as creep. It also includes information on low and high temperature performance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cb-7. Producer or source: Fansteel Metallurgical Corporation. Originally published December 1963, revised June 1981.


Author(s):  
Alexey V. Kavokin ◽  
Jeremy J. Baumberg ◽  
Guillaume Malpuech ◽  
Fabrice P. Laussy

In this Chapter we address the physics of Bose-Einstein condensation and its implications to a driven-dissipative system such as the polariton laser. We discuss the dynamics of exciton-polaritons non-resonantly pumped within a microcavity in the strong coupling regime. It is shown how the stimulated scattering of exciton-polaritons leads to formation of bosonic condensates that may be stable at elevated temperatures, including room temperature.


Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1550
Author(s):  
Vineet Kumar ◽  
Anuj Kumar ◽  
Minseok Song ◽  
Dong-Joo Lee ◽  
Sung-Soo Han ◽  
...  

The increasing demand for polymer composites with novel or improved properties requires novel fillers. To meet the challenges posed, nanofillers such as graphene, carbon nanotubes, and titanium dioxide (TiO2) have been used. In the present work, few-layer graphene (FLG) and iron oxide (Fe3O4) or TiO2 were used as fillers in a room-temperature-vulcanized (RTV) silicone rubber (SR) matrix. Composites were prepared by mixing RTV-SR with nanofillers and then kept for vulcanization at room temperature for 24 h. The RTV-SR composites obtained were characterized with respect to their mechanical, actuation, and magnetic properties. Fourier-transform infrared spectroscopy (FTIR) analysis was performed to investigate the composite raw materials and finished composites, and X-ray photoelectron spectroscopy (XPS) analysis was used to study composite surface elemental compositions. Results showed that mechanical properties were improved by adding fillers, and actuation displacements were dependent on the type of nanofiller used and the applied voltage. Magnetic stress-relaxation also increased with filler amount and stress-relaxation rates decreased when a magnetic field was applied parallel to the deformation axes. Thus, this study showed that the inclusion of iron oxide (Fe3O4) or TiO2 fillers in RTV-SR improves mechanical, actuation, and magnetic properties.


2021 ◽  
pp. 009524432110203
Author(s):  
Sudhir Bafna

It is often necessary to assess the effect of aging at room temperature over years/decades for hardware containing elastomeric components such as oring seals or shock isolators. In order to determine this effect, accelerated oven aging at elevated temperatures is pursued. When doing so, it is vital that the degradation mechanism still be representative of that prevalent at room temperature. This places an upper limit on the elevated oven temperature, which in turn, increases the dwell time in the oven. As a result, the oven dwell time can run into months, if not years, something that is not realistically feasible due to resource/schedule constraints in industry. Measuring activation energy (Ea) of elastomer aging by test methods such as tensile strength or elongation, compression set, modulus, oxygen consumption, etc. is expensive and time consuming. Use of kinetics of weight loss by ThermoGravimetric Analysis (TGA) using the Ozawa/Flynn/Wall method per ASTM E1641 is an attractive option (especially due to the availability of commercial instrumentation with software to make the required measurements and calculations) and is widely used. There is no fundamental scientific reason why the kinetics of weight loss at elevated temperatures should correlate to the kinetics of loss of mechanical properties over years/decades at room temperature. Ea obtained by high temperature weight loss is almost always significantly higher than that obtained by measurements of mechanical properties or oxygen consumption over extended periods at much lower temperatures. In this paper, data on five different elastomer types (butyl, nitrile, EPDM, polychloroprene and fluorocarbon) are presented to prove that point. Thus, use of Ea determined by weight loss by TGA tends to give unrealistically high values, which in turn, will lead to incorrectly high predictions of storage life at room temperature.


2011 ◽  
Vol 261-263 ◽  
pp. 416-420 ◽  
Author(s):  
Fu Ping Jia ◽  
Heng Lin Lv ◽  
Yi Bing Sun ◽  
Bu Yu Cao ◽  
Shi Ning Ding

This paper presents the results of elevated temperatures on the compressive of high fly ash content concrete (HFCC). The specimens were prepared with three different replacements of cement by fly ash 30%, 40% and 50% by mass and the residual compressive strength was tested after exposure to elevated temperature 250, 450, 550 and 650°C and room temperature respectively. The results showed that the compressive strength apparently decreased with the elevated temperature increased. The presence of fly ash was effective for improvement of the relative strength, which was the ratio of residual compressive strength after exposure to elevated temperature and ordinary concrete. The relative compressive strength of fly ash concrete was higher than those of ordinary concrete. Based on the experiments results, the alternating simulation formula to determine the relationship among relative strength, elevated temperature and fly ash replacement is developed by using regression of results, which provides the theoretical basis for the evaluation and repair of HFCC after elevated temperature.


2006 ◽  
Vol 527-529 ◽  
pp. 1261-1264 ◽  
Author(s):  
Sei Hyung Ryu ◽  
Sumi Krishnaswami ◽  
Brett A. Hull ◽  
Bradley Heath ◽  
Mrinal K. Das ◽  
...  

8 mΩ-cm2, 1.8 kV power DMOSFETs in 4H-SiC are presented in this paper. A 0.5 μm long MOS gate length was used to minimize the MOS channel resistance. The DMOSFETs were able to block 1.8 kV with the gate shorted to the source. At room temperature, a specific onresistance of 8 mΩ-cm2 was measured with a gate bias of 15 V. At 150 oC, the specific onresistance increased to 9.6 mΩ-cm2. The increase in drift layer resistance due to a decrease in bulk electron mobility was partly cancelled out by the negative shift in MOS threshold voltage at elevated temperatures. The device demonstrated extremely fast, low loss switching characteristics. A significant improvement in converter efficiency was observed when the 4H-SiC DMOSFET was used instead of an 800 V silicon superjunction MOSFET in a simple boost converter configuration.


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