Effect of Interlayer Thickness on Strength and Fracture of Si3N4 and Inconel600 Joint

2005 ◽  
Vol 297-300 ◽  
pp. 2435-2440 ◽  
Author(s):  
Min Yang ◽  
Zeng Da Zou ◽  
Si Li Song ◽  
Xin Hong Wang
Keyword(s):  
Shear Strength ◽  
Shear Test ◽  
Bonding Temperature ◽  
Fracture Morphology ◽  
Interlayer Thickness ◽  
Bonding Pressure ◽  
Fracture Behaviors ◽  
Ni Interlayer ◽  
Bonding Method ◽  
Cooling Velocity

In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum condition. The bonding temperature, bonding time, bonding pressure and cooling velocity was 1403K, 50min, 7.5MPa and 5K/min, respectively. The effects of interlayer thickness on the strength and fracture behaviors of joint were investigated through evaluating the strength of joints based on shear test and observing the fracture morphology by means of SEM. The results showed that the shear strength of joint changed with variation of the interlayer thickness. When the shear strength of joint increased, the location of fracture was changed from the ceramic/interlay interface to the reaction layer.

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

2005 ◽  
Author(s):  
X. F. Ang ◽  
G. G. Zhang ◽  
J. Wei ◽  
Z. Chen ◽  
C. C. Wong
Keyword(s):  
Shear Strength ◽  
Critical Temperature ◽  
Pressure Dependence ◽  
Bonding Temperature ◽  
Interfacial Stress ◽  
3D Integration ◽  
Bonding Pressure ◽  
Barrier Films ◽  
Linear Rise ◽  
Temperature And Pressure

Low temperature interconnection is a critical component of 3D integration and packaging technology. In this study, we investigate the characteristics of thermocompression metal bonding using gold stud bumps formed on Si die in the temperature range of 100-300 °C and the pressure range of 200–600 g/bump. We observed a critical bonding temperature below which bonding did not occur and above which shear strength improves linearly with bonding temperature. This critical temperature can be interpreted to be the onset of the break-up of organic barrier films while the linear rise in shear strength can be attributed to the increase in the true bonded area. Above this critical temperature, the tensile strength of the Au-Au bond exhibits a maximum with increasing bonding pressure. This can be related to the pressure dependence of the interfacial stress distribution and its effect on unbonded radius, r. SEM fractographs of the failed surfaces suggest a combination of cohesive and adhesive failures along the bonded interface.

scholarly journals Effect of Brazing Parameters on the Microstructure and Properties of SiC Ceramic Joint with Zr-Cu Filler Metal

Crystals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 93
Author(s):  
Bofang Zhou ◽  
Jinfeng Wang ◽  
Keqin Feng ◽  
Yuchen Cai ◽  
Sitan Chen
Keyword(s):  
Shear Strength ◽  
Reaction Layer ◽  
Shear Test ◽  
Filler Metal ◽  
Interface Reaction ◽  
Fracture Morphology ◽  
Holding Time ◽  
Sic Ceramic ◽  
Maximum Shear Strength ◽  
Joint Reaction

The microstructure and mechanical properties of brazing SiC ceramic with Zr-Cu filler metal under different brazing parameters (brazing temperature, holding time) were investigated. The phase of the joint reaction interface between Zr-Cu filler metal and SiC ceramic was characterized by XRD, the microstructure and fracture morphology of the brazing SiC ceramic joint were analyzed by SEM with EDS, and the strength of the joint was evaluated by compression shear test. The results show that the brazing join between SiC ceramic and Zr-Cu filler metal can be realized at the brazing temperature of 1100 °C~1300 °C, and the main products of interface reaction are ZrC and Zr2Si. The shear strength of the joint increases with the brazing temperature, and reaches the highest at 1200 °C. The thickness of interface reaction layer increases with the increase of holding time at brazing temperature of 1200 °C. Thickness of the interface reaction layer is 2.9 μm when the joint is holding for 20 min, and the maximum shear strength of the corresponding brazed SiC ceramic joint is 57 MPa.

Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method

2005 ◽  
Vol 502 ◽  
pp. 443-448
Author(s):  
Yasushi Fukuzawa ◽  
Shigeru Nagasawa ◽  
Masahiro Watanabe ◽  
Shigehiko Takaoka
Keyword(s):  
Heat Treatment ◽  
Electric Current ◽  
Bonding Temperature ◽  
Bonding Pressure ◽  
Pulse Electric Current ◽  
Layer 2 ◽  
Bonding Method ◽  
Pulse Electric ◽  
Sintering Method ◽  
Plating Layer

To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.

Mechanical and microstructure property evaluation of diffusion bonding of 5083, 6061 and 7075 aluminium to AZ31 magnesium using Cu interlayer

2021 ◽  
pp. 095440542110144
Author(s):  
Nader Nadermanesh ◽  
Abdolhamid Azizi ◽  
Sahebali Manafi
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Diffusion Bonding ◽  
Bonding Temperature ◽  
Effect Of Temperature ◽  
Process Conditions ◽  
Micro Hardness ◽  
Bonding Pressure ◽  
Electron Microscopes ◽  
Cu Interlayer

The diffusion bonding of 7075, 6061 and 5083 aluminium alloys to AZ31B magnesium was investigated using copper interlayer. An optical microscope along with scanning electron microscopes, equipped with an energy dispersive spectrometry/electron probe microanalysis, was utilized to characterize the microstructure of the joint. The mechanical properties of the joint were also assessed by micro-hardness and shear strength tests. The results indicate the high effect of temperature on the bonding results; so that, with a small change in temperature, severe changes were observed in the bonding results. A temperature range of 475°C–485°C and a minimum duration of 30 min with a low bonding pressure of 0.4 MPa were identified as advisable process conditions. The joint evaluation revealed the formation of CuAl2, Cu9Al4 and Al-Mg-Cu ternary phases on the aluminium-copper side, as well as Cu2Mg, CuMg2 and Al-Mg-Cu ternary phases on the magnesium-copper side in the reaction layer. When increasing the bonding temperature and duration, the amount of intermetallic compounds and, as a result, the mechanical properties of the joints changed. The highest shear strength and micro-hardness, related to the bonding performed at 480°C and holding time of 45 min, were 31.03 MPa and 167 HV, respectively.

Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu–Cu disks for power device packaging

2021 ◽  
Author(s):  
Byungho Park ◽  
Duy le Han ◽  
Mikkiko Saito ◽  
Jun Mizuno ◽  
Hiroshi Nishikawa
Keyword(s):  
Electron Microscopy ◽  
Shear Strength ◽  
Solid State ◽  
Formic Acid ◽  
Bonding Temperature ◽  
X Ray Diffraction ◽  
Promising Alternative ◽  
Transmission Electron ◽  
Cu Bonding ◽  
Bonding Method

Abstract Nanoparticle sintering is considered a promising alternative bonding method to Pb- based soldering for the attachment of components in high-temperature electronic devices. However, the technology still poses certain challenges, such as difficulty controlling joint thickness and the generation of voids owing to solvent evaporation. In this study, a solid-state (solvent-free), nanoporous-Cu (NPC) bonding method was examined. The effect of bonding temperatures (200–400°C) and atmospheres (N2 or formic acid) on the shear strength of joints formed between NPC sheets and bare Cu disks were investigated by scanning electron microscopy, X-ray diffraction, and transmission electron microscopy. It was shown that the bondability of NPC under an N2 atmosphere is closely related to the oxide layer formed on its surface that impairs the diffusion of Cu atoms between the NPC and Cu substrate. Furthermore, the coarsening of the NPC microstructure under a formic acid atmosphere at ≥ 350°C owing to the rapid diffusion of Cu atoms and accompanying plastic deformation induced by surface stress enhances the shear strength of the resulting NPC/Cu joint. The shear strength of NPC/Cu joints formed under a formic acid atmosphere increased from 14.1 to 35.9 MPa with increasing bonding temperature. Based on the results of the investigation, a mechanism was proposed to explain the superiority of the Cu–Cu joints achieved using this method.

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

2011 ◽  
Vol 133 (4) ◽  
Author(s):  
Chu-Hsuan Sha ◽  
Pin J. Wang ◽  
Wen P. Lin ◽  
Chin C. Lee
Keyword(s):  
Shear Strength ◽  
Solid State ◽  
Shear Test ◽  
Static Pressure ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Sem Images ◽  
Solid State Bonding ◽  
Reflow Temperature ◽  
Atomic Distance

Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible with the peak reflow temperature of lead-free (Pb-free) solders used in electronic industries. The Ag foil is quite soft and ductile. It can deform to mate with the Au surface on alumina. Thus, only 1000 psi of static pressure is needed to bring Ag atoms and Au atoms within atomic distance on the interface. Ag has superior physical properties. It has the highest electrical and thermal conductivities among the metals. Scanning electron microscope (SEM) images show that the Ag foil is well bonded to the Au layer on alumina. A standard shear test is performed to determine the shear strength of the bonding. The shear strength of five samples tested far exceeds the strength requirement of MIL-STD-883 G standard.

scholarly journals Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

2021 ◽  
Vol 8 ◽  
Author(s):  
Bang Jiang ◽  
Qiaoxin Zhang ◽  
Lin Shi ◽  
Chundong Zhu ◽  
Zhiwen Chen ◽  
...  
Keyword(s):  
Phase Transition ◽  
Shear Strength ◽  
Liquid Phase ◽  
Solder Joints ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Holding Time ◽  
Bonding Pressure ◽  
Transient Liquid Phase Sintering

Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3.

scholarly journals Influence of Structural Plane Microscopic Parameters on Direct Shear Strength

2018 ◽  
Vol 2018 ◽  
pp. 1-7 ◽  
Author(s):  
Yanhui Cheng ◽  
Weijun Yang ◽  
Dongliang He
Keyword(s):  
Particle Size ◽  
Shear Strength ◽  
Internal Friction ◽  
Direct Shear Test ◽  
Shear Test ◽  
Friction Angle ◽  
Internal Friction Angle ◽  
Direct Shear ◽  
Stiffness Ratio ◽  
Structural Plane

Structural plane is a key factor in controlling the stability of rock mass engineering. To study the influence of structural plane microscopic parameters on direct shear strength, this paper established the direct shear mechanical model of the structural plane by using the discrete element code PFC2D. From the mesoscopic perspective, the research on the direct shear test for structural plane has been conducted. The bonding strength and friction coefficient of the structural plane are investigated, and the effect of mesoscopic parameters on the shear mechanical behavior of the structural plane has been analyzed. The results show that the internal friction angle φ of the structural plane decreases with the increase of particle contact stiffness ratio. However, the change range of cohesion is small. The internal friction angle decreases first and then increases with the increase of parallel bond stiffness ratio. The influence of particle contact modulus EC on cohesion c is relatively small. The internal friction angle obtained by the direct shear test is larger than that obtained by the triaxial compression test. Parallel bond elastic modulus has a stronger impact on friction angle φ than that on cohesion c. Under the same normal stress conditions, the shear strength of the specimens increases with particle size. The shear strength of the specimen gradually decreases with the increase of the particle size ratio.

Soil Shear Strength Characteristic in Slope Disintegration Area

2013 ◽  
Vol 353-356 ◽  
pp. 735-739
Author(s):  
Xiao Ming Zhang ◽  
Shu Wen Ding ◽  
Shuang Xi Li
Keyword(s):  
Shear Strength ◽  
Direct Shear Test ◽  
Shear Test ◽  
Clay Content ◽  
Scientific Basis ◽  
Soil Mechanic ◽  
Direct Shear ◽  
Soil Cohesion ◽  
Soil Shear Strength ◽  
The Relationship

Development of slope disintegration is close to soil mechanic characteristics such as shear strength indices. Soil grain diameter and water content were tested. Soil direct shear test was conducted to analyze the relationship between shear strength indices and the influencing factors. The experimental data indicate that clay content and the range affect soil cohesion value and the scope. Soil cohesion increases with bulk density before 1.6g/cm3. But it decreases when the bulk after that. The results could provide a scientific basis for control of slope disintegration.

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