Evolution of TiN Coating Surface Roughness during Physical Vapor Deposition on High Speed Steel Substrate

2014 ◽  
Vol 604 ◽  
pp. 67-70
Author(s):  
Leonid Kupchenko ◽  
Rauno Tali ◽  
Eron Adoberg ◽  
Valdek Mikli ◽  
Vitali Podgursky
Keyword(s):  
Surface Roughness ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
Steel Substrate ◽  
High Speed Steel ◽  
Growth Exponent ◽  
Force Microscopy ◽  
Tin Coatings ◽  
Atomic Force

TiN coatings with different thickness were prepared by arc ion plating (AIP) physical vapor deposition (PVD) on high speed steel (HSS) substrates. TiN coatings surface roughness was investigated by atomic force microscopy (AFM) and 3D optical profilometry and growth kinetics was described using scaling exponents β and α. The growth exponent β is 0.91-1.0 and the roughness exponent α is 0.77-0.81. Due to relatively high value of the exponent α, the surface diffusion is likely predominant smoothening mechanism of TiN growth.

MACRODROPLET REDUCTION AND GROWTH MECHANISMS IN CATHODIC ARC PHYSICAL VAPOR DEPOSITION OF TiN FILMS

2008 ◽  
Vol 15 (05) ◽  
pp. 653-659 ◽  
Author(s):  
MUBARAK ALI ◽  
ESAH HAMZAH ◽  
TAHIR ABBAS ◽  
MOHD RADZI HJ. MOHD TOFF ◽  
ISHTIAQ A. QAZI
Keyword(s):  
Vapor Deposition ◽  
Metal Ion ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
Gas Flow ◽  
High Speed Steel ◽  
Hard Coatings ◽  
Growth Mechanisms ◽  
Tin Coatings ◽  
Cathodic Arc

Cathodic arc physical vapor deposition (CAPVD) a technique used for the deposition of hard coatings for tooling applications has many advantages. The main drawback of this technique is the formation of macrodroplets (MDs) during deposition resulting in films with rougher morphology. The MDs contamination and growth mechanisms was investigated in TiN coatings over high-speed steel, as a function of metal ion etching, substrate bias, and nitrogen gas flow rate; it was observed that the latter is the most important factor in controlling the size and number of the macrodroplets.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

scholarly journals Threading Performance of Different Coatings for High Speed Steel Tapping

Coatings ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 464
Author(s):  
Alain Gil Del Val ◽  
Fernando Veiga ◽  
Octavio Pereira ◽  
Luis Norberto Lopez De Lacalle
Keyword(s):  
Tool Life ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
Cutting Speed ◽  
High Speed Steel ◽  
Tialn Coating ◽  
Tool Performance ◽  
Thread Profile ◽  
Increase Tool Life

Threading holes using tapping tools is a widely used machining operation in the industry. This manufacturing process involves a great tool immersion in the part, which involves both friction and cutting. This makes the use of coatings critical to improving tool life. Four coatings are used based on Physical vapor deposition (PVD) technology—TiN, TiCN, TiAlN and TiAlN+WC/C are compared to uncoated tool performance. The effect of various coatings on the life of M12 × 1.5 tapping tools during threading of through holes 20 mm deep, in GG25 casting plates, dry and applying cutting speed of 50 m/min. The end-of-life criterion has been established based on a cutting torque of 16 N-m. Taking the uncoated tap as a basis for comparison, it is observed that coatings based on PVD technologies increase tool life doubling in the most advantageous case with the TiAlN coating. PVD type coatings provide better protection to wear at cylindrical area of the tool, where the thread profile is finished, than uncoated taps. The teeth located in the cone-cylinder transition zone of the taps suffer the most wear regardless of the coating. However, taps coated with TiAlN+WC/C wear level values is lowest of all the coatings tested, which indicates a strong reinforcement in these teeth.

The Effect of Deposition Parameters on the Structural and Mechanical Properties of BN Coatings Deposited onto High-Speed Steel by the PLD Method

2015 ◽  
Vol 220-221 ◽  
pp. 737-742
Author(s):  
Krzysztof Gocman ◽  
Tadeusz Kałdoński ◽  
Waldemar Mróz ◽  
Bogusław Budner
Keyword(s):  
Mechanical Properties ◽  
High Speed ◽  
High Speed Steel ◽  
Rf Discharge ◽  
Internal Stresses ◽  
Force Microscopy ◽  
Gas Nitriding ◽  
Atomic Force ◽  
Deposition Parameters ◽  
Steel Substrates

Boron nitride coatings have been deposited onto high-speed steel substrates using pulsed laser deposition technique combined with RF-discharge. In order to improve adhesion and reduce internal stresses, substrates were subjected to gas nitriding. The structure and morphology of coatings were investigated applying atomic force microscopy (AFM) and FTIR spectroscopy. Nanohardness and elastic modulus were examined employing a nanoanalyzer (CETR). On the basis of the conducted experiments, stable, crystalline, multiphase coatings have been obtained. It has been proved that morphology, structure and mechanical properties strongly depend on the parameters of the PLD process; in particular, the temperature of the substrate has a crucial influence on the properties of BN coatings.

scholarly journals Investigation on the corrosion behavior of physical vapor deposition coated high speed steel

2015 ◽  
Vol 7 (8) ◽  
pp. 168781401559952 ◽  
Author(s):  
R Ravi Raja Malarvannan ◽  
TV Moorthy ◽  
S Sathish ◽  
P Hariharan
Keyword(s):  
Corrosion Behavior ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
High Speed Steel

A Characterization of New Cleaning Method Using Electrolytic Ionized Water for Poly Si Cmp Process

2001 ◽  
Vol 671 ◽  
Author(s):  
N. Miyashita ◽  
Shin-ichiro Uekusa ◽  
S. Seta ◽  
T. Nishioka
Keyword(s):  
Surface Roughness ◽  
High Speed ◽  
Crystal Defects ◽  
Wafer Surface ◽  
Cleaning Process ◽  
Force Microscopy ◽  
Cleaning Method ◽  
Atomic Force ◽  
Chemical Impurities ◽  
Large Numbers

ABSTRACTA Trench isolation technology has been developed and applied to high-speed bipolar LSI production. In general, the wafer surface after a conventional ploy-Si Chemical-Mechanical-Polishing (CMP) is contaminated with silica particles and chemical impurities. These contaminations produce some unexpected patterns and crystal defects in the wafer surface layer after oxidation. It is difficult to remove them by the conventional cleaning techniques. Therefore, we have established the new post CMP cleaning method, using the electrolytic ionized water containing chemical additive of a small quantity. The anode water has the cleaning effect for the metallic and organic contaminations, and the cathode water has the removing effect for the particles and the etching effect for the poly-Si surface. For this new cleaning process, it is important to avoid the chemical mechanical damages on the surface and to control the surface roughness. Our experimental work has been focused on the large numbers of the remaining particle and the surface roughness using a particle counter and an atomic force microscopy (AFM). We herein report the properties of the electrolytic ionized water and the examined results of poly-Si surface after CMP process. It was found that the electrolytic ionized water is effective for surface control, and the new cleaning process is useful for CMP process.

Oxidation behavior of TiN with a Ti interlayer on stainless steel

2004 ◽  
Vol 819 ◽  
Author(s):  
Ming-Hua Shiao ◽  
Ching-Chiun Wang ◽  
Chien-Ying Su ◽  
Fuh-Sheng Shieu
Keyword(s):  
Stainless Steel ◽  
Steel Substrate ◽  
Depth Profiling ◽  
Columnar Structure ◽  
304 Stainless Steel ◽  
Force Microscopy ◽  
Tin Coatings ◽  
Atomic Force ◽  
Transmission Electron ◽  
Tin Thin Films

AbstractCharacterization of the TiN coatings oxidized in air at temperatures at 600 and 700°C for 30 min was carried out by X-ray diffraction (XRD), atomic force microscopy (AFM), transmission electron microscopy (TEM) and Auger electron spectroscopy (AES). TiN thin films with a Ti interlayer were prepared by hollow cathode discharge ion plating on AISI 304 stainless steel. Both XRD and TEM results show that the TiN coatings and Ti interlayer have columnar structure with (111) and (0002) preferred orientations, respectively. AFM results show the existence of pinholes on the surface of specimens due to electropolishing process of the steel substrate, and the surface roughness (Ra) changes from 3.5 nm for the as-deposited specimen to 11.6 nm after oxidation at 700°. After oxidation, the TiO2 oxide layer formed on the specimen surface was porous and retained the columnar structure as the original TiN coating. The microstructure of the Ti interlayer gradually changed from columnar to polycrystalline structure due to grain growth. The Auger elemental depth profiling indicated that interdiffusion of the Ti interlayer with steel substrate had occurred during the oxidation process.

ADHESION STRENGTH OF TiN COATINGS AT VARIOUS ION ETCHING DEPOSITED ON TOOL STEELS USING CATHODIC ARC PVD TECHNIQUE

2009 ◽  
Vol 16 (01) ◽  
pp. 29-35 ◽  
Author(s):  
MUBARAK ALI ◽  
ESAH HAMZAH ◽  
NOUMAN ALI
Keyword(s):  
Adhesion Strength ◽  
Tool Steel ◽  
Physical Vapor Deposition ◽  
High Speed ◽  
High Speed Steel ◽  
Scratch Test ◽  
Tool Steels ◽  
Ion Etching ◽  
Tin Coatings ◽  
Physical Vapor Deposition Method

Titanium nitride ( TiN ) widely used as hard coating material was coated on tool steels, namely on high-speed steel (HSS) and D2 tool steel by physical vapor deposition method. The goal of this study was to examine the effect of ion etching with and without titanium ( Ti ) and chromium ( Cr ) on the adhesion strength of TiN coatings deposited on tool steels. From the scratch tester, it was observed that by increasing Ti ion etching showed an increase in adhesion strength of the deposited coatings. The coatings deposited with Cr ion etching showed poor adhesion compared with the coatings deposited with Ti ion etching. Scratch test measurements showed that the coating deposited with titanium ion etching for 16 min is the most stable coating and maintained even at the critical load of 66 N. The curve obtained via penetration depth along the scratch trace is linear in the case of HSS, whereas is slightly flexible in the case of D2 tool steel. The coatings deposited on HSS exhibit better adhesion compared with those on D2 tool steel.

Structural Evolution of Nanocrystalline Germanium Thin Films with Film Thickness and Substrate Temperature

2003 ◽  
Vol 762 ◽  
Author(s):  
William B. Jordan ◽  
Eric D. Carlson ◽  
Todd R. Johnson ◽  
Sigurd Wagner
Keyword(s):  
Thin Films ◽  
Surface Roughness ◽  
Grain Size ◽  
Film Thickness ◽  
Vapor Deposition ◽  
Deposition Temperature ◽  
Structural Evolution ◽  
Chemical Vapor ◽  
Force Microscopy ◽  
Atomic Force

AbstractThe structure of germanium thin films prepared on glass by plasma enhanced chemical vapor deposition was characterized by Raman spectroscopy, atomic force microscopy (AFM) and field emission scanning electron microscopy (SEM). Crystallinity, surface roughness, and grain size were measured as functions of film thickness and deposition temperature. Grain nucleation was apparent for films as thin as 10 nm. Over the thickness range studied, grain size increased with film thickness, whereas average surface roughness started to increase with film thickness, but then remained fairly constant at approximately 1 nm for a film thickness greater than 25 nm.

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