Nanohardness of DC Magnetron Sputtered W – C Coatings as a Function of Composition and Residual Stresses

2015 ◽  
Vol 662 ◽  
pp. 107-110 ◽  
Author(s):  
Michal Novák ◽  
František Lofaj ◽  
Petra Hviščová ◽  
Rudolf Podoba ◽  
Marián Haršáni ◽  
...  
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Magnetron Sputtering ◽  
Linear Increase ◽  
Indentation Modulus ◽  
Dc Magnetron Sputtering ◽  
Glass Substrates ◽  
Compressive Stresses ◽  
Deposition Parameters

The effects of residual stresses in thin W-C based coatings were investigated with the aim to find their influence on nanohardness and indentation modulus. Ten samples of W-C based coatings were deposited on microslide glass substrates using DC magnetron sputtering at the identical deposition parameters. Their thickness was in the range from 500 to 600 nm. The residual stresses in the coatings varied from 1.5 GPa up to 4.4 GPa. Increase of residual stress caused linear increase of HITfrom 16 to 19.5 GPa. This increase was only the result of the compressive stresses. EITof the studied coatings was not sensitive to residual stresses and corresponded to 185 GPa ± 15 GPa.

Influence of deposition parameters on the residual stresses of WC-Wo sputtered thin films

MRS Advances ◽  
2020 ◽  
Vol 5 (23-24) ◽  
pp. 1215-1223
Author(s):  
R.R. Phiri ◽  
O.P. Oladijo ◽  
E.T. Akinlabi
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Residual Stresses ◽  
Substrate Surface ◽  
Tribological Performance ◽  
X Ray Diffraction ◽  
X Ray ◽  
Compressive Stresses ◽  
Deposition Parameters ◽  
Cobalt Thin Films

AbstractControl and manipulation of residual stresses in thin films is a key for attaining coatings with high mechanical and tribological performance. It is therefore imperative to have reliable residual stress measurements methods to further understand the dynamics involved. The sin2ψ method of X-ray diffraction was used to investigate the residual stresses on the tungsten carbide cobalt thin films deposited on a mild steel surface to understand the how the deposition parameters influence the generation of residual stresses within the substrate surface. X-ray spectra of the surface revealed an amorphous phase of the thin film therefore the stress measured was of the substrate surface and the effects of sputtering parameters on residual stress were analysed. Compressive stresses were identified within all samples studied. The results reveal that as the sputtering parameters are varied, the residual stresses also change. Optimum deposition parameters in terms of residual stresses were suggested.

Effect of Stresses in Molybdenum Back Contact Film on Properties of CIGSS Absorber Layer

2005 ◽  
Vol 865 ◽  
Author(s):  
Ankur A. Kadam ◽  
Anant H. Jahagirdar ◽  
Neelkanth G. Dhere
Keyword(s):  
Magnetron Sputtering ◽  
Contact Layer ◽  
Absorber Layer ◽  
Back Contact ◽  
Dc Magnetron Sputtering ◽  
Glass Substrates ◽  
Deposition Parameters ◽  
Torr Pressure ◽  
Lower Sheet Resistance ◽  
Deposition Conditions

AbstractAnalysis of CuIn1-x Gax Se2-y Sy (CIGSS) absorber and molybdenum back contact layer was carried out to understand the changes in the microstructure of CIGSS layer as a function of the deposition conditions and the nature of stress in the underlying Mo film. All the depositions were carried out on 10 cm x 10 cm glass substrates. Compressive and tensile stressed molybdenum films were prepared with combinations of deposition parameters; power and pressure. CIGSS absorber layer was prepared by depositing metallic precursors using DC magnetron sputtering followed by selenization and sulfurization. Molybdenum layer deposited at 300 W and 3 x 10 Torr pressure produced compressive stress with compact, well adherent and lower sheet resistance as compared to the tensile stressed film deposited at 200 W and 5 x 10 Torr. The crystallinity of the CIGSS film was found not to depend on the stress in the underlying molybdenum film. However, the adhesion at the Mo/CIGSS as well as gallium profile at the Mo/CIGSS interface were affected by the stress.

AlSb THIN FILMS PREPARED BY DC MAGNETRON SPUTTERING AND ANNEALING

2008 ◽  
Vol 22 (14) ◽  
pp. 2275-2283 ◽  
Author(s):  
WEIDONG CHEN ◽  
LIANGHUAN FENG ◽  
ZHI LEI ◽  
JINGQUAN ZHANG ◽  
FEFE YAO ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
High Efficiency ◽  
Dark Conductivity ◽  
Aluminum Antimonide ◽  
Dc Magnetron Sputtering ◽  
Glass Substrates ◽  
Average Grain Size ◽  
P Type ◽  
20 Nm

Aluminum antimonide (AlSb) is thought to be a potential material for high efficiency solar cells. In this paper, AlSb thin films have been fabricated by DC magnetron sputtering on glass substrates. The sputtering target consists of aluminum and antimony, and the area ratio of Al to Sb is 7:3, which is derived from research into the relationship between the deposition rates of both the metals and sputtering power. XRD and AFM measurements show that the as-deposited films are amorphous, but become polycrystalline with an average grain size of about 20 nm after annealing in an argon atmosphere. From optical absorption measurements of annealed AlSb films, a band gap of 1.56 eV has been demonstrated. Hall measurements show that the films are p-type semiconductors. The temperature dependence of dark conductivity tested in vacuum displays a linear lnσ to 1/T curve, which indicates a conductivity activation energy of around 0.61 eV.

Laser Shock Processing of Titanium Alloy Blade and FEM Simulation

2013 ◽  
Vol 456 ◽  
pp. 125-128
Author(s):  
Bing Yan ◽  
Rui Wang
Keyword(s):  
Residual Stress ◽  
Titanium Alloy ◽  
Residual Stresses ◽  
Fem Simulation ◽  
Laser Shock ◽  
Laser Shock Processing ◽  
Tc4 Titanium Alloy ◽  
Compressive Stresses ◽  
Maximum Value ◽  
Shock Processing

The aim of this article is to analyze the residual stresses field in a TC4 titanium alloy blade by laser shock processing (LSP).LSP is a new surface processing technology, it uses the laser shock wave to act on the surface of the target and form residual compressive stresses field. The ABAQUS software is applied to simulate the LSP of TC4 titanium alloy blade, and the distributions of the residual stresses field are analysed.After single LSP,the maximum value of residual stress on the surface is 309 MPa.The residual stresses on the surface increase first and then decrease.The residual stresses at the depth continue decreasing with the increase of the depth.After multiple LSP,the maximum value of residual stress on the surface is increased and plastically affected depth is increased.

Residual Stress Measurements in a 316L Uniaxial Samples Manufactured by Laser Powder Bed Fusion

2020 ◽  
Author(s):  
C. M. Davies ◽  
P. Sandmann ◽  
T. Ronneberg ◽  
P. A. Hooper ◽  
Saurabh Kabra
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Cross Section ◽  
316L Stainless Steel ◽  
Powder Bed Fusion ◽  
Laser Powder Bed Fusion ◽  
Powder Bed ◽  
Stress Measurements ◽  
Compressive Stresses ◽  
Central Cross Section

Abstract Uniaxial samples have been manufactured for tension/compression testing from 316L stainless steel by laser powder bed fusion (LPBF). Samples manufactured by LPBF are known to contain high levels of residual stresses. These uniaxial samples were built from a solid cylindrical rod and subsequently machined to reduce the central cross section of the sample to the required gauge diameter and improve the surface finish. Finite element (FE) models have been developed to simulate the LPBF process of the rods, their removal from the build plate and subsequent machining into the tension/compression samples. High tensile residual stresses were predicted at the surface of the samples, balances by similar magnitude compressive stresses along their axis. Post machining however, these stresses were reduced by around 80% or more. Residual stress measurements were performed on the samples post machining using the neutron diffraction techniques. These measurements confirmed that negligible residual stresses remained in the samples post removal from the build plate and machining.

Effect of Sputtering Gas Pressure and Bias Voltage on Mechanical Properties of TiN Coating Deposited by DC Magnetron Sputtering

2004 ◽  
Author(s):  
Hirotaka Tanabe ◽  
Yoshio Miyoshi ◽  
Tohru Takamatsu ◽  
Hitoshi Awano ◽  
Takaaki Yamano
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Magnetron Sputtering ◽  
Bias Voltage ◽  
Adhesive Strength ◽  
Gas Pressure ◽  
Dc Magnetron Sputtering ◽  
Tin Films ◽  
Bombarding Energy ◽  
Gas Pressures

The mechanical properties of TiN films deposited on carbon steel JIS S45C by reactive dc magnetron sputtering under three sputtering gas pressures, 0.5Pa, 0.8Pa, and 1.76Pa were investigated. The residual stress once increased and then decreased with increasing bias voltage at 0.5Pa and 0.8Pa, but increased monotonously at 1.76Pa. These variations could be explained by the variations of the bombarding energy of a sputtered ion at each gas pressure. The variations of hardness and toughness correlated with the variation of residual stress. The variation of adhesive strength also could be explained by the variation of the bombarding energy with a model proposed in this study. A specific wear rate was also investigated, and it was found that to increase not only the hardness but also the adhesive strength is necessary to improve the wear resistance of TiN films.

Influence of the Distance between Target and Substrate on the Properties of TGZO Films Prepared by DC Magnetron Sputtering

2010 ◽  
Vol 663-665 ◽  
pp. 572-575 ◽  
Author(s):  
Han Fa Liu ◽  
Hua Fu Zhang ◽  
Ai Ping Zhou
Keyword(s):  
Electrical Resistivity ◽  
Magnetron Sputtering ◽  
Visible Region ◽  
Hexagonal Structure ◽  
X Ray Diffraction ◽  
Dc Magnetron Sputtering ◽  
Glass Substrates ◽  
Average Transmittance ◽  
Xrd Patterns ◽  
Deposited Films

Ti-Ga co-doped ZnO thin films (TGZO) have been successfully prepared on glass substrates by DC magnetron sputtering at room temperature. The X-ray diffraction (XRD) patterns show that all the deposited films are polycrystalline with a hexagonal structure and have a preferred orientation along the c-axis perpendicular to the substrate. The distance between target and substrate was varied from 41 to 75 mm. The crystallinity increases obviously and the electrical resistivity decreases when the distance between target and substrate decreases from 75 to 46 mm. However, as the distance decreases further, the electrical resistivity increases. It is obtained that the lowest resistivity is 2.0610-4cm when the distance between target and substrate is 46 mm. In the visible region, the TGZO films show a high average transmittance of above 90 %.

X-Ray Diffraction Measurements of Residual Stress Induced by Surface Compressing Methods

2012 ◽  
Vol 729 ◽  
pp. 199-204 ◽  
Author(s):  
Dávid Cseh ◽  
Valéria Mertinger
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Surface Region ◽  
X Ray Diffraction ◽  
X Ray ◽  
Hardened Alloy ◽  
Compressive Stresses ◽  
Machine Parts ◽  
Stress States ◽  
Operational Behaviour

Residual stresses have a fundamental effect on the operational behaviour and lifetime of industrial products. The fatigue resistance of machine parts can be increased by introducing residual compressive stresses into the surface region. For certain machine parts especially in the vehicle industry the residual stress is strongly demanded by the quality control. For this reason, measuring the stress accurately is becoming increasingly important. The Almen test, which only gives a qualitative result, is widely used in the industry. Shot peening and rolling are methods which are suitable for creating elastic residual stresses. This paper examines the technologies used by Rába Futómű Nyrt. to increase the lifetime by means of residual stress. We performed analysis of the residual stress of samples shot peened the same way but under different heat treatment states. We compared the residual stress values of burnished and hardened shaft joints, and the residual stress states of gear made of hardened alloy, comparing the carbonized ones to ones which were shot peened under small intensity.

scholarly journals Tuning The Crystallographic Structure And Morphology Of Nanocrystalline CaB6 Films Deposited By DC Magnetron Sputtering

2015 ◽  
Vol 60 (2) ◽  
pp. 897-901 ◽  
Author(s):  
L. Zhang ◽  
G. Zhao ◽  
H. Liu ◽  
G. Min ◽  
H. Yu
Keyword(s):  
Grain Size ◽  
Magnetron Sputtering ◽  
Energy Dispersive Spectrometer ◽  
Argon Pressure ◽  
Raman Shift ◽  
Crystallographic Structure ◽  
Dc Magnetron Sputtering ◽  
Glass Substrates ◽  
Average Grain Size ◽  
Crystallite Sizes

Abstract Through changing the argon pressure, CaB6 films with different crystallographic orientation and morphology on glass substrates were prepared by direct current (DC) magnetron sputtering method. The film textures, crystallite sizes, composition and morphology were investigated by a spectrum of characterizing techniques in terms of X-ray diffraction (XRD), field emission scanning electron microscopy with energy dispersive spectrometer (FESEM-EDS), atomic force microscopy (AFM), Raman shift spectroscopy. The influence of argon pressure on microstructure was studied. The average grain size increased with the argon pressure increasing from 0.8 Pa to 1.5 Pa. Meanwhile, the dominant crystal face changed from (110) to (100). Then the grain size decreased when the argon pressure increased to 2.0 Pa. The surface morphology evolved from typical cauliflower-like nanocrystalline clusters to faceted rectangular pyramids. It was found that considerable amount of argon atoms were trapped in the films. The formation process of CaB6 films was also analyzed in this paper.

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