Homoepitaxial Growth and Characterization of 4H-SiC Epilayers by Low-Pressure Hot-Wall Chemical Vapor Deposition

2006 ◽  
Vol 527-529 ◽  
pp. 191-194 ◽  
Author(s):  
Guo Sheng Sun ◽  
Jin Ning ◽  
Quan Cheng Gong ◽  
Xin Gao ◽  
Lei Wang ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Low Pressure ◽  
Optical Microscope ◽  
Thick Sample ◽  
Force Microscopy ◽  
Homoepitaxial Growth ◽  
Atomic Force ◽  
Blocking Voltage ◽  
Gas System ◽  
Surface Morphologies

Horizontal air-cooled low-pressure hot-wall CVD (LP-HWCVD) system is developed to get high quality 4H-SiC epilayers. Homoepitaxial growth of 4H-SiC on off-oriented Si-face (0001) 4H-SiC substrates purchased from Cree is performed at a typical temperature of 1500°C with a pressure of 40 Torr by using SiH4+C2H4+H2 gas system. The surface morphologies and structural and optical properties of 4H-SiC epilayers are characterized with Nomarski optical microscope, atomic force microscopy (AFM), x-ray diffraction, Raman scattering, and low temperature photoluminescence (LTPL). The background doping of 32 μm-thick sample has been reduced to 2-5×1015 cm-3. The FWHM of the rocking curve is 9-16 arcsec. Intentional N-doped and B-doped 4H-SiC epilayers are obtained by in-situ doping of NH3 and B2H6, respectively. Schottky barrier diodes with reverse blocking voltage of over 1000 V are achieved preliminarily.

Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond

2016 ◽  
Vol 857 ◽  
pp. 79-82
Author(s):  
Roslina Ismail ◽  
Fuaida Harun ◽  
Azman Jalar ◽  
Shahrum Abdullah
Keyword(s):  
Optical Microscope ◽  
Bonding Process ◽  
Mechanical Interlocking ◽  
Average Roughness ◽  
Force Microscopy ◽  
Atomic Force ◽  
Surface Morphologies ◽  
Scanning Electron ◽  
Effect Of Surface

This work is a contribution towards the understanding of wire bond integrity and reliability in relation to their microstructural and mechanical properties in semiconductor packaging.The effect of surface roughness and hardness of leadframe on the bondability of Au wedge bond still requires detail analysis. Two type of leadframes namely leadframe A and leadframe B were chosen and scanning electron microscope (SEM) and optical microscope were used to inspect the surface morphology of leadframes and the quality of created Au wedge bond after wire bonding process. It was found that there were significant differences in the surface morphologies between these two leadframes. The atomic force microscopy (AFM) which was utilized to measure the average roughness, Ra of lead finger confirms that leadframe A has the highest Ra with value of 166.46 nm compared to that of leadframe B with value of 85.89 nm. While hardness value of different lead finger from the selected leadframe A and B obtained using Vicker microhardness tester are 180.9 VH and 154.2VH respectively.

Surface Morphology and Electric Property of the AlGaN/AlN/GaN Multilayers with Varying the AlN Thickness

2013 ◽  
Vol 1515 ◽  
Author(s):  
Shih-Chun Huang ◽  
Wen-Ray Chen ◽  
Jia-Ching Lin ◽  
Kuo-Jen Chang ◽  
Wen-Jen Lin ◽  
...  
Keyword(s):  
Lattice Mismatch ◽  
Chemical Vapor ◽  
Force Microscopy ◽  
Gan Hemt ◽  
Atomic Force ◽  
Algan Barrier ◽  
Density Analysis ◽  
Dimensional Electron Gas ◽  
Surface Morphologies ◽  
Gan Buffer Layer

ABSTRACTThe surface morphologies of AlGaN/AlN/GaN HEMT structures were examined by using the atomic force microscopy (AFM).These HEMT structures have been grown by metalorganic chemical vapor deposition (MOCVD) onto the sapphire (0001) substrates where the thicknesses of AlN interlayers were varied from 0 to 5 nm. After the growth of GaN buffer layer, the AlN intermediate and AlGaN top layers were subsequently deposited at 1130°C in an trimethylaluminum (TMAl) and ammonia (NH3) atmosphere. The surface of AlGaN layers shows the thick- and fine-thread patterns.It was found that the root-mean-square (RMS) roughness of the samples with 0, 0.5, 2.5 and 5nm AlN interlayer thickness are 0.503, 0.534, 0.534 and 0.601nm, respectively. Although the cracks and rougher surfaces show that the qualities of AlGaN barrier layers have slightly degraded in the samples with thicker AlN layer. These phenomena could be attributed to the lattice mismatch and the growth temperature. In addition, the room-temperature two-dimensional electron gas (2DEG) mobility and density analysis were performed on the AlGaN surfaces and the measured results were discussed in detail.

scholarly journals Deposition, morphology and functional properties of layers based on DLC:Si and DLC:N on polyurethane

2020 ◽  
Vol 126 (9) ◽  
Author(s):  
Karol Kyzioł ◽  
Piotr Jabłoński ◽  
Wiktor Niemiec ◽  
Janusz Prażuch ◽  
Daniel Kottfer ◽  
...  
Keyword(s):  
Roughness Parameter ◽  
Chemical Vapor ◽  
Human Keratinocytes ◽  
Polar Component ◽  
Internal Stresses ◽  
Capacitively Coupled ◽  
Force Microscopy ◽  
Atomic Force ◽  
Si Doped ◽  
Surface Morphologies

Abstract DLC:Si and DLC:N (diamond-like carbons doped with Si or N) functional layers in different configurations are deposited on polyurethane (PU) for bioengineering applications using CCP (capacitively coupled plasma) discharge generated in the PE CVD (plasma-enhanced chemical vapor deposition) system. Scanning electron microscopy (SEM) observations show that the obtained single and multilayers are continuous and well adherent to the substrates, but they differ in surface morphologies. DLC:Si layers form granular-like outer surfaces, while DLC:N ones a mosaic structure of plain areas. Topography analyses by atomic force microscopy (AFM) and optical profilometry reveal that Si-doped layers are characterized by significantly higher surface roughness (Ra ca. 5 nm) in comparison to N-doped layers (Ra ca. 0.3 nm) and also higher values of profile roughness parameter Rz (up to 32 μm vs. about 13 μm). Energy-dispersive X-ray spectroscopy (EDS) analysis indicates the homogenous chemical composition of the layers. DLC:N layers, are characterized by significantly higher polar component of surface free energy (up to ca. 5.0 mJ/m2). DLC:Si layers exhibit higher values of diiodomethane contact angle (up to ca. 90°) compared with DLC:N layers (up to ca. 55°). The attenuated total reflectance Fourier transform infrared spectroscopic measurements (ATR-FTIR) of the layers reveal that the addition of silicon to the DLC structure increases the content of terminal CHn bonds (n = 1, 2, 3) as well as beneficial Si–H and Si–CHn bonds, which significantly reduce the internal stresses in the layers. Both DLC:Si and DLC:N layers exhibit no cytotoxic effects using the human osteoblast-like cell line and human keratinocytes.

Ni Removal from Si Wafers by Low-Pressure UV-Chlorine Cleaning

1997 ◽  
Vol 477 ◽  
Author(s):  
C. H. Courtney ◽  
H. H. Lamb
Keyword(s):  
Physical Vapor Deposition ◽  
Depth Profiling ◽  
Chemical Vapor ◽  
Surface Concentration ◽  
Low Pressure ◽  
Force Microscopy ◽  
Etching Mechanism ◽  
Photochemical Etching ◽  
Atomic Force ◽  
Substrate Temperatures

ABSTRACTNi removal from Si wafers by low-pressure UV/Cl2 chemical vapor cleaning (CVC) was investigated at substrate temperatures of 150–200°C. Sub-monolayer Ni coverages were applied to Si(100) by ultrahigh-vacuum physical vapor deposition (UHV-PVD). The Ni surface concentration was reduced to the Auger electron spectroscopy (AES) detection limit by a 2-min UV/Cl2 exposure at 300 mTorr and 200°C. AES depth profiling revealed that Ni was not contained within nor buried beneath the chlorosilyl layer formed by UV/Cl2 CVC. In contrast, Ni was not removed under similar conditions from Si surfaces covered by a thin UV/air oxide layer. These results indicate that Ni removal from Si occurs by a photochemical etching mechanism and not by direct volatilization of NiCl2. Atomic force microscopy (AFM) of Si surfaces after UV/Cl2 CVC indicated that Si etching was limited ˜20 å and that the surface was smooth (RMS roughness = 1.6 å).

Step Flow Surface Morphology in Plasma Assisted Molecular Beam Epitaxy Grown GaN

2000 ◽  
Vol 639 ◽  
Author(s):  
Kazuhide Kusakabe ◽  
Akihiko Kikuchi ◽  
Katsumi Kishino
Keyword(s):  
Molecular Beam Epitaxy ◽  
Surface Morphology ◽  
Driving Force ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Force Microscopy ◽  
Atomic Force ◽  
Flow Surface ◽  
Migration Enhanced Epitaxy ◽  
Surface Morphologies

ABSTRACTThe surface morphologies of homoepitaxial GaN films grown by molecular beam epitaxy (MBE) on metalorganic chemical vapor deposition (MOCVD) grown GaN template layers were investigated, using atomic force microscopy (AFM). Typical surface morphology of MBE-grown films on MOCVD-templates was dominated by spiral hillocks due to the high density of dislocations having a screw character and large driving force of MBE growth. Introduction of the AlN multiple interlayer (AlN -MIL) into MBE-GaN layers suppressed the formation of spiral hillocks. It was attributed to obstructing the dislocation propagation by AlN-MIL. Migration enhanced epitaxy (MEE) growth of GaN also reduced the density and tightness of spiral hillocks. This observation was attributed to that MEE growth technique decreased the driving force of growth.

Growth and Surface Morphologies of 6H SiC Bulk and Epitaxial Crystals

2006 ◽  
Vol 527-529 ◽  
pp. 67-70 ◽  
Author(s):  
Govindhan Dhanaraj ◽  
Yi Chen ◽  
Michael Dudley ◽  
Hui Zhang
Keyword(s):  
Vapor Deposition ◽  
Chemical Vapor ◽  
Structural Quality ◽  
Epitaxial Layers ◽  
Bulk Crystals ◽  
Hydrogen Etching ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Surface Morphologies

Bulk crystals and epitaxial layers of 6H SiC have been grown and their surface morphologies have been investigated. Seeded sublimation has been employed to obtain bulk 6H SiC crystals whereas a silicon tetrachloride-propane based chemical vapor deposition (CVD) was used for growing epitaxial layers. The hot-zones were designed using numerical simulation. Growth rates up to 200 μm/hr could be achieved in the CVD process. A new growth-assisted hydrogen etching was developed to reveal the distribution of the micropipes present in the substrate. Morphological features were studied using Nomarski, atomic force microscopy (AFM), and scanning electron microscopy (SEM), and the structural quality was evaluated using synchrotron X-ray topography.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

scholarly journals Influence of the growth parameters of TiO2 thin films deposited by the MOCVD method

Cerâmica ◽  
2002 ◽  
Vol 48 (305) ◽  
pp. 38-42 ◽  
Author(s):  
M. I. B. Bernardi ◽  
E. J. H. Lee ◽  
P. N. Lisboa-Filho ◽  
E. R. Leite ◽  
E. Longo ◽  
...  
Keyword(s):  
Thin Films ◽  
Growth Parameters ◽  
Structural Characteristics ◽  
Chemical Vapor ◽  
X Ray Diffraction ◽  
Tio2 Thin Films ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Deposition Parameters

The synthesis of TiO2 thin films was carried out by the Organometallic Chemical Vapor Deposition (MOCVD) method. The influence of deposition parameters used during growth on the final structural characteristics was studied. A combination of the following experimental parameters was studied: temperature of the organometallic bath, deposition time, and temperature and substrate type. The high influence of those parameters on the final thin film microstructure was analyzed by scanning electron microscopy with electron dispersive X-ray spectroscopy, atomic force microscopy and X-ray diffraction.

scholarly journals Photothermal Deflection Spectroscopy Study of Nanocrystalline Si (nc-Si) Thin Films Deposited on Porous Aluminum with PECVD

2012 ◽  
Vol 2012 ◽  
pp. 1-5 ◽  
Author(s):  
S. Ktifa ◽  
M. Ghrib ◽  
F. Saadallah ◽  
H. Ezzaouia ◽  
N. Yacoubi
Keyword(s):  
Optical Properties ◽  
Energy Gap ◽  
Chemical Vapor ◽  
Nanocrystalline Silicon ◽  
Porous Aluminum ◽  
Force Microscopy ◽  
Photothermal Deflection Spectroscopy ◽  
Atomic Force ◽  
Photothermal Deflection ◽  
Morphology Characterization

We have studied the optical properties of nanocrystalline silicon (nc-Si) film deposited by plasma enhancement chemical vapor deposition (PECVD) on porous aluminum structure using, respectively, the Photothermal Deflection Spectroscopy (PDS) and Photoluminescence (PL). The aim of this work is to investigate the influence of anodisation current on the optical properties of the porous aluminum silicon layers (PASL). The morphology characterization studied by atomic force microscopy (AFM) technique has shown that the grain size of (nc-Si) increases with the anodisation current. However, a band gap shift of the energy gap was observed.

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