Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000047-000053
Author(s):  
J. Phillip Bailey ◽  
Michael D. Glover ◽  
Emmanuel Decrossas ◽  
Kaoru Porter ◽  
Tom Cannon ◽  
...  
Keyword(s):  
Cross Sections ◽  
Transmission Lines ◽  
Time Domain ◽  
High Frequency ◽  
High Speed ◽  
Digital Signal ◽  
Simulation Models ◽  
Advantages And Disadvantages ◽  
Lower Insertion Loss ◽  
Printing Techniques

The many advantages of low temperature co-fired ceramic (LTCC) materials are increasing their use in multi-layer systems containing multiple high-frequency / high-speed digital interconnects. Although construction of such interconnects is possible with current fabrication techniques, the loss exhibited by transmission lines at high frequencies limits their application by increasing system power consumption or requiring complex transceivers. Use of non-standard metal printing processes provides one possibility for realizing lower insertion loss desired for these interconnects. We have fabricated and evaluated representative single-ended and differential stripline transmission line structures using single, double, and mirror printing techniques for Ag metalization in DuPont 9K7 LTCC, to explore their suitability for high-frequency/high-speed applications. Discussion of analysis performed on cross-sections of these structures to determine post-firing geometry, as well as the level of fabrication control afforded over these parameters will be presented. To predict their performance for high-speed interconnects, 3D electromagnetic (3DEM) simulation models for characterizing the frequency performance of single-ended and differential structures have been also been developed. These 3DEM models have also been used in time domain simulations to verify digital signal capability by demonstrating structure performance at data rates exceeding 25 Gbps. Measurements of fabricated structures corresponding to the 3DEM models have also been performed in both the time and frequency domain and will be compared to the simulation results to confirm 3DEM model accuracy. The culmination of results from simulation and measurement will be used to present the differences, advantages, and disadvantages of each fabrication technique.

A Practical Method for Trace Exposure and Roughness Measurements and Implementation in High Speed Package Design

2012 ◽  
Author(s):  
Valentina Korchnoy ◽  
Jacov Brener
Keyword(s):  
Transmission Lines ◽  
Insertion Loss ◽  
High Frequency ◽  
High Speed ◽  
Transmission Loss ◽  
Signal Propagation ◽  
Practical Method ◽  
High Frequency Signal ◽  
Advantages And Disadvantages ◽  
Conductor Surface

Abstract High frequency signal propagation through transmission lines has been an important discipline for RF engineers. With advancements in digital technologies, especially when data rates reached multiple Gb/s, package designers have to consider parameters such as transmission loss and trace impedance in order to maintain signal integrity. For high frequency signals, the surface roughness of the copper trace becomes increasingly significant in determining conduction loss, due to current confinement to the conductor surface by the skin effect. Accurate 3D conductor surface maps are required for correct trace insertion loss simulation. Practical methods for package trace exposure and 3D surface height map acquisition are discussed in this paper. Advantages and disadvantages of these methods, and their implementation to real packages are shown. Using electrical parameters resulting from a 3D trace surface map, the error between electrical simulations and actual measurements of insertion loss in an FCBGA package have been reduced from 6% to nearly zero, enabling tighter margins in 10GB/s high speed serial design.

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

2016 ◽  
Vol 2016 (1) ◽  
pp. 000358-000363 ◽  
Author(s):  
Qianfei Su ◽  
A. Ege Engin ◽  
Jerry Aguirre
Keyword(s):  
Surface Roughness ◽  
Cross Sections ◽  
Transmission Lines ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Electrical Characterization ◽  
Cavity Resonator ◽  
Circuit Board ◽  
Low Profile ◽  
Measure Surface Roughness

Abstract Signal attenuation in transmission lines is a major issue for reliable transmission in high frequency range. Knowledge of the electrical parameters of printed circuit board (PCB), including dielectric constant and loss tangent, is critical. Moreover, surface roughness has a great effect on loss in high frequency. This paper demonstrates an effective simulation fitting method for electrical material characterization. Cavity resonator is chosen as the circuit for characterization. A methodology is presented to measure surface roughness from cross sections, and compared with values extracted from resonator measurements. Several materials and copper foils treatments, including low-profile, are analyzed in this paper.

scholarly journals Development of a High-Speed Digitizer to Time Resolve Nanosecond Fluorescence Pulses

2012 ◽  
Vol 10 (2) ◽  
Author(s):  
E. Moreno-García ◽  
R. Galicia-Mejía ◽  
D. Jiménez-Olarte ◽  
J. M. de la Rosa Vázquez ◽  
S. Stolik-Isakina
Keyword(s):  
Time Domain ◽  
Digital Signal Processor ◽  
High Speed ◽  
High Performance ◽  
Input Pulse ◽  
Control Program ◽  
Sampling Technique ◽  
Digital Signal ◽  
Time Resolved ◽  
The Time Domain

The development of a high-speed digitizer system to measure time-domain voltage pulses in nanoseconds range is presented in this work. The digitizer design includes a high performance digital signal processor, a high-bandwidth analog-to-digital converter of flash-type, a set of delay lines, and a computer to achieve the time-domain measurements. A program running on the processor applies a time-equivalent sampling technique to acquire the input pulse. The processor communicates with the computer via a serial port RS-232 to receive commands and to transmit data. A control program written in LabVIEW 7.1 starts an acquisition routine in the processor. The program reads data from processor point by point in each occurrence of the signal, and plots each point to recover the time-resolved input pulse after n occurrences. The developed prototype is applied to measure fluorescence pulses from a homemade spectrometer. For this application, the LabVIEW program was improved to control the spectrometer, and to register and plot time-resolved fluorescence pulses produced by a substance. The developed digitizer has 750 MHz of analog input bandwidth, and it is able to resolve 2 ns rise-time pulses with 150 ps of resolution and a temporal error of 2.6 percent.

scholarly journals Assessment of 50%-Propagation-Delay for Cascaded PCB Non-Linear Interconnect Lines for the High-Rate Signal Integrity Analysis

2013 ◽  
Vol 2 (1) ◽  
pp. 1
Author(s):  
T. Eudes ◽  
B. Ravelo ◽  
R. Al-Hayek
Keyword(s):  
Transfer Function ◽  
Transmission Lines ◽  
Time Domain ◽  
High Speed ◽  
Signal Integrity ◽  
Frequency Dispersion ◽  
Propagation Delay ◽  
High Rate ◽  
Propagation Time ◽  
Time Assessment

This paper presents an enlarged study about the 50-% propagation-time assessment of cascaded transmission lines (TLs). First and foremost, the accurate modeling and measurement technique of signal integrity (SI) for high-rate microelectronic interconnection is recalled. This model is based on the reduced transfer function extracted from the electromagnetic (EM) behavior of the interconnect line RLCG-parameters. So, the transfer function established takes into account both the frequency dispersion effects and the different propagation modes. In addition, the transfer function includes also the load and source impedance effects. Then, the SI analysis is proposed for high-speed digital signals through the developed model. To validate the model understudy, a prototype of microstrip interconnection with w = 500 µm and length d = 33 mm was designed, simulated, fabricated and tested. Then, comparisons between the frequency and time domain results from the model and from measurements are performed. As expected, good agreement between the S-parameters form measurements and the model proposed is obtained from DC to 8 GHz. Furthermore, a de-embedding method enabling to cancel out the connectors and the probe effects are also presented. In addition, an innovative time-domain characterization is proposed in order to validate the concept with a 2.38 Gbit/s-input data signal. Afterwards, the 50-% propagation-time assessment problem is clearly exposed. Consequently an extracting theory of this propagation-time with first order RC-circuits is presented. Finally, to show the relevance of this calculation, propagation-time simulations and an application to signal integrity issues are offered.

TDR Analysis on Short Transmission Lines

2014 ◽  
Author(s):  
Nicholas Konkol
Keyword(s):  
Failure Analysis ◽  
Transmission Line ◽  
Transmission Lines ◽  
Time Domain ◽  
System Level ◽  
Electrical Failure ◽  
Advantages And Disadvantages ◽  
System A ◽  
Time Domain Reflectometer ◽  
Line Analysis

Abstract Transmission line analysis is done in electrical failure analysis labs in order to find root causes that result in system level failures. After a fault is narrowed to a particular signal in a system, a Time Domain Reflectometer (TDR) can be used to analyze the physical transmission line associated with the signal. The transmission lines on smartphones often have inaccessible signal vias, few or no ground vias, probe points that are difficult to see, and short transmission lines. One solution that can alleviate these problems is to design a TDR Accessory Card. This paper discusses the processes involved in testing long and short transmission lines, providing the comparison between the expected and actual TDR measurement and the advantages and disadvantages of TDR, explaining four main points for using a TDR Accessory Card and two reasons for not using the TDR Accessory Card.

Performances of a High-Speed Impedance Camera for Flow Informatics

Volume 1 ◽  
2004 ◽  
Author(s):  
Y. Ma ◽  
M. Wang
Keyword(s):  
Image Reconstruction ◽  
Flow Velocity ◽  
Cross Sections ◽  
Digital Signal Processor ◽  
High Speed ◽  
Cross Correlation ◽  
Correlation Method ◽  
Digital Signal ◽  
Two Phase ◽  
Impedance Contrast

An impedance camera has been developed and optimized for visualization and measurement of two-phase flows. This camera, in its basic construction, can synchronously map two cross sections of a pipeline flow in time sequence, where the components of the flow have impedance contrast. Flow velocity distribution can be implemented from the two series of images using the cross-correlation method. The data capture, image reconstruction, concentration and velocity implementation, all are processed on-line using multi-digital signal processor built in the camera. This paper presents a part of test results regarding to the system major performances of the measurement repeatability, consistency of 16 parallel measurement channels, speeds of data acquisition, rate of image reconstruction and cross-correlation implementation, estimation of the discrimination error in flow velocity and flow rate measurements, etc.

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