Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer
2012 ◽
Vol 9
(4)
◽
pp. 160-165
◽
Keyword(s):
The Self
◽
Electrical and mechanical performance of quilt packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dice along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 100 pH, and the self-capacitance can be less than 34 fF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that causes failure in a set of edge interconnects totaling 3 mm width of nodules is about 658 g-force for Sn63Pb37 and 953 g-force for SAC305.