Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite

2013 ◽  
Vol 10 (2) ◽  
pp. 54-58 ◽  
Author(s):  
M. Faqir ◽  
J. W. Pomeroy ◽  
T. Batten ◽  
T. Mrotzek ◽  
S. Knippscheer ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Power Electronics ◽  
Structural Changes ◽  
Coefficient Of Thermal Expansion ◽  
Base Plate ◽  
Electronics Packaging ◽  
Case Scenario ◽  
Worst Case ◽  
New Material ◽  
Work Samples

A reliability analysis of silver diamond composites in terms of both thermal and mechanical properties is presented. This new material is an attractive solution for power electronics packaging, because an improvement of 50% in terms of thermal management and channel temperature can be obtained when using silver diamond composites as a base plate in packages compared with the more traditionally used materials such as CuW. However, to date, little is known about the reliability of this new material, such as changes induced in its properties by thermal cycling. Assessment of the reliability of silver diamond composites is the aim of this work. Samples were submitted to 10 thermal cycles from room temperature to 350°C, and subsequently, a further 500 cycles of thermal shock as well as thermal cycling from −55°C to 125°C following typical standards used in space and military applications. In the worst-case scenario, thermal conductivity only decreased from 830 W/m·K to ∼700 W/m·K. An increase in the coefficient of thermal expansion and a change in diamond stress, were also observed after thermal cycling. Some structural modifications at the silver-diamond interface were found to be the underlying reason for the observed material properties change. These structural changes take place after the initial thermal cycling, and are constant thereafter. Changes found in thermal properties are satisfactory for enabling a significant improvement to standard CuW packaging materials.

scholarly journals Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Darshan G. Pahinkar ◽  
Lauren Boteler ◽  
Dimeji Ibitayo ◽  
Sreekant Narumanchi ◽  
Paul Paret ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Silicon Carbide ◽  
Thermal Cycling ◽  
Power Electronics ◽  
Coefficient Of Thermal Expansion ◽  
Base Plate ◽  
Transfer Coefficients ◽  
Pin Fins ◽  
Aluminum Silicon Carbide ◽  
Aluminum Silicon

With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC)—Cu base plate—Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single-phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, microchannels, pin fins, and jets can be designed to yield a heat transfer coefficients (HTCs) of up to 65,000 W m−2 K−1, which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.

Reliability of Bonded Interfaces for Automotive Power Electronics

2013 ◽  
Author(s):  
Douglas DeVoto ◽  
Paul Paret ◽  
Sreekant Narumanchi ◽  
Mark Mihalic
Keyword(s):  
Thermal Resistance ◽  
Power Electronics ◽  
Carbon Fibers ◽  
Thermal Performance ◽  
Coefficient Of Thermal Expansion ◽  
Base Plate ◽  
Acoustic Microscopy ◽  
Thermal Cycles ◽  
Interface Materials ◽  
Sintered Silver

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase change materials pose bottlenecks to heat removal and are also associated with reliability concerns. There is an industry trend towards high thermal performance bonded interfaces. However, due to coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a problem from a reliability standpoint. These defects manifest themselves in increased thermal resistance in the package. The objective of this research is to investigate and improve the thermal performance and reliability of emerging bonded interface materials for power electronics packaging applications. We present results for thermal performance and reliability of bonded interfaces based on thermoplastic (polyamide) adhesive, with embedded near-vertical aligned carbon fibers, as well as sintered silver material. The results for these two materials are compared to conventional lead-based (Sn63Pb37) bonded interfaces. These materials were bonded between 50.8-mm × 50.8-mm cross-sectional footprint silicon nitride substrates and copper base plate samples. Samples of the substrate/base plate bonded assembly underwent thermal cycling from −40°C to 150°C according to Joint Electron Devices Engineering Council standard Number 22-A104D for up to 2,000 cycles. The dwell time of the cycle was 10 minutes and the ramp rate was 5°C/minute. Damage was monitored every 100 cycles by acoustic microscopy as an indicator of an increase in thermal resistance of the interface layer. The acoustic microscopic images of the bonded interfaces after 2,000 thermal cycles showed that thermoplastics with embedded carbon fibers performed quite well with no defects, whereas interface delamination occurred in the case of sintered silver material. Both these materials showed a superior bond quality as compared to the lead-based solder interface even after 1,000 thermal cycles.

Reducing Probabilistic Weather Forecasts to the Worst Case Scenario: Anchoring Effects

2008 ◽  
Author(s):  
Sonia Savelli ◽  
Susan Joslyn ◽  
Limor Nadav-Greenberg ◽  
Queena Chen
Keyword(s):  
Case Scenario ◽  
Worst Case ◽  
Weather Forecasts ◽  
Worst Case Scenario ◽  
Anchoring Effects

EXPEDITION TO MALI, 2020

2020 ◽  
pp. 12-28
Author(s):  
D. V. Vaniukova ◽  
◽  
P. A. Kutsenkov ◽  
Keyword(s):  
Mass Murder ◽  
The State ◽  
Case Scenario ◽  
Worst Case ◽  
Traditional Art ◽  
Peter The Great ◽  
State Museum ◽  
Bobo Dioulasso ◽  
Oriental Studies ◽  
The Village

The research expedition of the Institute of Oriental studies of the Russian Academy of Sciences has been working in Mali since 2015. Since 2017, it has been attended by employees of the State Museum of the East. The task of the expedition is to study the transformation of traditional Dogon culture in the context of globalization, as well as to collect ethnographic information (life, customs, features of the traditional social and political structure); to collect oral historical legends; to study the history, existence, and transformation of artistic tradition in the villages of the Dogon Country in modern conditions; collecting items of Ethnography and art to add to the collection of the African collection of the. Peter the Great Museum (Kunstkamera, Saint Petersburg) and the State Museum of Oriental Arts (Moscow). The plan of the expedition in January 2020 included additional items, namely, the study of the functioning of the antique market in Mali (the “path” of things from villages to cities, which is important for attributing works of traditional art). The geography of our research was significantly expanded to the regions of Sikasso and Koulikoro in Mali, as well as to the city of Bobo-Dioulasso and its surroundings in Burkina Faso, which is related to the study of migrations to the Bandiagara Highlands. In addition, the plan of the expedition included organization of a photo exhibition in the Museum of the village of Endé and some educational projects. Unfortunately, after the mass murder in March 2019 in the village of Ogossogou-Pel, where more than one hundred and seventy people were killed, events in the Dogon Country began to develop in the worst-case scenario: The incessant provocations after that revived the old feud between the Pel (Fulbe) pastoralists and the Dogon farmers. So far, this hostility and mutual distrust has not yet developed into a full-scale ethnic conflict, but, unfortunately, such a development now seems quite likely.

Risk-Based Robust Bidding Strategies for EVs’ Aggregators in Day-ahead Markets with Uncertainty

2020 ◽  
Author(s):  
Ahmed Abdelmoaty ◽  
Wessam Mesbah ◽  
Mohammad A. M. Abdel-Aal ◽  
Ali T. Alawami
Keyword(s):  
Robust Optimization ◽  
Electricity Market ◽  
Real Life ◽  
Optimization Approach ◽  
Case Scenario ◽  
Worst Case ◽  
Bidding Strategies ◽  
Wind Generators ◽  
Proposed Model ◽  
Optimal Bidding

In the recent electricity market framework, the profit of the generation companies depends on the decision of the operator on the schedule of its units, the energy price, and the optimal bidding strategies. Due to the expanded integration of uncertain renewable generators which is highly intermittent such as wind plants, the coordination with other facilities to mitigate the risks of imbalances is mandatory. Accordingly, coordination of wind generators with the evolutionary Electric Vehicles (EVs) is expected to boost the performance of the grid. In this paper, we propose a robust optimization approach for the coordination between the wind-thermal generators and the EVs in a virtual<br>power plant (VPP) environment. The objective of maximizing the profit of the VPP Operator (VPPO) is studied. The optimal bidding strategy of the VPPO in the day-ahead market under uncertainties of wind power, energy<br>prices, imbalance prices, and demand is obtained for the worst case scenario. A case study is conducted to assess the e?effectiveness of the proposed model in terms of the VPPO's profit. A comparison between the proposed model and the scenario-based optimization was introduced. Our results confirmed that, although the conservative behavior of the worst-case robust optimization model, it helps the decision maker from the fluctuations of the uncertain parameters involved in the production and bidding processes. In addition, robust optimization is a more tractable problem and does not suffer from<br>the high computation burden associated with scenario-based stochastic programming. This makes it more practical for real-life scenarios.<br>

scholarly journals A Thermally Conductive Pt/AAO Catalyst for Hydrogen Passive Autocatalytic Recombination

Catalysts ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 491
Author(s):  
Alina E. Kozhukhova ◽  
Stephanus P. du Preez ◽  
Aleksander A. Malakhov ◽  
Dmitri G. Bessarabov
Keyword(s):  
Electron Microscopy ◽  
Particle Size ◽  
Combustion Temperature ◽  
Volume Fraction ◽  
Morphological Characteristics ◽  
Al Alloy ◽  
Impregnation Method ◽  
Case Scenario ◽  
Worst Case ◽  
Thermal Distribution

In this study, a Pt/anodized aluminum oxide (AAO) catalyst was prepared by the anodization of an Al alloy (Al6082, 97.5% Al), followed by the incorporation of Pt via an incipient wet impregnation method. Then, the Pt/AAO catalyst was evaluated for autocatalytic hydrogen recombination. The Pt/AAO catalyst’s morphological characteristics were determined by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The average Pt particle size was determined to be 3.0 ± 0.6 nm. This Pt/AAO catalyst was tested for the combustion of lean hydrogen (0.5–4 vol% H2 in the air) in a recombiner section testing station. The thermal distribution throughout the catalytic surface was investigated at 3 vol% hydrogen (H2) using an infrared camera. The Al/AAO system had a high thermal conductivity, which prevents the formation of hotspots (areas where localized surface temperature is higher than an average temperature across the entire catalyst surface). In turn, the Pt stability was enhanced during catalytic hydrogen combustion (CHC). A temperature gradient over 70 mm of the Pt/AAO catalyst was 23 °C and 42 °C for catalysts with uniform and nonuniform (worst-case scenario) Pt distributions. The commercial computational fluid dynamics (CFD) code STAR-CCM+ was used to compare the experimentally observed and numerically simulated thermal distribution of the Pt/AAO catalyst. The effect of the initial H2 volume fraction on the combustion temperature and conversion of H2 was investigated. The activation energy for CHC on the Pt/AAO catalyst was 19.2 kJ/mol. Prolonged CHC was performed to assess the durability (reactive metal stability and catalytic activity) of the Pt/AAO catalyst. A stable combustion temperature of 162.8 ± 8.0 °C was maintained over 530 h of CHC. To confirm that Pt aggregation was avoided, the Pt particle size and distribution were determined by TEM before and after prolonged CHC.

scholarly journals Exploration of collagen cavitation based on peptide electrolysis

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Rui Zhai ◽  
Hui Chen ◽  
Zhihua Shan
Keyword(s):  
Structural Changes ◽  
Preparation Method ◽  
Supporting Electrolyte ◽  
Three Dimensional ◽  
Anode Region ◽  
New Approach ◽  
New Material ◽  
Animal Skin ◽  
Exchange Membrane ◽  
Material Preparation

AbstractElectrochemical modification of animal skin is a new material preparation method and new direction of research exploration. In this study, under the action of the electric field using NaCl as the supporting electrolyte, the effect of electrolysis on Glycyl-glycine(GlyGl), gelatin(Gel) and Three-dimensional rawhide collagen(3DC) were determined. The amino group of GlyGl is quickly eliminated within the anode region by electrolysis isolated by an anion exchange membrane. Using the same method, it was found that the molecular weight of Gel and the isoelectric point of the Gel decreased, and the viscosity and transparency of the Gel solution obviously changed. The electrolytic dissolution and structural changes of 3DC were further investigated. The results of TOC and TN showed that the organic matter in 3DC was dissolved by electrolysis, and the tissue cavitation was obvious. A new approach for the preparation of collagen-based multi-pore biomaterials by electrochemical method was explored.

scholarly journals Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 295
Author(s):  
Pao-Hsiung Wang ◽  
Yu-Wei Huang ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Glass Substrate ◽  
High Speed ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Design Parameters ◽  
Time To Failure ◽  
Wafer Level ◽  
Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

scholarly journals A Comparison of Match Demands Using Ball-in-Play versus Whole Match Data in Professional Soccer Players of the English Championship

Sports ◽  
2021 ◽  
Vol 9 (6) ◽  
pp. 76
Author(s):  
Dylan Mernagh ◽  
Anthony Weldon ◽  
Josh Wass ◽  
John Phillips ◽  
Nimai Parmar ◽  
...  
Keyword(s):  
Repeated Measures ◽  
Soccer Players ◽  
Training Methods ◽  
Case Scenario ◽  
Worst Case ◽  
Repeated Measures Design ◽  
Worst Case Scenario ◽  
Professional Soccer ◽  
Peak Match ◽  
Playing Time

This is the first study to report the whole match, ball-in-play (BiP), ball-out-of-play (BoP), and Max BiP (worst case scenario phases of play) demands of professional soccer players competing in the English Championship. Effective playing time per soccer game is typically <60 min. When the ball is out of play, players spend time repositioning themselves, which is likely less physically demanding. Consequently, reporting whole match demands may under-report the physical requirements of soccer players. Twenty professional soccer players, categorized by position (defenders, midfielders, and forwards), participated in this study. A repeated measures design was used to collect Global Positioning System (GPS) data over eight professional soccer matches in the English Championship. Data were divided into whole match and BiP data, and BiP data were further sub-divided into different time points (30–60 s, 60–90 s, and >90 s), providing peak match demands. Whole match demands recorded were compared to BiP and Max BiP, with BiP data excluding all match stoppages, providing a more precise analysis of match demands. Whole match metrics were significantly lower than BiP metrics (p < 0.05), and Max BiP for 30–60 s was significantly higher than periods between 60–90 s and >90 s. No significant differences were found between positions. BiP analysis allows for a more accurate representation of the game and physical demands imposed on professional soccer players. Through having a clearer understanding of maximum game demands in professional soccer, practitioners can design more specific training methods to better prepare players for worst case scenario passages of play.

scholarly journals Trissolcus japonicus (Hymenoptera: Scelionidae) Causes Low Levels of Parasitism in Three North American Pentatomids Under Field Conditions

2019 ◽  
Vol 19 (4) ◽  
Author(s):  
Joshua M Milnes ◽  
Elizabeth H Beers
Keyword(s):  
North American ◽  
Native Species ◽  
Classical Biological Control ◽  
The United States ◽  
Host Finding ◽  
Pest Species ◽  
Case Scenario ◽  
Worst Case ◽  
Egg Masses ◽  
Trissolcus Japonicus

Abstract Trissolcus japonicus (Ashmead), an Asian parasitoid of Halyomorpha halys (Stål) (Hemiptera: Pentatomidae), was first detected in North America in 2014. Although testing in quarantine facilities as a candidate for classical biological control is ongoing, adventive populations have appeared in multiple sites in the United States, Canada, and Europe. Extensive laboratory testing of T. japonicus against other North American pentatomids and H. halys has revealed a higher rate of parasitism of H. halys, but not complete host specificity. However, laboratory tests are necessarily artificial, in which many host finding and acceptance cues may be circumvented. We offered sentinel egg masses of three native pentatomid (Hemiptera: Pentatomidae) pest species (Chinavia hilaris (Say), Euschistus conspersus Uhler, and Chlorochroa ligata (Say)) in a field paired-host assay in an area with a well-established adventive population of T. japonicus near Vancouver, WA. Overall, 67% of the H. halys egg masses were parasitized by T. japonicus during the 2-yr study. Despite the ‘worst case’ scenario for a field test (close proximity of the paired egg masses), the rate of parasitism (% eggs producing adult wasps) on all three native species was significantly less (0.4–8%) than that on H. halys eggs (77%). The levels of successful parasitism of T. japonicus of the three species are C. hilaris > E. conspersus > C. ligata. The potential impact of T. japonicus on these pentatomids is probably minimal.

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