scholarly journals Upgrading Die Attach Machine Capability for Micro Electromechanical Systems Package

2020 ◽  
pp. 10-15
Author(s):  
Michael D. Capili
Keyword(s):  
Product Structure ◽  
Statistical Validation ◽  
Machine Model ◽  
Electromechanical Systems ◽  
Die Attach ◽  
Placement Accuracy ◽  
Critical Characteristics ◽  
And Performance

The paper discussed the study and challenges of the Die Attach process, the critical characteristics of the product structure and the demand for the MEMS product. Upgrading the current machine mechanical and software to improve the machine's capabilities and overcome the criticality of the product structure, such as; 30 microns Die Placement accuracy, can process Wafer with dual Die Orientation 0 and 180 degrees, capable of detecting incorrect die orientation and finally can process thin substrate with 130 microns thickness. After machine upgrades, statistical validation using Two Proportion tests was used to help validate the machine's performance efficiently. The new upgraded machine has the same capability and performance as the new die attach machine model, therefore the upgrade and enhancement on the old model Die Attach machine are effective and efficient.

scholarly journals Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry

2019 ◽  
Vol 2019 ◽  
pp. 1-8 ◽  
Author(s):  
Gilseung Ahn ◽  
Myunghwan Park ◽  
You-Jin Park ◽  
Sun Hur
Keyword(s):  
High Performance ◽  
Semiconductor Industry ◽  
Search Time ◽  
Generalization Ability ◽  
Q Learning ◽  
Die Attach ◽  
Metaheuristic Methods ◽  
Pick And Place ◽  
Novel Method ◽  
And Performance

In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity. Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard. Typical approaches are rule-based and metaheuristic methods. The two have high or low generalization ability, low or high performance, and short or long search time, respectively. The motivation of this paper is to develop a novel method involving only the strengths of these methods, i.e., high generalization ability and performance and short search time. We develop an interactive Q-learning in which two agents, a pick agent and a place agent, are trained and find a pick-and-place (PAP) path interactively. From experiments, we verified that the proposed approach finds a shorter path than the genetic algorithm given in previous research.

From Mining Affective States to Mining Facial Keypoint Data: The Quest Towards Personalized Feedback

2017 ◽  
Author(s):  
Christian E. Lopez ◽  
Conrad S. Tucker
Keyword(s):  
General Model ◽  
Affective State ◽  
Research Area ◽  
Specific Model ◽  
Support Vector ◽  
Affective States ◽  
Personalized Feedback ◽  
Machine Model ◽  
Individual Task ◽  
And Performance

Personalized and timely feedback has the potential to improve an individual’s performance on a wide variety of engineering tasks. The ability to capture an individual’s affective state(s) and performance on a task is a key component needed to advance personalization of feedback. While automated methods exist for quantifying task performance, the ability to quantify an individual’s affective state(s) remains an open research area. Existing methods for quantifying an individual’s affective state(s) are challenging to implement where real-time assessment is needed (e.g., engineering workshop environments). This has sparked a growing interest for automated systems capable of inferring individuals’ affective state(s), based on their projected facial or body cues. However, existing methods attempt to employ a general model to label an individual’s affective state(s) into discrete categories, such as fear, joy, surprise, etc. Nonetheless, emotional expressions are far more complex, as individual differences in facial expressions, may deteriorate the performance of these systems in providing personalized feedback. To overcome these limitations, this work proposes a machine learning method for predicting an individual’s performance on a task by utilizing his/her unique facial keypoint data, hereby bypassing the need to infer his/her discrete affective states. A case study involving 31 participants is presented. The support vector machine model employed to predict an individual’s performance yielded an accuracy of 77.15% for an individual-task specific model. In contrast, a general model yielded an accuracy of only 52.69%, hereby supporting the authors’ argument that individual-task specific models are more suitable for advancing personalized feedback.

scholarly journals Linear Motors Based on Piezoelectric MEMS

Proceedings ◽  
2020 ◽  
Vol 64 (1) ◽  
pp. 9
Author(s):  
Víctor Ruiz-Díez ◽  
Jorge Hernando-García ◽  
José Luis Sánchez-Rojas
Keyword(s):  
Wave Generation ◽  
Aluminium Nitride ◽  
Piezoelectric Film ◽  
Vibrational Modes ◽  
Electromechanical Systems ◽  
Linear Motors ◽  
3D Printed ◽  
Piezoelectric Mems ◽  
And Performance ◽  
Hybrid Devices

This paper reports the design, fabrication and performance of Micro-electromechanical Systems (MEMS) piezoelectric bidirectional conveyors featuring 3D-printed legs in bridge resonators. The structures consisted of aluminium-nitride (AlN) piezoelectric film on top of millimetre-sized rectangular thin silicon bridges and two electrode patches. The position and size of the patches were analytically optimised for wave generation, while the addition of 3D-printed legs, for a controlled contact, allowed for a further step into the manufacturing of efficient linear motors. Such hybrid devices have recently demonstrated the conveyance of sliders—surpassing several times the motor weight—with speeds of 1.7 mm/s while operated at 6 V and 19.3 kHz. However, by the optimisation of various aspects of the device such as the vibrational modes and excitation signals, speeds above 25 mm/s were demonstrated.

scholarly journals Upgrading Die Attach Epoxy Dispensing Mechanism

2021 ◽  
pp. 141-148
Author(s):  
Michael D. Capili
Keyword(s):  
Time Pressure ◽  
Detection System ◽  
Research Paper ◽  
Volume Reduction ◽  
Suitable Method ◽  
Statistical Validation ◽  
Die Attach ◽  
Sigma Function ◽  
Residual Material ◽  
Epoxy Dispensing

This research paper addressed how to improve the Die Attach Pneumatic Time-Pressure Dispensing Valve. Different assessment and statistical validation comparing the efficiency of the Pneumatic Time-Pressure Dispensing Valve and Dispensing Volume Reduction. The Musashi Super Ʃ CMIII Dispenser with Sigma function controller provides more choices for regulating the volume of dispensing, since the residual material in the syringe decreases, and can be a more suitable method for dispensing glue. The consistency of the glue volume will be more consistent after the implementation of this update. This controller has the option to compensate for pressure and vacuum as the remaining fluid in the syringe decreases. The Musashi dispenser controller is equipped with an empty syringe detection system. As the remaining adhesive, this will avoid variations in dispensed volume.

Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy

2021 ◽  
Author(s):  
Tadeh Avanessian ◽  
Jim Clatterbaugh ◽  
Robin L. Zinsmaster ◽  
Leyla Hashemi
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Test Results ◽  
Microelectronics Packaging ◽  
Bond Failure ◽  
Die Attach ◽  
Before And After ◽  
Placement Accuracy ◽  
Die Bonding ◽  
Heated Stage

Abstract Epoxy die attach is widely used in microcircuit assembly and enjoys advantages such as ease of deposition, fast curing, reworkability, and non-toxicity. These qualities also make it suitable for automated mass production. However, this method falls short when high placement accuracy is desired as the die can shift on uncured epoxy leading to die displacement from its original location. Gold to gold face-up bonding is another method utilized in microelectronics packaging given its proven bonding reliability and high placement accuracy for small devices. Nevertheless, it is difficult to achieve a reliable bond using this method for relatively larger devices. The nonplanarity of the bonding collet or the variation in the height of the gold bumps results in a tilted die attach and/or a weak bond between the die and the substrate. Moreover, CTE (Coefficient of Thermal Expansion) mismatch between the die, the gold bumps, and/or the substrate leads to bond failure due to temperature fatigue. This paper discusses a hybrid method to take advantage of the strengths of both methods mentioned above, culminating in a reliable process with high XYZ placement accuracy. To apply this method, epoxy is first dispensed on a gold-plated substrate. Using a flip chip machine, samples with plated gold bumps on their ground side are then placed on the substrate. The gold bumps are mainly used as targets and stand-offs to improve the placement accuracy and to control epoxy glue-line thickness. The force applied on the die, the time the force is applied, and the substrate temperature are controlled for optimum die attach. Moreover, along with the force applied by the vacuum tip, epoxy is partially cured on the flip chip machine heated stage before it is moved to an oven to complete the cure process. Die shear test results before and after temperature conditioning are compared with standard epoxy die attach and gold to gold face-up bonding for identical samples and the advantages are discussed.

A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications

2015 ◽  
Vol 794 ◽  
pp. 320-327
Author(s):  
Aarief Syed-Khaja ◽  
Christopher Kaestle ◽  
Martin Mueller ◽  
Jörg Franke
Keyword(s):  
Adhesive Bonding ◽  
Mechanical Design ◽  
Cost Effective ◽  
Lead Times ◽  
Power Electronic ◽  
Die Attach ◽  
Power Modules ◽  
And Performance ◽  
Module Development ◽  
Electronic Substrates

The field of power electronics packaging presents intricate and interdisciplinary challenges. System costs, reliability and performance are strongly determined by various aspects such as mechanical design, materials, thermal management and interconnect technologies. The overall costs of the product depend mainly on the complete process chain in the module development. Automation as well plays an important role and facilitates higher production rates, efficient use of materials, better product quality, and reduced factory lead times. This paper focuses on emerging interconnection technologies of bonding semiconductor components to power electronic substrates like diffusion soldering, conductive adhesive bonding and reactive multi-layer bonding. An overview on the automation potentials and complexities in individual technologies for the manufacturing of reliable and cost-effective power modules is given and discussed. Thus, a basis is created for choosing optimal die-attach technology depending on economic and technologic demand by comparing the state-of-the-art and advanced technologies.

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Technology Implementation ◽  
Wide Bandgap ◽  
Void Coalescence ◽  
Thermal Interface Materials ◽  
Die Attach ◽  
And Performance ◽  
Interface Materials ◽  
Sintered Silver

Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a challenge. Among major options, sintered silver shows advantages in ease of applications. Cost, performance, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and performance improvement of sintered silver using enhancement structures at micro- and nano-scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be optimized in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated systems. Demands of developing new high-temperature packaging materials to enable optimized package designs are also highlighted.

scholarly journals Analysis of Six-Phase Interior Permanent Magnet Synchronous Machines for Optimal Parameter Considerations

2018 ◽  
Vol 7 (2) ◽  
pp. 139
Author(s):  
Tanmoy Dey ◽  
Amit Kumar Chowdhury ◽  
Sk Mehboob Alam ◽  
Surajit Mondal
Keyword(s):  
Permanent Magnet ◽  
Optimal Parameter ◽  
Operating Conditions ◽  
Synchronous Machines ◽  
Permanent Magnet Synchronous Machines ◽  
Machine Model ◽  
Element Analysis ◽  
Interior Permanent Magnet ◽  
And Performance ◽  
Power Region

Understanding the merits of six-phase interior permanent magnet synchronous machines (IP-MSMs) over their three-phase counterparts, this paper analyses the six-phase machine for optimal parameter and performance considerations. Initially, a mathematical model of the six-phase IPMSM is developed employing the dq-axis theory and performance predicted by the model is verified under identical operating conditions with those using a machine designed and tested through finite element analysis (FEA). The developed and verified machine model is then employed to exclusively derive the relation between various machine parameters in order to obtain optimum flux weakening region in the six-phase IPMSM. Thereafter, the equations derived on the basis of maximum torque per ampere (MTPA) control theory are analyzed to understand the effect of various parameters and variables in influencing the machine’s performance in the ‘constant torque’ region and ‘constant power’ region, power output capability, a ratio of reluctance torque to magnet-assisted torque with changes in the stator current vector etc. This is the contribution of this paper.

scholarly journals Laser DAF Cut: A Breakthrough Approach of Die Attach Film Singulation for Thin Wafers

2021 ◽  
pp. 68-80
Author(s):  
Aiza Marie E. Agudon ◽  
Frederick P. Arellano ◽  
Bryan Christian S. Bacquian
Keyword(s):  
Integrated Circuit ◽  
New Technologies ◽  
Process Development ◽  
Development Trend ◽  
Die Attach ◽  
Critical Characteristics ◽  
Wafer Processing ◽  
Internal Configuration ◽  
Different Characteristics ◽  
Sawing Process

Today, semiconductor world is becoming more inclined to thinner Integrated Circuit (IC) packages. IC packages will require thinning of the internal configuration of the package, which involves the die or the wafer and the adhesive material, which is the Die Attach Film (DAF). Aligned to this, as wafers goes thinner it becomes more of a challenge in process development especially during its preparatory stages, such as wafer back grinding and sawing processes. As the die becomes smaller and thinner wafer sawing process should have minimum effect on the mechanical integrity of the silicon so as not to alter its quality. New technologies were introduced so as to adopt to this development trend, one of this is the Dicing Before Grinding (DBG). Compared to the normal wafer preparation process that is wafer back grinding before wafer sawing, DBG flow is wafer sawing first prior wafer back grinding processes. The application of DBG technology eliminates the mechanical draw backs of the conventional wafer sawing process. In addition, with the use of DAF for thinner packages, DBG was developed together with the Die Attach Film (DAF) cutting solution, which is Laser DAF Cutting.  DAF are separated using Laser as a cutting medium to address potential processability problems that may occur on the conventional mechanical blade saw. The paper discuss the Laser DAF cut development that covers the Design of Experiments (DoE) to understand the different characteristics of Laser DAF solution and be validated through actual simulation and wafer processing. The paper will also cover the interaction of different DAF thicknesses and Laser DAF parameters in order to define the critical characteristics so as to understand the behavior of different laser DAF parameters in achieving optimal DAF cutting process responses.

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